JPS5976199U

JPS5976199U - condenser microphone

Info

Publication number: JPS5976199U
Application number: JP17181582U
Authority: JP
Inventors: 川田　幸作; 「峰」岸　聖史
Original assignee: 日本ケミコン株式会社
Priority date: 1982-11-13
Filing date: 1982-11-13
Publication date: 1984-05-23

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は従来のコンデンサマイクロホンを示す縦断面図
、第２図はその位相調整のための音響抵抗の構成を示す
説明図、第３図は従来の他のコンデンサマイクロホンを
示す継断面図、第４図はその位相調整のための音響抵抗
の構成を示す説明図、第５図及び第６図は背極と端子板
との間の透孔のずれを示す説明図、第７図はこの考案の
コンデンサマイクロホンの実施例を示す縦断面図、第８
図は絶縁性支持体を示す斜視図、第９図及び第１０図は
その位相調整のための音響抵抗の構成を示す説明図、第
１１図及び第１２図は導電性スペーサの変形例を示す斜
視図である。１６・・・背極、２０．８０・・・透孔、４６・・・エ
レクトレット振動板、７６・・・導電性スペーサ、７７
・・・間隙、７８・・・背面板。第７図４含　　　　　　４１　　　１　　　　　八　＼　　（Ｘ１６４　６６　　
７４７３６８６６　Ｈ第９図００７８第８図ａ。第１２図Fig. 1 is a vertical cross-sectional view showing a conventional condenser microphone, Fig. 2 is an explanatory view showing the configuration of acoustic resistance for phase adjustment, Fig. 3 is a joint cross-sectional view showing another conventional condenser microphone, Figure 4 is an explanatory diagram showing the configuration of the acoustic resistance for phase adjustment, Figures 5 and 6 are explanatory diagrams showing the misalignment of the through hole between the back electrode and the terminal plate, and Figure 7 is an explanatory diagram showing the configuration of the acoustic resistance for phase adjustment. 8th longitudinal sectional view showing an embodiment of the condenser microphone of
The figure is a perspective view showing the insulating support, FIGS. 9 and 10 are explanatory diagrams showing the structure of the acoustic resistance for phase adjustment, and FIGS. 11 and 12 show modified examples of the conductive spacer. FIG. 16... Back electrode, 20.80... Through hole, 46... Electret diaphragm, 76... Conductive spacer, 77
... Gap, 78... Back plate. Figure 7 includes 4 4 1 1 8 \ (X164 66
74736866 H Figure 9 0 078 Figure 8 a. Figure 12

Claims

[Scope of utility model registration request]

(1) One or more through holes are formed at a certain distance from the center of the back electrode arranged at a certain interval on the back surface of the diaphragm, and electrical conductivity is formed between the back electrode and the back electrode. A through hole is formed in the center of the back plate arranged with a magnetic spacer interposed therebetween, and the phase is adjusted by the viscous resistance of air in the gap connecting the back electrode and the through hole of the back plate. Features a condenser microphone.

(2) The condenser microphone according to claim 1, wherein the conductive spacer is formed by molding a conductive material plate.

(3) The condenser microphone according to claim 1, wherein the conductive spacer is formed by printing and curing a conductive material on the back electrode or back plate.

(4) The condenser microphone according to claim 1, wherein the conductive spacer is formed by vacuum deposition or sputtering of a conductive substance on the back electrode or back plate.