JPS5975534A - Method of producing temperature fuse - Google Patents
Method of producing temperature fuseInfo
- Publication number
- JPS5975534A JPS5975534A JP18699682A JP18699682A JPS5975534A JP S5975534 A JPS5975534 A JP S5975534A JP 18699682 A JP18699682 A JP 18699682A JP 18699682 A JP18699682 A JP 18699682A JP S5975534 A JPS5975534 A JP S5975534A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- insulator
- photocurable resin
- conductive
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 8
- 239000012212 insulator Substances 0.000 claims description 19
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 description 14
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000008188 pellet Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- AREPHAPHABGCQP-UHFFFAOYSA-N 1-(dimethylamino)-3-[2-[2-(4-methoxyphenyl)ethyl]phenoxy]propan-2-ol Chemical compound C1=CC(OC)=CC=C1CCC1=CC=CC=C1OCC(O)CN(C)C AREPHAPHABGCQP-UHFFFAOYSA-N 0.000 description 1
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 241000257465 Echinoidea Species 0.000 description 1
- DIWRORZWFLOCLC-UHFFFAOYSA-N Lorazepam Chemical compound C12=CC(Cl)=CC=C2NC(=O)C(O)N=C1C1=CC=CC=C1Cl DIWRORZWFLOCLC-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000035922 thirst Effects 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野Ｊ
本発明ｔま、筒形の導電ケース内に可溶ベレッ１へを収
納しＣなる高温用〈１８０°Ｃ以上）濡麿ヒユーズ′の
製ｊ告／）ン去に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to the production of a high-temperature (180°C or higher) wet fuse by housing a fusible bell 1 in a cylindrical conductive case. Concerning the departure of /).
１発明の技術的背賠どその問題点］
〜般に１ｉｌ溶ベレツトタイゾの渇庶ヒー！−ズｔｉｋ
、第１図に示すように、出力リード線１を接続した筒形
の導電ケース２内に四状の１１溶べ１ノツ１−ｒ３と同
動シ９電板４どをボールトスブリンク５を介しＣ配７ｆ
ｆ 、、Ｊるどどしに、さらに１１動尋電板４の側面に
ゾツシュスプリング６を介しく入力リード線７を支Ｊｊ
したＬ７ラミツク製の絶縁体ε３を配置埒し、絶縁体８
の外縁ｒａ％上にエボギシ樹脂のような熱硬化性なｊ脂
からなるシール層９を設（プＣ構成されている。1. Technical disadvantages of the invention and its problems] - In general, the lack of 1-il melting technology! -zu tik
, as shown in Fig. 1, a bolt blink 5 is installed in a cylindrical conductive case 2 to which an output lead wire 1 is connected, and a four-shaped 11 weld 1 notch 1-r3 and a cooperating 9 electric plate 4 are installed. Intermediate C distribution 7f
In addition, the input lead wire 7 is supported on the side of the moving electric board 4 via the spring 6.
The insulators ε3 made of L7 lamic were arranged, and the insulators 8
A sealing layer 9 made of thermosetting resin such as ebogishi resin is provided on the outer edge of the sealing layer 9.
このＪ：うに構ｌ戊されｌこン品度じ−Ｊ−ス゛にａ５
いＣは、ｉｉ編時には１１Ｊ溶ベレツ］〜３が同体Ｃあ
るノ〔めｉｊｌ溶ベレッ］−３３ど可動導電板４どは一
定の間隔を保持され、導電ケース２等を介し−（出力リ
ード線１ど入力リード線７との間に３９電路が形成され
くいるが、異常湿度上野時にはＯＪ溶ベレット３が溶融
してボールドスプリング５が圧縮状態から伸張状態に変
るため、プツシ−Ｌスプリング６の弾撥力により用動導
゛市根４が図中ノ「方向に移動し−（人力リード線７の
先端部から離間し、導電路が連断されることになる。This J: The quality of the sea urchin is a5.
The movable conductive plates 4 and 33 are kept at a constant interval, and the output leads are connected via the conductive case 2, etc. An electric circuit 39 is formed between the wire 1 and the input lead wire 7, but in the case of abnormal humidity in Ueno, the OJ melt pellet 3 melts and the bold spring 5 changes from a compressed state to an expanded state. Due to the repulsive force, the power conductor 4 moves in the direction shown in the figure and separates from the tip of the human power lead wire 7, thereby disconnecting the conductive path.
ところＣ１従来からこのような渇１哀ヒま−ズを製造す
るには、導電ケース２内に各部品を組込み、絶縁体８外
縁部−［に熱硬化性樹脂のシール層９を設けた後、恒温
槽に入れ高温（１００〜１５０’Ｃ）で長時間（１へ・
２時間）加熱しＣ前記樹脂を硬化“する方法が行われＣ
いるが、この方法Ｃは加熱中に導電ケース２内の湿気が
絶縁体８の内外周面に冶って外方に逃げるため、シール
層９に気泡等が生じ、耐電圧特性が低下したり外観不良
が生じるという欠点があった。また、熱硬化性樹脂の完
全硬化に長い時間がかかるため生産性が低いという欠点
があった。However, in order to manufacture such a thirst mask in the past, each component is assembled in the conductive case 2, and a sealing layer 9 of thermosetting resin is provided on the outer edge of the insulator 8. , put it in a constant temperature oven for a long time at high temperature (100-150'C) (to 1.
A method of curing the resin by heating (for 2 hours) is carried out.
However, in this method C, the moisture inside the conductive case 2 settles on the inner and outer circumferential surfaces of the insulator 8 during heating and escapes to the outside, causing bubbles to form in the sealing layer 9 and reducing the withstand voltage characteristics. This had the disadvantage of causing poor appearance. Additionally, it takes a long time to completely cure the thermosetting resin, resulting in low productivity.
さらに、各部品を導電ケース２内に組込んだものを恒温
槽に入れて８０〜１００℃の温度で５時間程度加熱して
導電ケース２内を乾燥さけた後、直らに絶縁体８外ｌＩ
家部上に光硬化性樹脂組成物からなるシール層９を設け
、紫外線を１５〜２０分間照用して光硬化ｔＩｔ樹脂組
成物を硬化さける方法１）開発され（いる。Furthermore, each part assembled into the conductive case 2 is placed in a constant temperature oven and heated at a temperature of 80 to 100°C for about 5 hours to avoid drying the inside of the conductive case 2, and then immediately placed outside the insulator 8.
A method 1) has been developed in which a sealing layer 9 made of a photocurable resin composition is provided on the part and the photocurable resin composition is cured by irradiating it with ultraviolet rays for 15 to 20 minutes.
しかしながら、この方法で４！ｌられる温度ヒユーズ′
におい（は、特に高温上〇のシール層９の接着強疫が４
１（り、密封ｔ！Ｌが不完全ひある］ｃめ、溶融した可
溶ペレット３がシール層９と絶縁体８との隙間から漏れ
出やＪいという欠点があった。However, with this method, 4! temperature fuse'
Smell (especially when the adhesive strength of the seal layer 9 on high temperatures is 4)
1. The sealing T!L is incomplete. c. There is a drawback that the melted soluble pellets 3 leak out from the gap between the sealing layer 9 and the insulator 8.
また、高温時に【、１導電クース２の内ハニが０．２・
〜０．３ｋｇ／ｃシどなり、溶＾東しノこ田）ンダベレ
ッ１〜３がボールドスプリング５の弾撥力に逆らっＣ可
動導電板４を右方向に押ルタるため、可動導電板４と入
力リード線７が完全に離間し備く、溶Ｗｉ不良を起こし
易いという欠点があった。Also, at high temperatures, the inner honey of 1 conductive coos 2 is 0.2.
~0.3kg/c, melting, melting ^ Higashi Shinokoda) Because Nadabelets 1 to 3 push the movable conductive plate 4 to the right against the elastic force of the bold spring 5, the movable conductive plate 4 and There was a drawback that the input lead wires 7 were completely separated from each other, making it easy to cause molten Wi defects.
［発明の目的１
本発明はこのような従来の欠５ｊ、【をＷ〆消りるため
になされたちのＣ１シール層による密封が完全Ｃ外観お
よび特性の良りｆな温度ヒ」−スを能率的に製造する方
法を提供することを目的どづる。[Objective of the Invention 1] The present invention aims to eliminate such conventional deficiencies, and to eliminate temperature heat by completely sealing with the C1 sealing layer, which has good appearance and characteristics. The purpose is to provide an efficient manufacturing method.
Ｌ発明のＩＩＡ要Ｊ
１なわち本発明の温度ヒユーズの製造／ｉ法は、一端に
出力リード線を接続した筒形の導電ケース内に、可溶ペ
レッ１〜、゛ボールドスプリング、可動導電椴、ノッシ
ュスプリングおよび入力リード線を支持した絶縁体を順
次収納し、前記導電ケースの聞［１周縁を前記絶縁体外
縁部に密接させた後、短時間加熱して前記導電クース内
を乾燥させ、この状態Ｃ前記絶縁体外縁部と導電ケース
の開口周縁および前記入ツノリード線との各当接部上に
光硬化性樹脂組成物を被着した後紫外線照射を行なっ゛
（前記光硬化性樹脂組成物を硬化させ、その後前記絶縁
体外縁部および前記当接部上にさらに光硬化性樹脂組成
物を被着しく゛紫外線照射を行ない、該光硬化性樹脂組
成物を硬化させることを特徴としＣいる。IIA Requirements of the Invention J 1 That is, the method for manufacturing the temperature fuse of the present invention is to place fusible pellets 1 to 1, a bold spring, and a movable conductive cap in a cylindrical conductive case to which an output lead wire is connected to one end. , the insulator supporting the nosh spring and the input lead wire is sequentially housed, the first periphery of the conductive case is brought into close contact with the outer edge of the insulator, and then heated for a short time to dry the inside of the conductive case. , In this state C, a photocurable resin composition is applied to each contact portion between the outer edge of the insulator, the opening periphery of the conductive case, and the incoming horn lead wire, and then UV irradiation is performed (the photocurable resin The composition is cured, and then the photocurable resin composition is further coated on the outer edge portion of the insulator and the contact portion by irradiating ultraviolet rays to cure the photocurable resin composition. There is C.
本発明にｉｌｊいＣ１導電ケース内の１１１２水乾燥の
−ＩＣめ加熱ケる手段としては、種々の方法があるが、
各部品を内部に組込／Ｖだ導電ケースを内部に温度調節
器（＝Ｊ上ヒータの埋め込まれた加熱用ホルダ内に挿入
覆る方法をどるのが望ましく、この状態で７０〜８０℃
の温度に３へ・５分間保持するのが適当である。There are various methods for heating the -IC of the 1112 water drying in the C1 conductive case that are applicable to the present invention.
Assemble each component inside /V It is preferable to insert the conductive case inside the temperature controller (=J) into the heating holder in which the heater is embedded and cover it, and in this state it will be heated to 70 to 80℃.
It is appropriate to hold the sample at a temperature of 3 to 5 minutes.
本発明に使用り−る光硬化ｔｅｌ樹脂組成物どしく゛は
、エポキシアクリレ−１〜、■ボキシメタクリレート、
ポリニスデルアクリレート、ウレタンアクＩＪ ｌノー
トあるいは不飽和ポリ」ニスデル等を主成分どする公知
のものはすべて用いることが（゛さるが、特に絶縁体外
縁部と導電ケースの開［°１周縁および人力リード線と
の各当接部に最初に被？する光硬化性＃Ｉ脂Ｍ１成物は
（゛きるだけ短時間、好ましくは数秒〜；ｔ”ｔｏ秒程
瓜の紫外線照射にまり硬化Ｍるものを用いるのが望まし
い。The photocurable tel resin composition used in the present invention is epoxy acrylate 1~, boxy methacrylate,
Any known material containing polynisdel acrylate, urethane acrylate, urethane acrylate, or unsaturated polyamide acrylate as a main component can be used. The light-curing #I resin M1 compound that is first coated on each contact part with the human lead wire is cured by the ultraviolet irradiation of the melon for about t'' to seconds. It is desirable to use a
し発明の実施例」 次に本発明の実施例につい′Ｃ記載Ｊる。Examples of the invention Next, examples of the present invention will be described.
実施例
第２図に示づように、一端に出力リード線１゜を接続し
た筒形の金属製の導電クヘス１１内に、可溶ペレッ１へ
１２、ホールドスプリング１３、可＠ＩＪ導電板１４、
ブツシュスプリング１５Ｊ５よび入力リード線１７を支
持したレラミック製の絶縁体１７を順次収納し、導電ケ
ース１１の開口周縁を絶縁体１７の外縁部に密接した後
、全体を７０〜８０’Ｃの温度に保持された加熱ホルダ
（図示せず）内に挿入し、３〜５分加熱して導電ケース
１１内を乾燥さし、この状態で絶縁体１７外縁部と導電
ケース１１の開口周縁および入力リード線１６との各当
接部上に１１ζ−３０６６（スリーボントン１５Ａ１蝿
気性付与タイプの光硬化性樹脂組成物の商品名）を被着
しで第′１次シール層１８を設４Ｊた後、高１［水銀ラ
ンプを用いＣ１０〜２０秒間紫外線を照射しく第１次シ
ールｌｉ！ｊ１８を硬化さ−Ｕだ。Embodiment As shown in FIG. 2, in a cylindrical metal conductive stem 11 with an output lead wire 1° connected to one end, a fusible pellet 1 12, a hold spring 13, and an IJ conductive plate 14 are placed. ,
The insulator 17 made of Reramic that supported the bushing spring 15J5 and the input lead wire 17 is sequentially housed, and the opening periphery of the conductive case 11 is brought into close contact with the outer edge of the insulator 17, and then the whole is heated to a temperature of 70 to 80'C. The conductive case 11 is heated for 3 to 5 minutes to dry the inside of the conductive case 11. In this state, the outer edge of the insulator 17, the opening periphery of the conductive case 11, and the input lead are heated. 11ζ-3066 (trade name of Three Bonton 15A1 fly-resistant type photocurable resin composition) was deposited on each contact portion with the wire 16 to form a primary sealing layer 18, High 1 [Use a mercury lamp to irradiate ultraviolet rays for C10 to 20 seconds first seal li! Harden j18-U.
次に絶縁体１７外縁部おにび前記当接部上にざらにに−
４１６（スリーボンド社製、光硬化性樹脂組成物の商品
名）を被着して第２次シール層１９を設けた後、高圧水
銀ランプを光源として紫外線を１５〜２０分間照射し′
にの第２次シール層１９を完全に硬化さＵた。Next, the outer edge of the insulator 17 and the contact portion are roughly coated.
416 (manufactured by ThreeBond, trade name of a photocurable resin composition) to provide the second sealing layer 19, and then irradiated with ultraviolet rays for 15 to 20 minutes using a high-pressure mercury lamp as a light source.
The secondary sealing layer 19 was completely cured.
こうして得られた温度ヒユーズは、第１次および第２次
シール層１８．１９に気泡や微小な孔が生じでおらず、
外観が良好であるとともに、所定の耐電圧試験（ペレッ
ト溶断試験直後１．５ｋＶの電圧に１分間耐える試験〉
を完全にバスした。The temperature fuse obtained in this way has no air bubbles or minute holes in the primary and secondary sealing layers 18 and 19.
In addition to having a good appearance, the specified withstand voltage test (a test that withstands a voltage of 1.5 kV for 1 minute immediately after the pellet fusing test)
was completely bussed.
また高温雰囲気上においＣもｉ？Ｊ ａ’ｌ！ Ｌ／た
可溶ペレット１２が外部に漏れるごどがなく、溶＋ａ不
良も生じなかった。Also, C in a high temperature atmosphere is also i? J a'l! There was no possibility that the soluble pellets 12 leaked to the outside, and no defective melting +a occurred.
「発明の効果」
以上の実施例から−し明らかなＪ、うに本発明にＪ、れ
ば、外観Ｊ３よび特性の良好な温度ヒーコースを生産性
よく製造することができる。``Effects of the Invention'' It is clear from the above examples that if the present invention is applied, a temperature heatherse with good appearance and characteristics can be manufactured with high productivity.
第１図は従来の渇磨ヒコーズの製造Ｚｊ法を第１明づる
ための断面図、第２図は本発明実施例を説明り−るため
の断面図である。
１．１０・・・出力リード線
２．１１・・・導電ケース
３．１２・・・可溶ペレッｌ〜
４．１４・・・可動尋電板
５．１３・・・ホールドスプリング
６．１５・・・ブツシュスプリング
７．１６・・・入力リード線
８．１７・・・絶縁体
０・・・・・・・・・・・・熱硬化性樹脂からなるシー
ル層１８・・・・・・・・・・・・光硬化性樹脂組成物
からなる第１次シール層
１９・・・・・・・・・・・・光硬化性樹脂組成物から
なる第２次シール層
代理人弁理士 須 山 佐 −
（ほか１名）
第１図
第？図FIG. 1 is a cross-sectional view for explaining the conventional ZJ method for manufacturing Touma Hikozu, and FIG. 2 is a cross-sectional view for explaining an embodiment of the present invention. 1.10... Output lead wire 2.11... Conductive case 3.12... Fusible pellet ~ 4.14... Movable electric wire plate 5.13... Hold spring 6.15. ... Bush spring 7.16 ... Input lead wire 8.17 ... Insulator 0 ... Sealing layer 18 made of thermosetting resin ... ......First seal layer 19 made of a photocurable resin composition...Second seal layer made of a photocurable resin composition Patent attorney Su Yamasa - (1 other person) Figure 1? figure
Claims (1)
内に、可溶ベレット、ホールドスプリング、可動導電板
、プツシゴスプリングＪ５よび人力リード線を支持した
絶縁体を順次収納し、前記導電ケースの開口ｆ？ＦＩ緑
を前記絶縁体外縁部に密接させた後、９．ｉｔ ａｎｙ
間加熱加熱前記導電ケース内を乾燥させ、この状態で前
記絶縁体外縁部と導電ケースの開口周縁および前記人力
リード線どの各当接部上に光硬化性樹脂組成物を被着し
た後紫外線照射を行なつＣ前記光硬化性樹脂組成物を硬
化さＵ、その後前記絶縁体外縁部ｄ３ Ｊ、び前配当接
部上にさらに光硬化１１１樹脂組成物を被名しく紫外線
照射を行４にい、該光映化性樹脂組成物を硬化さセるこ
とを特徴どりる（ｉｉａ度ヒユーズの製造り法。(1> A fusible bellet, a hold spring, a movable conductive plate, a push spring J5, and an insulator supporting a human power lead wire are sequentially housed in a cylindrical conductive case with an output lead wire connected to one end, and the conductive After bringing the opening f?FI green of the case into close contact with the outer edge of the insulator, 9.it any
Heating for a while to dry the inside of the conductive case, and in this state, a photocurable resin composition is coated on the outer edge of the insulator, the periphery of the opening of the conductive case, and the contact portions of the human lead wire, and then irradiated with ultraviolet rays. C. The photocurable resin composition is cured, and then the photocurable resin composition is further applied on the outer edge d3 of the insulator and the front connecting portion, and the photocurable resin composition is irradiated with ultraviolet rays in row 4. , curing the photoresistible resin composition (method for producing a fuse).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18699682A JPS5975534A (en) | 1982-10-25 | 1982-10-25 | Method of producing temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18699682A JPS5975534A (en) | 1982-10-25 | 1982-10-25 | Method of producing temperature fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5975534A true JPS5975534A (en) | 1984-04-28 |
Family
ID=16198373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18699682A Pending JPS5975534A (en) | 1982-10-25 | 1982-10-25 | Method of producing temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5975534A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536871A (en) * | 1976-07-08 | 1978-01-21 | Nippon Electric Co | Method of manufacturing electronic parts |
-
1982
- 1982-10-25 JP JP18699682A patent/JPS5975534A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536871A (en) * | 1976-07-08 | 1978-01-21 | Nippon Electric Co | Method of manufacturing electronic parts |
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