JPS6244369B2 - - Google Patents
Info
- Publication number
- JPS6244369B2 JPS6244369B2 JP56191625A JP19162581A JPS6244369B2 JP S6244369 B2 JPS6244369 B2 JP S6244369B2 JP 56191625 A JP56191625 A JP 56191625A JP 19162581 A JP19162581 A JP 19162581A JP S6244369 B2 JPS6244369 B2 JP S6244369B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- lead wire
- case
- conductive case
- sealing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 14
- 239000008188 pellet Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000565 sealant Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【発明の詳細な説明】
本発明は、筒形ケース内に可溶ペレツトを収納
してなる温度ヒユーズの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a thermal fuse comprising a cylindrical case containing fusible pellets.
この種の温度ヒユーズは第1図に示すように構
成されている。すなわち、第1リード線1を接続
した筒形の導電性のケース2内に、塊状の可溶ペ
レツト3と可動導電板4とをホールドスプリング
5を介して配置し、可動導電板4と第2リード線
6を支持したセラミツク製の絶縁体7とをプツシ
ユスプリング8を介して配置してある。絶縁体外
端部上にはエポキシ樹脂等の硬化性樹脂を塗着さ
せたシール層9を設けてある。 This type of temperature fuse is constructed as shown in FIG. That is, in a cylindrical conductive case 2 to which the first lead wire 1 is connected, a lumpy soluble pellet 3 and a movable conductive plate 4 are placed via a hold spring 5, and the movable conductive plate 4 and the second A ceramic insulator 7 supporting a lead wire 6 is disposed via a push spring 8. A sealing layer 9 coated with a hardening resin such as epoxy resin is provided on the outer end of the insulator.
このような温度ヒユーズにおいて、常温時は可
溶ペレツト3が固形であるため可溶ペレツト3と
可動導電板4との間は一定間隔を保持され、ケー
ス2等を介して第1リード線1と第2リード線6
との間に導電経路が形成されている。しかし、異
常温度上昇により可溶ペレツト3が溶融したとき
はホールドスプリング5が圧縮状態から伸張状態
に変わるためプツシユスプリング8の力で可動導
電板4が第1図中、左方向に移動して第2リード
線6の先端部6aから離間し導電経路が遮断され
ることとなる。 In such a temperature fuse, since the soluble pellets 3 are solid at room temperature, a constant distance is maintained between the soluble pellets 3 and the movable conductive plate 4, and the first lead wire 1 is connected to the first lead wire 1 through the case 2 etc. Second lead wire 6
A conductive path is formed between the two. However, when the fusible pellet 3 melts due to an abnormal temperature rise, the hold spring 5 changes from a compressed state to an expanded state, so the movable conductive plate 4 moves to the left in FIG. 1 due to the force of the push spring 8. It separates from the tip 6a of the second lead wire 6, and the conductive path is cut off.
ところで、従来、このような温度ヒユーズを製
造する過程において、ケース2内に各部品を組込
み、絶縁体外端部上に硬化性樹脂によるシール層
9を設けた後恒温槽に入れ高温(80〜110℃)で
加熱してシール層9を硬化することを行つている
が、加熱中にケース2内の湿気が絶縁体7の内、
外周面にそつて外方へ逃げるため、シール層9に
気泡あるいは微小の孔が生じ、耐電圧特性が低下
したり外観不良となる等の不都合が起き易かつ
た。 By the way, conventionally, in the process of manufacturing such a temperature fuse, each component is assembled into the case 2, a sealing layer 9 made of a curable resin is provided on the outer end of the insulator, and then placed in a thermostatic oven at a high temperature (80 to 110℃). The sealing layer 9 is cured by heating at a temperature of
Since the particles escape outward along the outer circumferential surface, bubbles or minute holes are generated in the sealing layer 9, which tends to cause problems such as a decrease in withstand voltage characteristics and poor appearance.
また、特開昭53−6871号公報には、ケース内の
空間部に素子を収納し、ケースの開口部から絶縁
ブツシングを貫通してリード線を導出し、絶縁ブ
ツシングの端面に、二液型エポキシ樹脂のような
絶縁封止剤を被着するにあたり、この絶縁封止剤
の被着に先立つて、全体を加熱してケース内の空
気を膨脹させておいて流動性の絶縁封止剤を被着
し、ケース内の空気の冷却収縮に伴つて、ケース
と絶縁ブツシングの間、あるいは絶縁ブツシング
とリード線の間の微小間隙に、前記絶縁封止剤を
吸込み固化させるようにした温度ヒユーズの製造
方法が開示されている。 Furthermore, in Japanese Patent Application Laid-Open No. 53-6871, an element is housed in a space inside a case, a lead wire is led out from the opening of the case through an insulating bushing, and a two-component type Before applying an insulating sealant such as epoxy resin, the entire case is heated to expand the air inside the case and a fluid insulating sealant is applied. A temperature fuse is attached to the insulating sealant, and as the air inside the case cools and contracts, the insulating sealant is sucked into a minute gap between the case and the insulating bushing or between the insulating bushing and the lead wire and solidified. A manufacturing method is disclosed.
しかしながら、この方法においては、高温状態
のケースとブツシングの間に二液型エポキシ樹脂
のような絶縁封止剤を吸込ませるので、これらの
間で絶縁封止剤が加熱され、その中に溶存されて
いた水分、空気が放出され、さらに絶縁封止剤
は、この後、通常、高温(温度ヒユーズの溶融温
度より低い温度)で加熱架橋が行われるので、そ
の際架橋に伴う分解生成物も離脱して封止部に気
泡や微小な孔が形成されるという問題があつた。 However, in this method, an insulating sealant such as a two-component epoxy resin is sucked between the case and the bushing, which are in a high temperature state, so the insulating sealant is heated between them and dissolved therein. The moisture and air that had been present are released, and since the insulating sealant is then thermally crosslinked at a high temperature (lower than the melting temperature of the temperature fuse), decomposition products accompanying crosslinking are also released. There was a problem that air bubbles and minute holes were formed in the sealing portion.
本発明は、かかる難点を解消すべくなされたも
ので、シール部に気泡等が生じないようにした温
度ヒユーズの製造方法を提供しようとするもので
ある。 The present invention has been made in order to solve this problem, and it is an object of the present invention to provide a method of manufacturing a temperature fuse in which bubbles and the like are not generated in the sealing portion.
本発明の製造方法においては、導電ケース2内
に可溶ペレツト3、ホールドスプリング5、可動
導電板4、プツシユスプリング8、第2リード線
6を支持した絶縁体7等の各部品を順次収納し、
導電ケースの開口周縁2aを絶縁体外縁部に密接
した後、高温下において導電ケース内を乾燥させ
て脱湿し、この状態下で絶縁体外端部と導電ケー
スの開口周縁及び第2リード線との各当接部を速
硬化性接着剤により仮シールする。この後、絶縁
体外端部及び前記当接部上に硬化性樹脂を被着
し、シール層を形成するのである。 In the manufacturing method of the present invention, parts such as the fusible pellet 3, the hold spring 5, the movable conductive plate 4, the push spring 8, and the insulator 7 supporting the second lead wire 6 are sequentially stored in the conductive case 2. death,
After bringing the opening periphery 2a of the conductive case into close contact with the outer edge of the insulator, the inside of the conductive case is dried and dehumidified under high temperature, and under this condition, the outer edge of the insulator, the opening periphery of the conductive case, and the second lead wire are connected. Temporarily seal each abutting part with a fast-curing adhesive. Thereafter, a curable resin is applied on the outer end of the insulator and the abutting portion to form a sealing layer.
なお、速硬化性接着剤としては、数秒で硬化す
るアロンアルフアー(商品名)のような瞬間接着
剤や数分で硬化するアラルダイト(商品名)のよ
うな速硬化性接着剤が使用される。 As the fast-curing adhesive, an instant adhesive such as Aron Alpha (trade name), which hardens in a few seconds, or a fast-curing adhesive, such as Araldite (trade name), which hardens in a few minutes, is used.
上記のように、導電ケースの開口端より露出す
る絶縁体外端部に、乾燥中に仮シールを設け、そ
の後、硬化性樹脂によるシール層を設けるように
したので、シール層が、空気等の溶存ガスや分解
ガスの発生のない、従つて、気泡等の発生のない
速硬化性接着剤からなる仮シール層と硬化性樹脂
によるシール層の2層構造となり、仮に、熱処理
時に、硬化性樹脂によるシール層内に分解生成物
による気泡等が発生しても、該層の絶縁耐力が低
下するようなことはなくなる。また、仮シールの
硬化時間は、通常の硬化性樹脂のそれと比べて極
めて短いので作業性もほとんど低下することがな
い。 As mentioned above, a temporary seal was provided on the outer end of the insulator exposed from the open end of the conductive case during drying, and then a sealing layer of curable resin was provided. It has a two-layer structure: a temporary sealing layer made of a fast-curing adhesive that does not generate gas or decomposition gas, and therefore does not generate bubbles, etc., and a sealing layer made of a curable resin. Even if bubbles or the like are generated in the seal layer due to decomposition products, the dielectric strength of the layer will not be reduced. Further, since the curing time of the temporary seal is extremely short compared to that of a normal curable resin, the workability is hardly reduced.
次に、本発明の実施例を説明する。 Next, examples of the present invention will be described.
実施例 1
第2図に示されるように導電ケース2内に、各
構成部品を収納し、導電ケースの開口周縁を絶縁
体7の外縁部に密接した後、恒温槽に入れ温度
100〜110℃で時間30〜60分間加熱しケース2内を
乾燥させ、この加熱状態下で絶縁体外端部と導電
ケースの開口周縁及び第2リード線6との各当接
部10,11をアロンアルフアー(商品名)で仮
シールを行う。この後、絶縁体外端部上にエポキ
シ樹脂を塗着してシール層9を設け、このシール
層を硬化させた。Example 1 As shown in FIG. 2, each component was housed in a conductive case 2, and the opening periphery of the conductive case was brought into close contact with the outer edge of the insulator 7, and then placed in a thermostatic oven to maintain the temperature.
The inside of the case 2 is dried by heating at 100 to 110°C for 30 to 60 minutes, and under this heated state, the contact parts 10 and 11 between the outer end of the insulator, the periphery of the opening of the conductive case, and the second lead wire 6 are heated. Make a temporary seal with Aron Alpha (product name). Thereafter, an epoxy resin was applied onto the outer end of the insulator to form a sealing layer 9, and this sealing layer was cured.
このようにして得られた温度ヒユーズはシール
層に気泡、微小の孔が生じておらず、また所定の
耐電圧試験(ペレツト溶断試験直後1.5KV 1分
間耐えること)を完全にパスできた。 The temperature fuse thus obtained had no bubbles or minute holes in the sealing layer, and completely passed the specified withstand voltage test (withstanding 1.5 KV for 1 minute immediately after the pellet fusing test).
なお、プツシユスプリングの外表面に絶縁塗料
たとえばフツ素系樹脂、テフロン、ホルマール樹
脂等を焼付けしておくことにより、第2リード線
先端部との間の耐電圧が向上し、より高電圧用の
温度ヒユーズを製造することが可能である。 In addition, by baking an insulating coating such as fluorocarbon resin, Teflon, formal resin, etc. on the outer surface of the push spring, the withstand voltage between it and the tip of the second lead wire can be improved, making it suitable for higher voltage applications. It is possible to manufacture temperature fuses of
第1図は温度ヒユーズを示す断面図、第2図は
本発明の方法を説明するための簡略図である。
1…第1リード線、2…導電ケース、3…可溶
ペレツト、4…可動導電板、5…ホールドスプリ
ング、6…第2リード線、7…絶縁体、8…プツ
シユスプリング、9…シール層、10,11…当
接部。
FIG. 1 is a sectional view showing a temperature fuse, and FIG. 2 is a simplified diagram for explaining the method of the present invention. DESCRIPTION OF SYMBOLS 1...First lead wire, 2...Conductive case, 3...Fusible pellet, 4...Movable conductive plate, 5...Hold spring, 6...Second lead wire, 7...Insulator, 8...Push spring, 9...Seal Layer, 10, 11... contact portion.
Claims (1)
ース内に、可溶ペレツト、ホールドスプリング、
可動導電板、プツシユスプリング、第2リード線
を支持した絶縁体を順次収納し、導電ケースの開
口周縁を絶縁体外縁部に密接した後、高温下で導
電ケース内を乾燥させ、この状態の下で、絶縁体
外端部と導電ケースの開口周縁及び第2リード線
との各当接部を速硬化性接着剤により仮シール
し、この後、絶縁体外端部及び前記当接部上に硬
化性樹脂を被着し、シール層を形成することを特
徴とする温度ヒユーズの製造方法。1 Inside a cylindrical conductive case with a first lead wire connected to one end, a fusible pellet, a hold spring,
After storing the movable conductive plate, push spring, and insulator supporting the second lead wire in order, and bringing the opening periphery of the conductive case into close contact with the outer edge of the insulator, the inside of the conductive case was dried at high temperature. Below, the contact parts between the outer end of the insulator, the periphery of the opening of the conductive case, and the second lead wire are temporarily sealed with a fast-curing adhesive, and then the outer end of the insulator and the contact parts are sealed with a fast-curing adhesive. 1. A method for manufacturing a temperature fuse, which comprises coating a thermoplastic resin to form a sealing layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19162581A JPS5893132A (en) | 1981-11-28 | 1981-11-28 | Method of producing temperature fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19162581A JPS5893132A (en) | 1981-11-28 | 1981-11-28 | Method of producing temperature fuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5893132A JPS5893132A (en) | 1983-06-02 |
JPS6244369B2 true JPS6244369B2 (en) | 1987-09-19 |
Family
ID=16277749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19162581A Granted JPS5893132A (en) | 1981-11-28 | 1981-11-28 | Method of producing temperature fuse |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5893132A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS536871A (en) * | 1976-07-08 | 1978-01-21 | Nippon Electric Co | Method of manufacturing electronic parts |
-
1981
- 1981-11-28 JP JP19162581A patent/JPS5893132A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS536871A (en) * | 1976-07-08 | 1978-01-21 | Nippon Electric Co | Method of manufacturing electronic parts |
Also Published As
Publication number | Publication date |
---|---|
JPS5893132A (en) | 1983-06-02 |
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