JPS60170129A - Method of producing temperature fuse - Google Patents
Method of producing temperature fuseInfo
- Publication number
- JPS60170129A JPS60170129A JP2561184A JP2561184A JPS60170129A JP S60170129 A JPS60170129 A JP S60170129A JP 2561184 A JP2561184 A JP 2561184A JP 2561184 A JP2561184 A JP 2561184A JP S60170129 A JPS60170129 A JP S60170129A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- insulator
- conductive case
- lead wire
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 16
- 239000008188 pellet Substances 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 18
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（発明の技術分野）
本発明は 筒形の導電ケース内に可溶ペレットを収納Ｉ
２てなる温度ヒ）貸の製造方法に関する。[Detailed Description of the Invention] (Technical Field of the Invention) The present invention provides a method for storing soluble pellets in a cylindrical conductive case.
2) Concerning the manufacturing method of the temperature.
（発明の技術的背景とその問題点）
一般に可溶ペレットタイプの温度ヒユーズは、第１図に
示すように、出力リード線１を接続した筒形の導電ケー
ス２内に塊状の可溶ペレット３と可動導電板４とをホー
ルドスプリング５を介して配置するとともに、さらに可
動導電板４の側面にブツシュスプリング６を介して入力
リード線１を支持したセラミック裂の絶縁体８を配置し
、絶縁体８の外縁部上にエポキシ樹脂のような熱硬化性
樹脂からなるシール層９を設けて構成されている。(Technical background of the invention and its problems) Generally, as shown in Fig. 1, a fusible pellet type temperature fuse has a lumpy fusible pellet 3 inside a cylindrical conductive case 2 to which an output lead wire 1 is connected. A movable conductive plate 4 is disposed via a hold spring 5, and a ceramic split insulator 8 supporting the input lead wire 1 via a bushing spring 6 is disposed on the side of the movable conductive plate 4. A sealing layer 9 made of thermosetting resin such as epoxy resin is provided on the outer edge of 8.
このように構成された温度ヒユーズにおいては、常温時
には可溶ペレット３が固体でおるため可溶ペレット３と
可動導電板４とは一定の間隔を保持され、導電ケース２
等を介して出力リード線１と入力リード線γとの間に導
電路が形成されているが、異常温度上昇時には可溶ペレ
ット３が溶融してホールドスプリング５が圧縮状態から
伸張状態に変るため、ブツシュスプリング６の弾撥力に
より可動導電板４が図中左方向に移動して入力リード線
γの先端部から離間し、導電路が遮断されることになる
。In the temperature fuse configured in this way, the soluble pellet 3 is solid at room temperature, so the soluble pellet 3 and the movable conductive plate 4 are kept at a constant distance, and the conductive case 2
A conductive path is formed between the output lead wire 1 and the input lead wire γ via etc., but when the temperature rises abnormally, the fusible pellet 3 melts and the hold spring 5 changes from a compressed state to an expanded state. Due to the elastic force of the bushing spring 6, the movable conductive plate 4 moves to the left in the figure and is separated from the tip of the input lead wire γ, thereby interrupting the conductive path.
ところで、従来からこのような温度ヒユーズを製造する
には、導電ケース２内に各部品を組込み、絶縁体８外縁
部上に熱硬化性樹脂のシール層９を設けた後、恒温槽に
入れ高温（１００〜１５０℃）で長時間（１〜２時間）
７Ｘｌ熱して前記樹脂を硬化する方法が行われているが
、この方法では加熱中に導電ケース内の湿気が絶縁体８
の内外周面に沿って外方に逃けるため、シール層９に気
泡等が生じ、耐電圧特性が低下したり外観不良が生じる
という欠点があった。また、熱硬化性樹脂の完全硬化に
長に時間がかかる友め生産性が低いという欠点があった
。By the way, conventionally, in order to manufacture such a temperature fuse, each component is assembled in the conductive case 2, a sealing layer 9 of thermosetting resin is provided on the outer edge of the insulator 8, and then the thermosetting resin is placed in a thermostatic oven and heated to high temperature. (100-150℃) for a long time (1-2 hours)
A method has been used in which the resin is cured by heating 7
Since it escapes outward along the inner and outer circumferential surfaces of the seal layer 9, bubbles and the like are generated in the sealing layer 9, resulting in a disadvantage that the withstand voltage characteristics are lowered and the appearance is poor. Another drawback is that it takes a long time to completely cure the thermosetting resin, resulting in low productivity.
さらに、各部品を導電ケース２内に組込んだものを恒温
槽に入れて８０〜１００℃の温度で５時間程度加熱して
導電ケース２内を乾燥させた後、直ちｉｃ絶縁体８外縁
部上に光硬化性樹脂組成物からなるシールＮ９を設け、
紫外線を１５〜２０分間照射して光硬化性樹脂組成物を
硬化させる方法も開発されている。Furthermore, each component assembled into the conductive case 2 is placed in a thermostatic oven and heated at a temperature of 80 to 100°C for about 5 hours to dry the inside of the conductive case 2, and then the outer edge of the IC insulator 8 is immediately heated. A seal N9 made of a photocurable resin composition is provided on the part,
A method of curing a photocurable resin composition by irradiating it with ultraviolet rays for 15 to 20 minutes has also been developed.
しかしながら、この方法で得られる温度ヒユーズにおい
ては、特に高温下でのシール層９の接着強度が低く、密
封性が不完全であるため、溶融した可溶ペレット３がシ
ール層９と絶縁体８との隙間から漏れ出やすいとい５次
点があった。However, in the temperature fuse obtained by this method, the adhesive strength of the sealing layer 9 is low, especially at high temperatures, and the sealing performance is incomplete, so that the melted soluble pellets 3 bond between the sealing layer 9 and the insulator 8. There was a 5th point that was likely to leak through the gaps between.
また、高温時には４宵ケース２の内圧が０．２〜Ｑ、
３ Ｋｇ ／ ｃｍ２ となり、溶融した可溶ペレット
３がホールドスプリング５０弾撥力に逆らって可動導電
板４を右方向に押圧するため、可動導電板４と入力リー
ド線７が完全に離間し難く、溶断不良奮起こし易いとい
う欠点があった。In addition, at high temperatures, the internal pressure of the 4-night case 2 is 0.2~Q,
3 Kg/cm2, and the molten soluble pellet 3 presses the movable conductive plate 4 to the right against the elastic force of the hold spring 50, making it difficult for the movable conductive plate 4 and the input lead wire 7 to be completely separated. It has the disadvantage of being prone to fusing failure.
（発明の目的）
本発明にこのような従来の欠点を解消するためＫなされ
たもので、シール層による密封が完全で外観および特性
の良好な温度ヒユーズを能率的に製造する方法を提供す
ることを目的とする。(Objective of the Invention) The present invention has been made in order to eliminate such conventional drawbacks, and it is an object of the present invention to provide a method for efficiently manufacturing a temperature fuse that is completely sealed by a sealing layer and has good appearance and characteristics. With the goal.
（発明の概要）
すなわち本発明の温度ヒユーズの製造方法は、一端に出
力リード線を接続した筒形の導電ケース内に、可溶ペレ
ット、ホールドスプリング、可動導電板、ブツシュスプ
リングおよび入力リード線全支持した？、縁体全順次収
納し、前記導電ケースの開口周縁を前記絶縁体外縁部Ｖ
Ｃ＠接させた後、刀口熱して前記導電ケース内の空気を
希薄状態とし、この状態で前記絶縁体外縁部と４電ケー
スの開口周縁および前記入力リード線との各当接部に金
属イオン硬化性アクリル樹脂組成物と光硬化性樹脂組成
物との混合物を被着して硬化させて１次シール層を形成
し、その後、前記絶縁体外縁部および前記４電ケースの
開口周縁部上にさらに１〜３重蓋％の酸化クロムを含有
する光硬化性樹脂組成物を被着して硬化させて２次シー
ル層を形成することを特徴としている。(Summary of the Invention) That is, the method for manufacturing a temperature fuse of the present invention includes a cylindrical conductive case with an output lead wire connected to one end, a fusible pellet, a hold spring, a movable conductive plate, a bushing spring, and an input lead wire. Did you fully support it? , the edges are all sequentially stored, and the opening periphery of the conductive case is connected to the outer edge of the insulator V.
After contacting C@, the air inside the conductive case is heated to a diluted state, and in this state, metal ions are applied to the outer edge of the insulator, the periphery of the opening of the 4-conductor case, and each contact portion with the input lead wire. A mixture of a curable acrylic resin composition and a photocurable resin composition is applied and cured to form a primary sealing layer, and then on the outer edge of the insulator and the periphery of the opening of the 4-electric case. Furthermore, a photocurable resin composition containing 1 to 3% chromium oxide is applied and cured to form a secondary sealing layer.
不発明において、導電ケース内の空気全希薄状とするた
め７Ｊｎ熱する手段としては、種々の方法があるが 各
部品全内部に組込んだ導電ケース全内部Ｋｒ１ｔＡ度調
節器付ヒーｐ等の埋め込まれた加熱用ホルダ内に挿入す
る方法ケとるのが望ましく、この状態で定格温度より２
０〜３０℃低いｇ度として約３０分間保持するのが適当
である。In order to make the air inside the conductive case completely diluted, there are various methods to heat the conductive case. It is preferable to insert it into a heated heating holder, and in this state the temperature should be 2° below the rated temperature.
It is appropriate to hold the temperature at a temperature of 0 to 30°C for about 30 minutes.
本発明の１次シールに使用する金属イオン硬化性アクリ
ル樹脂は、例えばスリーボンド社商品名≠１３６０があ
けられる。The metal ion-curable acrylic resin used for the primary seal of the present invention is, for example, ThreeBond's product name ≠1360.
また不発明に使用する光硬化性樹脂組成物としては、例
えばスリーボンド社商品名＋に−４１６（光硬化性エポ
キシアクリレート樹脂）があげられるが、この他にエポ
キシメタクリレート、ポリエステルアクリレート、ウレ
タンアクリレートあるいは不飽和ポリエステル等の公知
の光硬化性樹脂があけられる。また２次シールに使用す
る光硬化性樹脂組成物１ｃｌ−ｊ変色および変性防止の
ために少クロムの添加１ｉは組成物全体の１〜３重量％
の前曲とするのが望ましい。Examples of photocurable resin compositions used in the invention include ThreeBond's product name + and -416 (photocurable epoxy acrylate resin), but also epoxy methacrylate, polyester acrylate, urethane acrylate, and Known photocurable resins such as saturated polyester can be used. In addition, the addition of a small amount of chromium 1i to the photocurable resin composition 1cl-j used for the secondary seal to prevent discoloration and deterioration is 1 to 3% by weight of the entire composition.
It is preferable to use it as the prequel.
また％に絶縁体外縁部と導電ケースの開口周縁および入
力リード線との各当接部に最初に被着する光硬化性樹脂
組成物はできるだけ短時間、好ましくは数秒〜数１０秒
程度の紫外線照射により硬化するものを用いるのが望ま
しい。In addition, the photocurable resin composition that is first applied to each contact area between the outer edge of the insulator, the opening periphery of the conductive case, and the input lead wire is exposed to ultraviolet light for as short a time as possible, preferably from several seconds to several tens of seconds. It is desirable to use a material that can be cured by irradiation.
（発明の実施例） 次に本発明の実施例について説明する。(Example of the invention) Next, examples of the present invention will be described.
第２図に示すように、一端に出力リード線１０を接続し
た筒形の金属製の導電ケース１１内に、可溶ベレット１
２、ホールドスプリング１３、可動４を板１４、ブツシ
ュスプリング１５および入力リード線１６を支持したセ
ラミック製の絶縁体１７を順次収納し、導電ケース１１
の開口周縁を絶縁体１７の外縁部に密接した後、全体を
定格理屈より２０〜３０℃低い温度に保持された加熱ホ
ルダ（図示せず）内に挿入し、約３０分間加熱して４軍
ケース１１内を乾燥させ、この状態で絶縁体１７外縁部
と導電ケース１１の開口周縁および入力リード線１６と
の各当接部上に前記す１３６０と前記すに−４１６と′
ｆｃ２：１の割合で混合した樹脂組成物を被着して第１
次シール層１８を設けた後、紫外線照射をすることによ
り外に露出している部分は紫外線により、また導電ケー
ス１１に遮蔽されている部分は÷１３６０の金属イオン
効果により第１次シール層１８を硬化させた。As shown in FIG. 2, a fusible pellet 1 is placed inside a cylindrical metal conductive case 11 with an output lead wire 10 connected to one end.
2. Hold spring 13, movable member 4, plate 14, bushing spring 15, and ceramic insulator 17 supporting input lead wire 16 are sequentially housed in conductive case 11.
After bringing the opening periphery of the insulator 17 into close contact with the outer edge of the insulator 17, the entire body is inserted into a heating holder (not shown) maintained at a temperature 20 to 30 degrees Celsius lower than the rated temperature, and heated for about 30 minutes. The inside of the case 11 is dried, and in this state, the above-mentioned 1360 and the above-mentioned 2-416 and '
A resin composition mixed at a ratio of fc2:1 is applied and the first
After the next sealing layer 18 is formed, the first sealing layer 18 is irradiated with ultraviolet rays, so that the parts exposed to the outside are exposed to ultraviolet rays, and the parts shielded by the conductive case 11 are exposed to the metal ion effect of ÷1360. hardened.
次に絶縁体１１外縁部および前記当接部上に前記Φに−
４１６に２重量％の酸化クロムを添加混合した樹脂組成
物を被着して第２次シール層１９を設けた後、紫外線照
射によりこの第２次シール層１９全完全に硬化させた。Next, on the outer edge of the insulator 11 and the contact portion, the
A resin composition prepared by adding and mixing 2% by weight of chromium oxide to 416 was applied to form the second sealing layer 19, and then the entire second sealing layer 19 was completely cured by ultraviolet irradiation.
こうして得られた温度ヒユーズは、第１次および第２次
シール層１８．１９に気泡や微小な孔が生じておらず、
また加熱によるシール層の変色がないので外観が良好で
あるとともに、所定の耐電圧試験（ペレット溶断試験直
後１．５ Ｋｖの電圧Ｖｃ１分間耐える試験）を完全に
パスした。The temperature fuse obtained in this way has no air bubbles or minute holes in the primary and secondary sealing layers 18 and 19.
In addition, since there was no discoloration of the sealing layer due to heating, it had a good appearance and completely passed the specified withstand voltage test (a test that withstood a voltage Vc of 1.5 Kv for 1 minute immediately after the pellet fusing test).
また高温雰囲気下においても溶融した可溶ペレット１２
が外部に漏れることがなく、溶断不良も生じなかった。In addition, the soluble pellets 12 melted even in a high temperature atmosphere.
There was no leakage to the outside, and no fusing defects occurred.
なお、前記１次および２次シール層１Ｂ、１９を硬化す
る際、ファンおよびブロア等により冷風を当てながら紫
外線照射することにより次の効果が得らｎる。Incidentally, when curing the primary and secondary sealing layers 1B and 19, the following effects can be obtained by irradiating them with ultraviolet rays while blowing cold air with a fan, blower, or the like.
■ 低温度用（１００℃以下）温度ヒユーズのシール層
の硬化も、溶断したりシール層に気泡を発生させること
なく行い得る。(2) The sealing layer of a low-temperature (100°C or lower) temperature fuse can be cured without melting or creating bubbles in the sealing layer.
Ｃ２）２次シール層表面に光沢が出て商品奥価値が上が
る。C2) The surface of the secondary seal layer becomes glossy, increasing the product value.
（発明の効果）
以上の実施例からも明らかなように本発明によれば、溶
断時に可溶ぺＶットの融液の洩れがなく外観および特性
の良好な温度ヒユーズを短時間に製造することができる
。(Effects of the Invention) As is clear from the above embodiments, according to the present invention, a temperature fuse with good appearance and characteristics can be manufactured in a short time without leaking the melt of fusible PET when blowing. be able to.
第１図は従来の温度ヒユーズの製造方法を説明するため
の断面図、第２図は本発明実施例を説明するための断面
図である。
１、１０・・・・・・出力リード線
２．１１・・・・・・導電ケース
３．１２・・・・・・ｎＴｍベレット
４．１４・・・・・・可動４電板
５．１３・・・・＝・ホールドスプリング６．１５・・
・・・・ダッシュスプリング７．１６・・・・−・入力
リード線FIG. 1 is a sectional view for explaining a conventional method of manufacturing a temperature fuse, and FIG. 2 is a sectional view for explaining an embodiment of the present invention. 1, 10... Output lead wire 2.11... Conductive case 3.12... nTm bellet 4.14... Four movable electric plates 5.13・・・=・Hold spring 6.15・・
・・・・Dash spring 7.16・・・・−・Input lead wire
Claims (1)
に、可溶ペレット、ホールドスプリング、可動４を板、
ブツシュスプリングおよび入力リード線全支持した絶縁
体を順次収納し、前記導電ケースの開口周縁を前記絶縁
体外縁部に密接させた後、加熱して前記導電ケース内の
空気を希薄状態とし、この状態で前記絶縁体外縁部と導
電ケースの開口周縁および前記入力リード線との各当接
部に金属イオン硬化性アクリル樹脂組成物と光硬化性樹
脂組成物との混合物を被着して硬化させ、その後、前記
絶縁体外縁部および前記導電ケース開口周縁部とに、１
〜３重量％の酸化クロムを含有する光硬化性樹脂組成部
を被着して硬化させることを特徴とする温度ヒユーズの
製造方法。 ２、金属イオン硬化性アクリル樹脂組成物と光硬化性樹
脂組成物との混合割合は２〜３：１である特許請求の範
囲第１項記載の温度ヒユーズの製造方法。[Claims] 1. A fusible pellet, a hold spring, and a movable 4 are placed in a cylindrical conductive case with an output lead wire connected to one end of the plate,
The bushing spring and the insulator that fully supports the input lead wire are sequentially stored, and the opening periphery of the conductive case is brought into close contact with the outer edge of the insulator, and then heated to dilute the air inside the conductive case. In this state, a mixture of a metal ion-curable acrylic resin composition and a photocurable resin composition is applied to each contact portion between the outer edge of the insulator, the opening periphery of the conductive case, and the input lead wire, and cured. , Then, 1 is applied to the outer edge of the insulator and the periphery of the opening of the conductive case.
A method for producing a temperature fuse, comprising depositing and curing a photocurable resin composition containing ~3% by weight of chromium oxide. 2. The method for manufacturing a temperature fuse according to claim 1, wherein the mixing ratio of the metal ion-curable acrylic resin composition and the photocurable resin composition is 2 to 3:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2561184A JPS60170129A (en) | 1984-02-14 | 1984-02-14 | Method of producing temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2561184A JPS60170129A (en) | 1984-02-14 | 1984-02-14 | Method of producing temperature fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60170129A true JPS60170129A (en) | 1985-09-03 |
Family
ID=12170680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2561184A Pending JPS60170129A (en) | 1984-02-14 | 1984-02-14 | Method of producing temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60170129A (en) |
-
1984
- 1984-02-14 JP JP2561184A patent/JPS60170129A/en active Pending
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