JPS5974292A - Partial plating device - Google Patents

Abstract

PURPOSE:To perform easily partial plating of small parts, holed parts, etc. by putting mterials to be plated into the spacing between pipes for releasing and sucking a plating soln. which are provided to face each other at right angles to plural pipes for dropping the plating soln. and subjecting the materials to electroplating. CONSTITUTION:The plating soln. supplied by a pump 14 into a storage tank 16 passes through an auxiliary pipe 19 connecting to main pipes 18, 18' through pipes 17, 17' and is recovered through a pipe 19'. The electrodes 21, 21' connected to fittings 20, 20' fixed to the pipes 18, 18' are used as an anode, and the pressure of the plating liquid in the pipes 18, 18' is increased or decreased to release vigorously the plating soln. from the pipe 19 ant to suck the same into the pipe 19'. When the opening or notched part of the material 23 to be plated as a cathode is put between the pipes 19 and 19' in which the plating soln. is circulated, the material conducts by contact with the plating soln. 24. If the material 23 is detected therefrom after holding for a required time in said state, the material 23 is plated thereon in approximately the same shape as the sectional shape of the pipes 19, 19'.

Description

[Detailed description of the invention] The present invention relates to a partial plating method.

The present invention relates to a method for performing partial plating using a plurality of pipes, which improves the stability of plating and increases the commercialization of metuki. Frames for integrated circuits (integrated circuits) and other electrical contact members are plated with negative metal to ensure electrical continuity and long-term reliability. The conventional partial plating method requires a special mask, cumbersome jigs and processes for applying and printing resist, and applying tape, making it impossible to easily perform partial plating. A conventional example will be explained based on an embodiment shown in the drawings. As shown in the cross-sectional view shown in FIG. The material to be plated 1 is covered entirely with an elastic sheet 3 on the other side, and after being pressed from the upper side of the elastic sheet 3 via an air cylinder 4, a nozzle 5 that also serves as an anode located below the elastic sheet 20 is applied. This is accomplished by spraying the plating solution toward the back surface 6 of the material 1 to be plated, plating the back surface 6 at the same location, and collecting the unnecessary plating solution from the hole 7. In 1 part 1, a material to be plated 10 with a resist 9 applied to other parts except for the part 8 that requires plating is immersed in a plating solution, and the material to be plated 10 is used as a cathode and the plating solution is used as an anode. This is done by removing the resist 9 after plating the portion 8 that requires it. 1, insulating tape 12 is applied to the other parts except for the part 11 that requires plating.
This can be done by using the material to be plated 13 to which plating is pasted as a cathode and the plating solution as an anode to plate the portion 11 that requires plating, and then removing the insulating tape 12. Among these partial plating methods, the method shown in FIG. 1 C-1 requires (1) a dedicated mask for each item to be plated, and is expensive and requires a long manufacturing period.

■Partial plating on bent parts, cut and raised parts, etc. is not possible. ■Remask replacement, that is, changing processed products, requires 3 times even if it is simple.
-8, and is unsuitable for many types of processing.

■Mechanical equipment is large, takes up a lot of space, and is expensive, so it takes a long time to depreciate.

■Leakage of plating solution from gaps in the mask and capillary action between the mask and the material to be plated causes the plating solution to remain attached to most parts of the material to be plated before proceeding to the next process, resulting in wasted expensive plating solution. Consume.

In addition to the following problems, the plating method shown in item 1) requires two to three steps to apply or print the resist onto the material to be plated, which increases the number of man-hours.

■Cannot be applied to items that have undergone processing such as bent parts or raised cut parts.

■It is difficult to reliably maintain adhesion between the resist and the material to be plated, and parts that do not require plating are often damaged.

(2) Two to three steps are required to completely remove the resist, which increases the number of steps.

In addition to the following problems, the plating method shown in
This method requires very complicated work such as pasting insulating tape several times, which is not reliable and spoils the appearance.

■Plating on minute parts is technically difficult.

■It is difficult to apply to plated materials that have bent parts or raised cuts.

Although there are many problems with the currently used partial plating method, it is unavoidably not used because there is no other suitable solution.

The present invention solves all of these problems and provides a method for easily partially plating small parts, parts with holes, etc.

Hereinafter, the present invention will be explained based on embodiments shown in the drawings.

In the cross-sectional view of the device shown in FIG.
5, the plating solution is supplied to the plating solution supply storage tank 16 through the plating solution supply pipe 1 made of silicone rubber or the like.
7, 17', the main pipe 18, 1 is made of an insulating material with excellent plating liquid resistance, such as Teflon or vinyl chloride.
The secondary pipes 19 and 19' connected to the main pipe 1
The main pipe 18 is made of the same material as 8 and 18'.
, 18', and is recovered via the secondary pipe 19'. Main pipe 18, 18'
The electrode connecting fittings 20, 2 (1') are fixed to the electrode connecting fittings 20, 2 (1'), and an electrode 21 made of a conductive wire, rod, plate, etc.
, 21' are connected. Said main pipe 18°18
Since the end surfaces of the slave pipes 19 and 19' connected with '&C' are provided parallel to the main pipes 18 and 18', in the structure of the pipe portion, the supply pipes 22 and 22
' is supplied with plating solution through main pipes 18 and 18',
High plating liquid pressure is applied to the main pipe 18, and the main pipe 18'
The plating solution pressure is adjusted to be low, and the plating solution is vigorously discharged from the secondary pipe 19 via the main pipe 18 where the plating solution pressure is high, and at the same time, the plating solution is connected to the main pipe 181 where the plating solution pressure is low. The sub-vibrator 19' is used for suction, and the electrode connecting fitting 20.2 (1', electrode 2I
, 1211 are operated as anodes, and the hole or notch of the material to be plated, which is operated as a cathode, is inserted between the slave pipes 19 and 19'.
9.Contact and conduction with the released plating solution. The material to be plated and the plating liquid are kept in contact for several tens of seconds.
After holding it for several minutes, the Gyoda to be plated is attached to the secondary pipe 19,1.
By separating the pipes 9' from the pipes 9', the plated material can be plated in a shape that is almost the same as the cross-sectional shape of the slave pipes 19 and 19'. When performing the smearing process using such a method, it is assumed that the plating solution is already present inside at least the secondary pipes 19 and 19'.
The plating solution U that was vigorously discharged from the main pipe 18'
Since the pressure of the plating liquid is low, the plating liquid is sucked into the secondary pipe 19' which is suctioning it, and is recovered via the recovery pipes 25 and 25'.

In this case, the main pipes 18, 18' and the secondary pipes 19, 1
It is desirable that the distance between the pipe 9' and the end face of the main pipe 18, 18' be equal to or larger than the inner diameter of the main pipe 18, 18'. In the above case, the slave vibrator 19° 19' is placed horizontally, but the specifications do not change even when the slave pipes 19, 19' are rotated downward, upward, etc. Further, the plating solution supplied to the plating solution supply storage tank 16 is recovered through a plating solution supply pipe made of silicone rubber or the like and installed at a certain location to prevent plating solution leakage.

Furthermore, when increasing or decreasing the plating solution flow rate, it is possible to increase or decrease the plating solution flow rate by opening and closing the plating solution flow rate adjustment valves 26 and 26' attached to the plating solution supply pipes 17 and 17'. To adjust the amount of plating solution released or the strength of the suction, open and close the slave pipe plating solution volume adjustment valves 27 and 27' attached to the plating solution supply pipes 17 and 17'. You can finely adjust the amount of liquid in Sae. However, it must be determined by taking into account various factors such as the supply amount from the main pipes 18 and 18', the position of the plating liquid level in the sub pipes 19 and 19', the viscosity of the plating liquid, and the temperature. As an example that satisfies the above conditions, the main pipe 18,
18' outer diameter φ10 wua, inner diameter φ6 m, slave pipe] 9.19I outer diameter φ0.6 ms, inner diameter φ0.3, end face of slave pipe 19.191 to main pipe 18,1
Distance to end face of 8' L 5.5 M, plating liquid temperature 45
°C to 70 °C, plating solution composition is Au (CN2) 20
~3CI r/7s Bath preparation liquid 75ch, pure water remaining amount P, H7
, Q ~7-5 + specific gravity 1.13 ~ 1.18, t:
Under these conditions, the voltage was 4v to 6V, the current density was 5 to 1 (l A/dm), the material to be plated was phosphor bronze with N6 plating applied to approximately 1 μm, and the plating time was 30 seconds. As a result of this process, ■ It is possible to perform sufficient plating even if the spacing between the opposing secondary pipes is 2.0H to 2.5 meters. ■ The area to which plating is applied is limited to a range of 0.3 μ to 0.6 m. There is no leakage or adhesion to others.

■Main pipe plating solution flow rate 1.5-2. Otyy'sec
, N pressure s V+ Current density 7A/dm'', the relationship between plating time and plating thickness is 0.5ttm75se
c, 1. ottm, /LIMecy 1-57'1
It was possible to make it 5sec+.

In view of the above, the partial plating apparatus according to the present invention (1) has an outer diameter of the secondary pipe of 0.6 mg to 2.0 IuI, so that partial plating can be easily performed on small parts with holes of 2,011 m or less.

■Since the slave pipes are installed opposite each other, one side is for discharging the plating solution and the other is for sucking the plating solution, so the plating solution is constantly flowing through the plated surface. There are no problems with appearance such as discoloration.

■Since the plating liquid is discharged and sucked in by two secondary pipes whose centers are aligned, there is no leakage of the plating liquid.

As described above, the partial plating apparatus according to the present invention is most suitable for partial plating of small parts, for example, electrically conductive parts used in wristwatches, table clocks, etc., parts for small home appliances such as cameras, small tape recorders, etc. Partial plating is possible by simply putting Kg plating material between the opposing pipes, so it is possible to apply plating to the tip of the tip using the conventional plating method. The plating solution was considered to be a drawback of the method in which the plating solution contacts and slides on the plating object, and the anode installed inside the tip and the material to be plated act as polarization to plate the area that the plating solution touches. It is a partial plating device with a wide range of applications that can be used as a new plating device that satisfies all the problems and problems that are difficult to replenish.

[Brief explanation of drawings]

FIG. 1 shows a conventional partial plating method, and (a), (b), and (b) 4 show cross-sectional views of each embodiment. 1-11... Material to be plated 2... Elastic body having through holes 3... Elastic body sheet 4... Air cylinder 511... Nozzle 6... Plating processing section 7, φ, Hole section 1 mouth) 8φ... Plating processing part 9... Resist] 0, Φ, material to be plated... Plating processing part 12, Φ, insulating tape 13... Figure 2 shows the present invention Partial plating device 14--Plating solution supply pump 15...Plating solution supply pipe 16...Plating solution supply storage tank 17, Φ, Plating solution supply pipe 18, 18', Main pipe 19, 19'. O Sub-pipe addition, 201... Electrode connection fittings 21, 21'... Electrode η 22'll e Supply pipe device, 23'... Material to be plated, 241... Plating solution 25, 25'... Recovery pipe 26 , 2f3'・Fist plating liquid flow rate adjustment valve 27 , 27
'...Sub pipe plating liquid volume adjustment valve side...Plating liquid supply pipe and above Applicant: Suwa Seikosha Co., Ltd. Sai1en/4)

Claims (1)

[Claims] A plurality of pipes through which the plating solution flows are provided, sub-pipes are provided in a portion of each of the pipes to face each other at approximately right angles, one sub-pipe is used as a plating solution discharge pipe, and the other sub-pipe is used as a plating solution suction pipe; A certain interval is provided between the end faces of the plurality of opposing subordinate pipes so that the plating solution flowing through the tube is discharged from one of the opposing subordinate pipes, and the plating solution is sucked from the other subordinate pipe. is a method in which the material to be plated is placed in the space with the plating solution flowing through the space, and the plating solution is used as the anode and the material to be plated as the anode. A plating solution supply and storage tank located above is filled with the plating solution, a plurality of pipes of a certain length are provided from the plating solution supply and storage tank, the plating solution is dropped through the pipes, and the plating solution is discharged from the opposing secondary pipe. The method is characterized in that the plating liquid is caused to flow through between the opposing sub-pipes, and the material to be plated is inserted into the gap through which the plating liquid is flowing, thereby partially plating the material to be plated. partial plating equipment.