JPH031392B2 - - Google Patents
Info
- Publication number
- JPH031392B2 JPH031392B2 JP17811381A JP17811381A JPH031392B2 JP H031392 B2 JPH031392 B2 JP H031392B2 JP 17811381 A JP17811381 A JP 17811381A JP 17811381 A JP17811381 A JP 17811381A JP H031392 B2 JPH031392 B2 JP H031392B2
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- plating
- plating liquid
- plated
- main pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 132
- 239000007788 liquid Substances 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 26
- 230000001788 irregular Effects 0.000 description 5
- 238000011084 recovery Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 本発明は、部分メツキ方法に関する。[Detailed description of the invention] The present invention relates to a partial plating method.
本発明は復数個のパイプを用いて、部分メツキ
をする方法に於て、メツキの安定性の向上、メツ
キの高速化を図るための方法に関する。IC（集積
回路）用フレーム、又は、の他の電気用接点部材
は、電気導通性、長期信頼性を確保する必要性か
ら貴金属メツキを行つている。従来から行なわれ
ている部分メツキ法は復数個のパイプを用いた簡
便な部分メツキ法である。 The present invention relates to a method for improving the stability of plating and increasing the speed of plating in a method of partially plating using a plurality of pipes. IC (integrated circuit) frames and other electrical contact members are plated with precious metals to ensure electrical continuity and long-term reliability. The conventional partial plating method is a simple partial plating method using several pipes.
以下、従来技術の部分メツキ方法の実施例を図
面に基づいて、説明する。第１図のノズル部分断
面図のうち、テフロン、塩化ビニール等、耐メツ
キ液性に優れた絶縁性材料を用いた主パイプ１
は、従パイプ２を経て接続される。従パイプ２
は、主パイプ１と同様の材料を用いたもので、主
パイプ１の一部に設けられて外部に連結されてい
る。主パイプ１には電極接続金具３が固定されて
いるとともに、電極４が接続されている。前記主
パイプに接続された従パイプ２の端面の位置は主
パイプ１と略平行に設けるものとする。以上パイ
プ部分の構成に於て、供給パイプ５がメツキ液を
供給し、主パイプ１を経て、従パイプ２に渦流を
発生させると同時に主パイプ１に吸引され、更に
電極接続金具３、電極４を陽極として働らかせた
状態とし、陰極として働かせた被メツキ材６を従
パイプ２の端部に近接することにより、従パイプ
２の端面よりやや下がつたメツキ液７と接触導通
する。前記被メツキ材６とメツキ液７が接触導通
された状態で、数秒〜数十秒間保持した後、被メ
ツキ材６を従パイプ２から引き離すことにより、
従パイプ２の断面形状とほぼ同一のメツキ処理形
状を被メツキ材６に行なうことができる。このよ
うな方法によりメツキ処理作業を行なう場合少な
くとも従パイプ２の内部には既にメツキ液が存在
するものとし、従パイプ２から漏出したメツキ液
７は、従パイプ２内部にあるメツキ液７の表面張
力により端面より流出することなく保持されると
同時に、主パイプ１を通じて吸収されることによ
り、回収パイプ８を経て回収することになる。こ
の場合主パイプ１と従パイプ２の端面との間隔Ｌ
は概ね主パイプ１の内径の1/2以上にすることが
望ましい。前記については従パイプ２を下向きに
した場合であるが、従パイプ２を90゜（横むき）
180゜（上むき）等と回転させた場合に於ても前記
と同様に仕様は変らない。ただし、主パイプ１か
らのメツキ液供給量は、15〜20ｍ／Secが限度で
前記以上の流速とした場合はメツキ液７の表面張
力よりメツキ液流の力が大となり、回収パイプ５
から供給された後、被メツキ材６と湿潤後、その
まま装置外を排出されると同時に、排出されたメ
ツキ液流により、メツキを必要としない部分へメ
ツキが付着することにより、本来目的とした部分
以外へメツキが析出し、貴金属が無駄になるばか
りでなく、外観上も不規則なメツキと素地境界線
ができ上り実用に耐えられないものとなる。 Hereinafter, an example of a conventional partial plating method will be described based on the drawings. In the partial cross-sectional view of the nozzle in Figure 1, the main pipe 1 is made of an insulating material with excellent plating liquid resistance, such as Teflon or vinyl chloride.
are connected via the slave pipe 2. Slave pipe 2
is made of the same material as the main pipe 1, and is provided in a part of the main pipe 1 and connected to the outside. An electrode connecting fitting 3 is fixed to the main pipe 1, and an electrode 4 is connected thereto. The position of the end face of the slave pipe 2 connected to the main pipe is approximately parallel to the main pipe 1. In the structure of the pipe section described above, the supply pipe 5 supplies the plating liquid, which passes through the main pipe 1, generates a vortex in the subordinate pipe 2, and is simultaneously sucked into the main pipe 1, and is then sucked into the main pipe 1, and then the electrode connecting fitting 3 and the electrode 4. By bringing the material 6 to be plated, which is working as an anode and working as a cathode, close to the end of the secondary pipe 2, contact is established with the plating liquid 7 slightly lower than the end surface of the secondary pipe 2. After holding the state in which the material to be plated 6 and the plating liquid 7 are in contact and electrical conductivity for several seconds to several tens of seconds, the material to be plated 6 is separated from the slave pipe 2.
The plated material 6 can be plated to have a shape that is almost the same as the cross-sectional shape of the secondary pipe 2. When plating work is performed using such a method, it is assumed that plating liquid is already present inside at least the secondary pipe 2, and the plating liquid 7 leaking from the secondary pipe 2 is applied to the surface of the plating liquid 7 inside the secondary pipe 2. It is held by the tension without flowing out from the end face, and at the same time is absorbed through the main pipe 1, so that it is collected via the collection pipe 8. In this case, the distance L between the end faces of the main pipe 1 and the subordinate pipe 2
It is desirable that the diameter be approximately 1/2 or more of the inner diameter of the main pipe 1. The above is a case where the slave pipe 2 is facing downward, but if the slave pipe 2 is turned 90 degrees (sideways)
Even if it is rotated by 180 degrees (upwards), etc., the specifications do not change as described above. However, the plating liquid supply amount from the main pipe 1 is limited to 15 to 20 m/Sec, and if the flow rate is higher than the above, the force of the plating liquid flow will be greater than the surface tension of the plating liquid 7, and the recovery pipe 5
After being supplied from the plating material 6, it is discharged from the device as it is, and at the same time, the discharged plating liquid flow causes plating to adhere to areas that do not require plating, thereby removing the material that was originally intended. Not only does the plating precipitate in areas other than the parts, and the precious metal is wasted, but also the appearance is irregular, with irregular plating and border lines between the substrates, making it unusable for practical use.
従つてこのポンプ直結貫流部分メツキ方法は、
ポンプの回転の不規則により、従パイプ端面
から出るメツキ液面が不規則になり、そのため
メツキ液面調整が困難である。 Therefore, in this pump-directly connected once-through partial plating method, due to the irregular rotation of the pump, the level of the plating liquid coming out from the end face of the secondary pipe becomes irregular, making it difficult to adjust the level of the plating liquid.
マグネツトポンプ、ギヤポンプ等を使用して
いるため、ポンプ自体の内部構造が不安定な為
従パイプ端面のメツキ液面が非常に不安定であ
る。 Since a magnetic pump, gear pump, etc. are used, the internal structure of the pump itself is unstable, and the plating liquid level at the end of the slave pipe is extremely unstable.
メツキ流速度を速くすることにより、他の部
分へメツキ液が漏出してしまう。 By increasing the plating flow rate, the plating liquid leaks to other parts.
他の部分へメツキされてしまうため、外観上
不規則な素地境界線ができあがり、実用に耐え
られないものとなる。 Since the plating is applied to other parts, a boundary line of the substrate is created which is irregular in appearance, and becomes impractical.
等の問題点により、この部分メツキ方法は多く
の問題点が存在する。 There are many problems with this partial plating method due to the following problems.
本発明はかかる問題点を全て解決したもので、
曲げ加工、切り起し加工、絞り加工等を有する被
メツキ材に容易に部分メツキを行なうための方法
を提供するものである。 The present invention solves all of these problems,
The present invention provides a method for easily partially plating a material to be plated which has been subjected to bending, cutting, drawing, etc.
本発明の部分メツキ方法は、メツキ液の貫流す
る種パイプの一部分に略直角に、従パイプを設け
前記種パイプ中を貫流するメツキ液が従パイプ中
に渦流を発生するようにして、従パイプ端面に被
メツキ材を湿潤接触した状態でメツキ液側を陽極
に、また被メツキ材側を陰極としてメツキする方
法に於て、ポンプによりメツキ液を上方にあるメ
ツキ液供給貯蔵タンクにメツキ液を充満させ、メ
ツキ液供給貯蔵タンクから一定の長さのパイプを
経て、メツキ液を落下させ、前記種パイプ中を貫
流させ、従パイプ中に渦流を発生するようにして
メツキを行なうことを特徴とする。 In the partial plating method of the present invention, a secondary pipe is provided approximately at right angles to a part of the seed pipe through which the plating liquid flows, and the plating liquid flowing through the seed pipe generates a vortex in the secondary pipe. In the method of plating with the material to be plated in wet contact with the end surface, the plating liquid side is used as an anode and the material side to be plated is used as a cathode.The plating liquid is pumped by a pump into the plating liquid supply storage tank located above. Plating is performed by filling the plating liquid supply storage tank and dropping the plating liquid through a pipe of a certain length, causing it to flow through the seed pipe and generating a vortex in the slave pipe. do.
以下、本発明を図面に示す実施例に基づいて、
説明する。 Hereinafter, based on the embodiments of the present invention shown in the drawings,
explain.
第２図の装置断面図のうち、ポンプ９から供給
されたメツキ液はシリコンゴム等でつくられたメ
ツキ液供給管１０を経て、メツキ液供給貯蔵タン
ク１１に供給されたメツキ液はシリコンゴム等で
つくられたメツキ液供給管１２を経て、テフロ
ン、塩化ビニール等、耐メツキ液性に優れた絶縁
性材料を用いた主パイプ１３へ接続される。 In the sectional view of the device shown in FIG. 2, the plating liquid supplied from the pump 9 passes through the plating liquid supply pipe 10 made of silicone rubber or the like, and the plating liquid supplied to the plating liquid supply storage tank 11 is made of silicone rubber or the like. The plating liquid supply pipe 12 is connected to a main pipe 13 made of an insulating material with excellent plating liquid resistance, such as Teflon or vinyl chloride.
従パイプは、主パイプ１３と同様の材料を用い
たもので、主パイプ１３の一部に設けられた従パ
イプ１４を通り外部に導びかれる。主パイプ１３
には電極接続金具１５が固定されているととも
に、電極１６が接続されている。前記主パイプ１
３に接続された従パイプ１４の端面の位置は主パ
イプ１３と略平行に設けるものとする。以上パイ
プ部分の構成に於て、供給パイプ１７がメツキ液
を供給し、主パイプ１３を経て縦パイプ１４に渦
流を発生させると同時に主パイプ１３に吸引さ
れ、更に、電極接続金具１５、電極１６を陽極と
して働らかせた状態とし、陰極として働かせた被
メツキ材１８を従パイプ１４の端部に近接するこ
とにより、従パイプ１４の端面よりやや飛び出し
たメツキ液１９と接触導通する。前記被メツキ材
１８とメツキ液１９が接触導通された状態で、数
秒〜数十秒間保持した後、被メツキ材１８を従パ
イプ１４から引き離すことにより、従パイプ１４
の断面形状とほぼ同一のメツキ処理形状を被メツ
キ材１８に行なうことができる。このような方法
によりメツキ処理作業を行なう場合少なくとも従
パイプ１４の内部には既にメツキ液が存在するも
のとし、従パイプ１４から漏出したメツキ液１９
は、従パイプ１４内部にあるメツキ液１９の表面
張力により端面より流出することなく保持される
と同時に、主パイプ１３を通じて吸引されること
により、回収パイプ２０を経て回収することにな
る。この場合主パイプ１３と従パイプ１４の端面
との間隔Ｌは概ね主パイプ１３の内径の1/2以上
にすることが望しい。前記については従パイプ１
４を横おきにした場合であるが従パイプ１４と下
向き、上向き等と回転させた場合に於ても前記と
同様に仕様は変らない。 The secondary pipe is made of the same material as the main pipe 13, and is guided to the outside through the secondary pipe 14 provided in a part of the main pipe 13. Main pipe 13
An electrode connecting fitting 15 is fixed to the holder, and an electrode 16 is connected to the holder. The main pipe 1
The position of the end face of the slave pipe 14 connected to the main pipe 13 shall be approximately parallel to the main pipe 13. In the structure of the pipe section described above, the supply pipe 17 supplies the plating liquid, generates a vortex flow in the vertical pipe 14 through the main pipe 13, and at the same time is sucked into the main pipe 13. By bringing the material 18 to be plated, which is working as an anode and working as a cathode, close to the end of the secondary pipe 14, contact is established with the plating liquid 19 slightly protruding from the end surface of the secondary pipe 14. After holding the state in which the material to be plated 18 and the plating liquid 19 are in contact with each other for several seconds to several tens of seconds, the material to be plated 18 is pulled away from the secondary pipe 14, thereby removing the secondary pipe 14.
The plated material 18 can be plated with a shape that is almost the same as the cross-sectional shape of the plated material 18. When plating work is performed using such a method, it is assumed that plating liquid is already present inside at least the secondary pipe 14, and the plating liquid 19 leaking from the secondary pipe 14 is
is held by the surface tension of the plating liquid 19 inside the secondary pipe 14 without flowing out from the end face, and at the same time is sucked through the main pipe 13 to be recovered via the recovery pipe 20. In this case, it is desirable that the distance L between the end faces of the main pipe 13 and the secondary pipe 14 be approximately 1/2 or more of the inner diameter of the main pipe 13. For the above, slave pipe 1
4 is placed horizontally, but the specifications do not change as described above even when the sub pipe 14 is rotated downward, upward, etc.
またメツキ液供給貯蔵タンク１１に供給され
た、メツキ液は、メツキの漏出防止のため、シリ
コンゴム等で作られ、一定の場所に設けられたメ
ツキ液送給管２３を経て回収される。更に、メツ
キ液流量の増減を行なう場合は、メツキ液供給管
１２に取り付けられているメツキ液流量調整弁２
１を開閉することにより、可能であり、従パイプ
１４の端面のメツキ液１９の増減を行なう場合
は、メツキ液供給管１２に取り付けてある。端面
メツキ液量調整弁２２を開閉することにより端面
メツキ液１９の液量の微調整が行なえる。ただし
主パイプ１３からの供給量と従パイプ１４のメツ
キ液面１９の位置、メツキ液の粘性、温度等諸要
因を総合して決定されなければならない。前記諸
件をみたす１例として、主パイプ１３の外径φ10
mm、内径φ8mm従パイプ１４外径φ3.6mm、内径
φ2.5mm、従パイプ１４の端面から主パイプ１３の
端面までの間隔L5.5mmメツキ液温60℃〜70℃、メ
ツキ液組成とAu（CN2）20〜30ｇ／、建浴液75
％、純水残量、P.H7.0〜7.5、比重1.13〜1.18、電
圧4V〜6V、電流密度５〜10A／ｄm2被メツキ材
としてはリン青銅の上にNiメツキを約1μｍ施し
たもの、メツキ処理時間10〜30秒、このようなも
とでメツキ処理を行つた結果として
被メツキ材上へのメツキ処理形状は、従パイ
プの内径よりやや大きい。φ2.5mm〜φ2.6mm位で
目視した所で真円に近いものでメツキ形状の大
きい崩れはない。 Further, the plating liquid supplied to the plating liquid supply storage tank 11 is recovered through a plating liquid supply pipe 23 made of silicone rubber or the like and provided at a fixed location to prevent plating from leaking. Furthermore, when increasing or decreasing the plating liquid flow rate, use the plating liquid flow rate adjustment valve 2 attached to the plating liquid supply pipe 12.
1, and when increasing or decreasing the amount of plating liquid 19 on the end surface of the slave pipe 14, it is attached to the plating liquid supply pipe 12. By opening and closing the end plating liquid amount adjusting valve 22, the amount of the end plating liquid 19 can be finely adjusted. However, it must be determined by taking into account various factors such as the amount of supply from the main pipe 13, the position of the plating liquid level 19 in the sub pipe 14, the viscosity of the plating liquid, and the temperature. As an example that satisfies the above conditions, the outer diameter of the main pipe 13 is φ10.
mm, inner diameter φ8mm, slave pipe 14 outer diameter φ3.6mm, inner diameter φ2.5mm, distance L5.5mm from the end face of slave pipe 14 to the end face of main pipe 13, plating liquid temperature 60°C to 70°C, plating liquid composition and Au ( CN 2 ) 20-30g/, bath building liquid 75
%, remaining amount of pure water, P.H7.0~7.5, specific gravity 1.13~1.18, voltage 4V~6V, current density 5~10A/dm 2 As the material to be plated, approximately 1 μm of Ni plating was applied on phosphor bronze. As a result of plating under such conditions, the plating time was 10 to 30 seconds, the shape of the plating on the material to be plated was slightly larger than the inner diameter of the secondary pipe. When visually inspected at around φ2.5mm to φ2.6mm, it is close to a perfect circle and there is no major deterioration in the plating shape.
メツキ液の付着した部分は上記の2.5mm〜
2.6mmの範囲に限られ、その他への流出、付着
はない。 The area where the plating liquid is attached is 2.5 mm or more as shown above.
It is limited to a range of 2.6 mm, and there is no leakage or adhesion to other areas.
被メツキ材と従パイプ端面とのすきまは、
0.1〜0.2mmとしても充分メツキ処理が可能。 The clearance between the material to be plated and the end of the subordinate pipe is
Plating processing is possible even with a thickness of 0.1 to 0.2 mm.
主パイプメツキ液流速2.5〜3.0ｍ／sec、電圧
5V、電流密度7A／ｄm2に於て、メツキ時間と
メツキ厚みの関係は、0.5μｍ／5sec 1.0μｍ／
10sec 1.5μｍ／15secとすることができた。 Main pipe plating liquid flow rate 2.5 to 3.0 m/sec, voltage
At 5V and current density of 7A/ dm2 , the relationship between plating time and plating thickness is 0.5μm/5sec 1.0μm/
10sec 1.5μm/15sec.
以上に関しては平担面に部分的にメツキを行な
う場合であるが、第３図のイに示す如く、曲げ加
工を行なつた被メツキ材２４の斜線部分２５に、
部分的にメツキ処理を必要とする場合は、第３図
ロに示す如く、従パイプ２６の中に斜線部分２７
を挿入することにより容易に実現できる。 The above is a case where a flat surface is partially plated, but as shown in FIG.
If plating is required partially, as shown in FIG.
This can be easily achieved by inserting .
前述した、第２図、第３図の場合は２例とも被
メツキ材を立てて、メズルを横おきにおいて行な
つたものであるが、前記以外の姿勢が例えば従パ
イプを下向きとした場合、従パイプを上向きとし
て、被メツキ材を上とした場合でも容易に、メツ
キ処理されることは言うまでもない。 In both of the cases shown in Figures 2 and 3 mentioned above, the material to be plated was placed upright and the mezzle was placed horizontally, but if the plated material was placed in a position other than the above, for example, with the secondary pipe facing downward, Needless to say, the plating process can be easily performed even when the slave pipe is oriented upward and the material to be plated is placed on top.
以上のとおり、本考案による部分メツキ方法は
メツキ液供給管に、メツキ液端面調整弁を、
取り付けたため、従パイプ端面のメツキ液量の
調整が容易である。 As described above, the partial plating method according to the present invention includes installing a plating liquid end face adjustment valve in the plating liquid supply pipe.
Since it is attached, it is easy to adjust the amount of plating liquid on the end surface of the secondary pipe.
メツキ液供給貯蔵タンクより、メツキ液を落
下させているため、従パイプ端面のメツキ液面
が非常に安定している。 Since the plating liquid is dropped from the plating liquid supply storage tank, the plating liquid level at the end of the secondary pipe is very stable.
メツキ液流速度を速くすることにより、従パ
イプ中のメツキ液は、主パイプに吸引され、メ
ツキ液の漏出は殆んどない。 By increasing the plating liquid flow rate, the plating liquid in the secondary pipe is sucked into the main pipe, and there is almost no leakage of the plating liquid.
メツキ液の漏出が殆んどないため、メツキ処
理後の外観は、問題がない。 Since there is almost no leakage of the plating solution, there is no problem with the appearance after the plating process.
以上のとおり、本発明による部分メツキ方法は
小形部品、例えば腕時計、置時計等に用いる電気
的導通部品、カメラ、小型テープレコーダー等の
小型家電用部品への部分メツキには最も適してい
る。 As described above, the partial plating method according to the present invention is most suitable for partial plating of small parts, for example, electrically conductive parts used in wristwatches, table clocks, etc., and parts for small home appliances such as cameras, small tape recorders, etc.
このように被メツキ物の表面にノズルと接触、
又は、近接するだけで部分的にメツキが可能とな
るため、従来から行なわれている筆メツキ法、即
ち穂先の部分に滞留させたメツキ液を被メツキ物
に接触、摺動させるとともに穂先の内部に設けら
れた陽極と被メツキ材を陰極として働らかせてメ
ツキ液の触れた部分にメツキを行なう方法の欠点
とされていたメツキ液の補給が困難又は、新らし
く開発されたパイプ循環式部分メツキ方法のメツ
キ液のタレ等の諸問題を全て満足した新しい筆メ
ツキ法として取り扱うこともできる応用範囲の広
い部分メツキ方法である。 In this way, the nozzle comes into contact with the surface of the object to be plated,
Alternatively, since partial plating is possible just by getting close, the conventional brush plating method, in which the plating liquid retained in the tip of the tip contacts and slides onto the object to be plated, and the inside of the tip is removed. It was difficult to replenish the plating solution, which was considered to be a drawback of the method of plating the area touched by the plating solution by using the anode installed in the plate and the material to be plated as a cathode, or the newly developed pipe circulation type section. This partial plating method has a wide range of applications and can be treated as a new brush plating method that satisfies all the problems of the plating method, such as dripping of the plating solution.
第１図、比較例のメツキ方法によるノズル部分
断面図、１……主パイプ、２……従パイプ、３…
…電極接続金具、４……電極、５……供給パイ
プ、６……被メツキ材、７……メツキ液、８……
回収パイプ。
第２図、本発明による部分メツキ法装置、９…
…メツキ液供給ポンプ、１０……メツキ液供給
管、１１……メツキ液供給貯蔵タンク、１２……
メツキ液供給管、１３……主パイプ、１４……従
パイプ、１５……電極接続金具、１６……電極、
１７……供給パイプ、１８……被メツキ材、１９
……メツキ液、２０……回収パイプ、２１……メ
ツキ液流量調整弁、２２……端面メツキ液量調整
弁、２３……メツキ液送給管。
第３図、曲げ部品への本発明による部分メツキ
例、２４……袖メツキ材、２５……メツキ処理部
分、２６……従パイプ。
FIG. 1 is a partial cross-sectional view of a nozzle according to the plating method of a comparative example, 1...Main pipe, 2...Sub-pipe, 3...
... Electrode connection fitting, 4 ... Electrode, 5 ... Supply pipe, 6 ... Material to be plated, 7 ... Plating liquid, 8 ...
recovery pipe. Fig. 2, partial plating method apparatus according to the present invention, 9...
...Plating liquid supply pump, 10...Plating liquid supply pipe, 11...Plating liquid supply storage tank, 12...
Plating liquid supply pipe, 13...Main pipe, 14...Sub pipe, 15...Electrode connection fitting, 16...Electrode,
17... Supply pipe, 18... Material to be plated, 19
...Plating liquid, 20...Recovery pipe, 21...Plating liquid flow rate adjustment valve, 22...End face plating liquid amount adjustment valve, 23...Plating liquid supply pipe. FIG. 3: Example of partial plating of bent parts according to the present invention, 24...Sleeve plating material, 25...Plating treated portion, 26...Sub pipe.
Claims (1)
角に、従パイプを設け前記主パイプ中を貫流する
メツキ液が従パイプ中に渦流を発生するようにし
て、従パイプ端面に被メツキ材を湿潤接触した状
態で、メツキ液側を陽極に、また被メツキ材側を
陰極としてメツキする方法に於て、ポンプにより
メツキ液を上方にあるメツキ液供給貯蔵タンクに
メツキ液を充満させ、メツキ液供給貯蔵タンクか
ら一定の長さのパイプを経て、メツキ液を落下さ
せ、前記主パイプ中を貫流させ、従パイプ中に渦
流を発生するようにしてメツキを行なうことを特
徴とした部分メツキ方法。1. A secondary pipe is provided approximately at right angles to a part of the main pipe through which the plating liquid flows, and the plating liquid flowing through the main pipe generates a vortex in the secondary pipe, thereby moistening the material to be plated on the end surface of the secondary pipe. In the method of plating with the plating liquid side as the anode and the side of the material to be plated as the cathode in a contact state, the plating liquid is filled with the plating liquid into the plating liquid supply storage tank located above by a pump, and the plating liquid is supplied. A partial plating method characterized in that plating is performed by dropping a plating liquid from a storage tank through a pipe of a certain length, flowing through the main pipe, and generating a vortex in the sub pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17811381A JPS5881989A (en) | 1981-11-06 | 1981-11-06 | Partial plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17811381A JPS5881989A (en) | 1981-11-06 | 1981-11-06 | Partial plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5881989A JPS5881989A (en) | 1983-05-17 |
| JPH031392B2 true JPH031392B2 (en) | 1991-01-10 |
Family
ID=16042878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17811381A Granted JPS5881989A (en) | 1981-11-06 | 1981-11-06 | Partial plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881989A (en) |
-
1981
- 1981-11-06 JP JP17811381A patent/JPS5881989A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5881989A (en) | 1983-05-17 |
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