CN105350059A - Clamp and method for single surface electroplating of substrates - Google Patents
Clamp and method for single surface electroplating of substrates Download PDFInfo
- Publication number
- CN105350059A CN105350059A CN201510842019.5A CN201510842019A CN105350059A CN 105350059 A CN105350059 A CN 105350059A CN 201510842019 A CN201510842019 A CN 201510842019A CN 105350059 A CN105350059 A CN 105350059A
- Authority
- CN
- China
- Prior art keywords
- substrate
- probe
- pad
- probe electrode
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention provides a clamp for single surface electroplating of substrates. The clamp comprises a supporting plate, two probe electrodes and electrode leads connected with the probe electrodes. The supporting plate is provided with a groove matched with the substrates. One ends of the probe electrodes are fixed to the supporting plate through studs, and probes of the probe electrodes are placed into accommodation holes in the supporting plate. In electroplating, the substrates are placed into the groove, and the probes of the probe electrodes rotate to the substrates. According to the clamp, the back surfaces of the substrates are stably attached to the groove of the supporting plate through the tension of water, the probe electrodes have the electrode electroplating effect and can press the substrates, and therefore the back surfaces of the substrates can be completely isolated from electroplating liquid, and single surface electroplating of the substrates can be successfully realized. The clamp has the advantages of being simple in structure, easy and convenient to use, free of pollution, low in cost and high in efficiency.
Description
Technical field
The invention belongs to microelectronics technology, relate to substrate plating apparatus and method, be specifically related to a kind of fixture and method of substrate one-side electroplating.
Background technology
Plating is exactly the process utilizing electrolysis principle to plate other metal or alloy of skim on some metallic surface, utilize electrolytic action to make the technique of the surface attachment layer of metal film of metal or other material thus play to prevent burning (as corrosion), improve wear resistance, electroconductibility, reflective, the effects such as erosion resistance (copper sulfate etc.) and having improved aesthetic appearance, skin as many coins has employing electroplating technique, and electroplating technology general in the prior art, all by after in the plating tank that needs the object that is plated directly to be positioned over to be loaded with electroplate liquid, implement plating again, but products many in actual production process goes to consider in the economy principle of its concrete function and plated material, only need to carry out one-side electroplating.
Such as, the making of microwave line plate in micro-assembling (MCM) technique, general use Rogers bonded copper base, copper metallic substance can be oxidized and redden in follow-up high-temperature operation, need to carry out gold-plated process to front before use, to reduce transmission loss, ensure the reliability of bonding simultaneously.Because there is metal on traditional microwave wiring board two sides, if do not protected, two sides metal can add plating simultaneously, not only causes waste, causes golden crisp effect in order to avoid thick gold directly welds, and also need increase in subsequent operations and remove gold process; If only add electric current in front, back metal can be consumed as anode, and copper metal enters plating solution and causes plating solution to pollute, and therefore needs to protect the back side.
Tradition back-protective adopts Coating glue protect, is namely coated with last layer protecting glue at substrate back, removes protecting glue after having electroplated; This mode needs gluing and exposure sources, and operation is longer, and cost is higher.The mucous membrane protection that utilizes had realizes one-side electroplating, although technique is relatively simple, mucous membrane is pasted onto the wiring board back side, is removed by mucous membrane after completing plating; But general adhesive tape mucous membrane can cause the glue residue on back metal, and binding agent is not easily removed, remaining binding agent causes a hidden trouble also can to follow-up sintering technique.
Summary of the invention
The present invention, for solving prior art Problems existing, devises a kind of simple to operate, cost is low, the fixture of the reusable substrate one-side electroplating of noresidue and method.
The technology used in the present invention is: a kind of fixture of substrate one-side electroplating, comprise back up pad, probe electrode, the contact conductor that is connected with probe electrode, wherein back up pad is provided with the groove matched with substrate and the putting hole matched with the probe of probe electrode, probe electrode one end is fixing on the supporting plate by stud, and the probe of probe electrode can rotate between groove and putting hole.
Further, described probe electrode is two.
Further, described supporting plate material is poly (methyl methacrylate) plate or PVC material, and thickness is 4 ~ 7mm.
Further, described probe electrode is elasticity tungsten pin electrode, and diameter is 0.5mm.
Further, the described back up pad back side is provided with wire lead slot, and contact conductor is positioned at wire lead slot.
Further, described contact conductor is rubber tube wiring and is fixed in wire lead slot with silica gel by contact conductor, and contact conductor diameter is 0.5mm.
A kind of electro-plating method of substrate one-side electroplating, comprise the following steps: back up pad is provided with the groove matched with substrate, probe electrode one end is fixing on the supporting plate by stud, and contact conductor is connected with probe electrode, and the probe of probe electrode is put in putting hole on the supporting plate; Place in a groove after not needed by substrate plating one side to coat water again, the tension force of water is utilized to make substrate be close in groove, then rotate on substrate by the probe of probe electrode, whole back up pad is put in electroplate liquid, switches on power and starts to carry out one-side electroplating to substrate; After having electroplated, wash by water, dry up, the probe of probe electrode moves on in putting hole, takes off substrate and completes one-side electroplating.
Beneficial effect of the present invention is: the present invention utilizes the tension force of water that substrate back steadily is close in the groove of back up pad, the effect compressed by substrate is also played in the effect that probe electrode had both played electrode plating simultaneously, make substrate back and electroplate liquid completely isolated, successfully realize substrate one-side electroplating.
Use two probe electrodes, make substrate fixing more stable, electroplate more even, efficient simultaneously.Back up pad adopts poly (methyl methacrylate) plate or PVC material, and thickness is 4 ~ 7mm, can ensure back up pad not flexural deformation, increases retaining screw firmness; The fagging back side is provided with wire lead slot, and contact conductor is positioned at wire lead slot, makes whole fixture clean, clean and tidy, easy to operate.Tungsten pin electrode has good elasticity, is convenient to compacting substrate, does not cause excessive pressure simultaneously, conveniently adjust electrode position to substrate; Electrode thickness is suitable for, and crosses thick or meticulous meeting and causes electrolytic coating blocked up or cross and thinly affect electroplating effect.Contact conductor is rubber tube wiring and is fixed in wire lead slot with silica gel by contact conductor, bare wire cathode leg effectively can be avoided to cause plating area change, affect the accuracy of electroplating parameter; Contact conductor diameter is 0.5mm, is excessively slightly difficult to fix, and impact uses.
The present invention has that structure is simple, easy to use, pollution-free, cost is low, efficiency advantages of higher; The technique such as one-side electroplating that front in microstrip circuit thickeies plating, the front plating of semiconductor photoelectric device, doping or semi-insulating silicon substrate can be widely used in.
Accompanying drawing explanation
Facad structure schematic diagram when Fig. 1 is electroless plating of the present invention.
Facad structure schematic diagram when Fig. 2 is plating base of the present invention.
Fig. 3 is structure schematic diagram of the present invention.
Wherein, 1 represent back up pad, 2 and represent probe electrode, 3 and represent contact conductor, 4 and represent substrate, 5 and represent groove, 6 and represent putting hole, 7 and represent stud, 8 and represent silica gel.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail
As shown in Figure 1, a kind of fixture of substrate one-side electroplating, the contact conductor 3 comprise back up pad 1, two probe electrodes 2, being connected with probe electrode 2, wherein back up pad 1 is provided with the groove 5 matched with substrate 4, probe electrode 2 one end is fixed in back up pad 1 by stud 7, and the probe of probe electrode 2 is placed in the putting hole 6 in back up pad 1.As shown in Figure 3, back up pad 1 back side is provided with wire lead slot, and contact conductor 3 is positioned at wire lead slot, and contact conductor 3 is rubber tube wiring and is fixed in wire lead slot by contact conductor 3 with silica gel 8.As shown in Figure 2, during plating, substrate is put into groove 5, the probe of probe electrode 2 rotates on substrate 4.
During concrete enforcement, a kind of electro-plating method of substrate one-side electroplating, comprise the following steps: back up pad 1 is provided with the groove 5 matched with substrate 4, probe electrode 2 one end is fixed in back up pad 1 by stud 7, contact conductor 3 is connected with probe electrode 2, and the probe of two probe electrodes 2 is placed in the putting hole 6 in back up pad 1; Be placed in groove 5 after not needed by substrate 4 plating one side to coat water again, the tension force of water is utilized to make substrate 4 be close in groove 5, then rotate on substrate 4 by the probe of probe electrode 2, whole back up pad 1 is put in electroplate liquid, switches on power and starts to carry out one-side electroplating to substrate 4; After having electroplated, wash by water, dry up, the probe of probe electrode 2 moves on in putting hole 6, takes off substrate 4 and completes one-side electroplating.
Wherein back up pad 1 material is poly (methyl methacrylate) plate or PVC material, and thickness is 5mm.Probe electrode 2 is elasticity tungsten pin electrode, and diameter is 0.5mm.Contact conductor 3 is rubber tube wiring and is fixed in wire lead slot with silica gel by contact conductor 3, and the diameter of contact conductor 3 is 0.5mm.
Claims (7)
1. the fixture of a substrate one-side electroplating, it is characterized in that: comprise back up pad (1), probe electrode (2), the contact conductor (3) that is connected with probe electrode (2), wherein back up pad (1) is provided with the groove (5) matched with substrate (4) and the putting hole (6) matched with the probe of probe electrode (2), probe electrode (2) one end is fixed in back up pad (1) by stud (7), and the probe of probe electrode (2) can rotate between groove (5) and putting hole (6).
2. a kind of fixture of substrate one-side electroplating according to claims 1, is characterized in that: described probe electrode (2) is two.
3. a kind of fixture of substrate one-side electroplating according to claims 1, it is characterized in that: described back up pad (1) material is poly (methyl methacrylate) plate or PVC material, thickness is 4 ~ 7mm.
4. a kind of fixture of substrate one-side electroplating according to claims 1 or 2, is characterized in that: described probe electrode (2) for elasticity tungsten pin electrode, diameter be 0.5mm.
5. a kind of fixture of substrate one-side electroplating according to claims 1, it is characterized in that: described back up pad (1) back side is provided with wire lead slot, contact conductor (3) is positioned at wire lead slot.
6. a kind of fixture of substrate one-side electroplating according to claims 1 or 5, is characterized in that: described contact conductor (3) is for rubber tube wiring and be fixed in wire lead slot by contact conductor (3) with silica gel (8).
7. the electro-plating method of a substrate one-side electroplating, it is characterized in that: comprise the following steps: back up pad (1) is provided with the groove (5) matched with substrate (4), probe electrode (2) one end is fixed in back up pad (1) by stud (7), contact conductor (3) is connected with probe electrode (2), and the probe of probe electrode (2) is placed in the putting hole (6) in back up pad (1); Be placed in groove (5) after not needed by substrate (4) plating one side to coat water again, the tension force of water is utilized to make substrate (4) be close in groove (5), then the probe of probe electrode (2) is rotated on substrate (4), whole back up pad (1) is put in electroplate liquid, switches on power and starts to carry out one-side electroplating to substrate (4); After having electroplated, wash by water, dry up, the probe of probe electrode (2) moves on in putting hole (6), takes off substrate (4) and completes one-side electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510842019.5A CN105350059A (en) | 2015-11-28 | 2015-11-28 | Clamp and method for single surface electroplating of substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510842019.5A CN105350059A (en) | 2015-11-28 | 2015-11-28 | Clamp and method for single surface electroplating of substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105350059A true CN105350059A (en) | 2016-02-24 |
Family
ID=55326115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510842019.5A Pending CN105350059A (en) | 2015-11-28 | 2015-11-28 | Clamp and method for single surface electroplating of substrates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105350059A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105603497A (en) * | 2016-03-14 | 2016-05-25 | 武汉欧普兰光电技术股份有限公司 | Semiconductor wafer electroplating clamping device, clamping method and electroplating process thereof |
| CN110820033A (en) * | 2019-12-19 | 2020-02-21 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Sputtered ceramic substrate electroplating hanger and clamping method thereof |
| CN115637481A (en) * | 2022-11-16 | 2023-01-24 | 苏州太阳井新能源有限公司 | Photovoltaic cell electroplating equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06207300A (en) * | 1993-01-07 | 1994-07-26 | Toshiba Corp | Plating jig and plating method |
| JP2001247999A (en) * | 2000-03-07 | 2001-09-14 | Ebara Corp | Substrate plating jig |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| CN102776551A (en) * | 2012-07-04 | 2012-11-14 | 中国电子科技集团公司第四十一研究所 | Hard microstrip circuit electroplating fixture |
| CN103617962A (en) * | 2013-11-13 | 2014-03-05 | 中国电子科技集团公司第四十一研究所 | Substrate electroplating clamp |
| CN103874790A (en) * | 2011-10-19 | 2014-06-18 | 株式会社Ｊｃｕ | Substrate electroplating jig |
| CN204237882U (en) * | 2014-11-12 | 2015-04-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | Many size compatibilities single-wafer electroplating clamp |
| CN205152380U (en) * | 2015-11-28 | 2016-04-13 | 石家庄海科电子科技有限公司 | Anchor clamps that substrate single face was electroplated |
-
2015
- 2015-11-28 CN CN201510842019.5A patent/CN105350059A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06207300A (en) * | 1993-01-07 | 1994-07-26 | Toshiba Corp | Plating jig and plating method |
| JP2001247999A (en) * | 2000-03-07 | 2001-09-14 | Ebara Corp | Substrate plating jig |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| CN103874790A (en) * | 2011-10-19 | 2014-06-18 | 株式会社Ｊｃｕ | Substrate electroplating jig |
| CN102776551A (en) * | 2012-07-04 | 2012-11-14 | 中国电子科技集团公司第四十一研究所 | Hard microstrip circuit electroplating fixture |
| CN103617962A (en) * | 2013-11-13 | 2014-03-05 | 中国电子科技集团公司第四十一研究所 | Substrate electroplating clamp |
| CN204237882U (en) * | 2014-11-12 | 2015-04-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | Many size compatibilities single-wafer electroplating clamp |
| CN205152380U (en) * | 2015-11-28 | 2016-04-13 | 石家庄海科电子科技有限公司 | Anchor clamps that substrate single face was electroplated |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105603497A (en) * | 2016-03-14 | 2016-05-25 | 武汉欧普兰光电技术股份有限公司 | Semiconductor wafer electroplating clamping device, clamping method and electroplating process thereof |
| CN105603497B (en) * | 2016-03-14 | 2018-09-11 | 武汉欧普兰光电技术股份有限公司 | A kind of semiconductor crystal wafer plating clamping device, clamp method and its electroplating technology |
| CN110820033A (en) * | 2019-12-19 | 2020-02-21 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Sputtered ceramic substrate electroplating hanger and clamping method thereof |
| CN115637481A (en) * | 2022-11-16 | 2023-01-24 | 苏州太阳井新能源有限公司 | Photovoltaic cell electroplating equipment |
| CN115637481B (en) * | 2022-11-16 | 2023-09-29 | 苏州太阳井新能源有限公司 | Photovoltaic cell piece electroplating equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205152380U (en) | Anchor clamps that substrate single face was electroplated | |
| CN105350059A (en) | Clamp and method for single surface electroplating of substrates | |
| CN205529113U (en) | Clamping device is electroplated to semiconductor wafer | |
| CN100407503C (en) | Terminal and its electroplating method | |
| CN102776551B (en) | A kind of hard microstrip circuit electroplating clamp | |
| TW200601917A (en) | Method for fabricating electrical connection structure of circuit board | |
| CN104047036B (en) | Copper plating solution and production and preparation method thereof | |
| CN102011154A (en) | Gold plating solution for plating gold finger on circuit board | |
| CN103617962B (en) | A kind of substrate electroplating clamp | |
| CN206498004U (en) | Mancarried electronic aid charging inlet corrosion-resistant coating structure | |
| CN203120290U (en) | Ceramic copper-clad plate | |
| CN102055099A (en) | Electric connector terminal and electroplating method thereof | |
| CN206308443U (en) | Electrochemical electrode fixing device | |
| CN202231951U (en) | Pinboard capable of preventing electroplated soft gold on PCB from being punctured in electric test | |
| CN208136371U (en) | A kind of plating clamping device | |
| CN203689950U (en) | Tin-plated copper-plated steel flat wire used for electric power transmission | |
| CN107249257A (en) | The IC support plate preparation methods of novel environment friendly | |
| CN209210954U (en) | A kind of micro- plating prosthetic device of biplate shape parallel pole relay connector conductive plane | |
| CN103515487A (en) | Method for manufacturing ceramic package substrate used in light-emitting wafers | |
| CN112770541A (en) | Processing method for improving surface roughness of flexible circuit board and flexible circuit board | |
| CN208791807U (en) | A kind of potsherd metallization electroplating clamp for microwave chip components and parts | |
| CN201477968U (en) | Novel carbon fiber lead | |
| CN103560158B (en) | A kind of avris type high concentration solar thermoelectricity is separated receiver | |
| CN218951534U (en) | Multi-point conductive wafer electroplating tool | |
| CN102905459A (en) | Blue adhesive for gold plating of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160224 |
|
| WD01 | Invention patent application deemed withdrawn after publication |