JPS5963800A - Device for producing mounting printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting printed circuit board manufacturing apparatus U, the purpose of which is to produce a preparatory half III (-1
To provide an apparatus for manufacturing a mounting board 1 to a board capable of uniformly cutting lead wires across the board 1 to the sheet metal without performing any damage, the present invention has features for achieving this purpose. This configuration involves inserting the electronic component lead wires from the printed board side into the printed board and the board that are twisted together, and then pressing the printed board onto the printed board. Press the board toward the board, and sandwich the board with the electronic component lead wire inserted between the print temporary press and the board.
(J) Cutting the lead wire protruding from the back side of the board in the closed state.

Next 1. J.
I will explain.

J in Figure 1: Connect the lead wire 3a of the electronic component 3 from the printed board 1 side to the printed board 1 and the board 2 which are screwed together.
At the same time, the printed circuit board 1 with the lead wire 3a of the electronic component 3 inserted is pressed between the print temporary press 4 and the board 2 by pressing the printed circuit board 1 to the board 2 side with the print temporary press 4. In the pinched state, the lead wires 3a protruding from the back surface of the board 2 are cut by the cutting blade 5, followed by soldering (=Jl) to produce a product. .

The pudding 1 to the plate holder 4 are equipped with an electronic component 3 having a lead wire 3a inserted into the plate 1 to the pudding 1, or a cushioning material 4a that wraps the electronic component 3 and the pudding 1 to the plate 1 and presses it against the board 2. ing. Further, the print temporary presser 4 presses the prints 1 to the board 1 against the board 2, and is equipped with means for moving and releasing the prints 1 to 1 to the board 2, for example, a descending PIT mechanism. Substrate 2 (, 1 is formed of a flat metal plate, etc., and holes slightly larger than one lead wire diameter are bored at the lead wire hole positions and phase +L/r- of pudding 1 to board 1, and the lead wire It has a long thickness.

On the back side of the board 2, there is a flat blade or a rotary blade J: Beating shearing force 5
slides to cut the lead wire 3a protruding from the back surface of the board 2. 6 is a board stopper.

In addition, the competition hair that does not show the board and the board to the pudding 1 that are tied together! It is also possible to place the lead wire on the holder and run it, and automatically cut off the extra length of the lead wire pressed against the print/temporary press in the middle of the process.

In order to manufacture conventionally mounted printed circuit boards, it was
As shown in Publication No. 3747, after inserting the lead wires of a large number of electronic components into a printed board and immersing them in a solder bath to perform preliminary flat soldering, the mounted printed board is rotated. The lead wire was moved parallel to the blade while maintaining the lead wire cutting length interval, and the extra length of the lead wire was pushed and cut by the rotary blade, and then soldering was performed to form a product.

Therefore, half Lu is applied twice before and after the lead wire VJ is cut.
Soldering requires a process and is unsuitable for mass production.Besides, before mounting the parts and cutting the lead wires, the board is dipped in a soldering bath for preliminary soldering, so the excess lead length is Because there are half-days (J-W) and solder icicles on the wires, half-01 bridges and solder icicles are likely to form, which may cause a short circuit in the electrical circuit. In order to press the lead wires with the rotary blade, move the printed board to the solder part A.
There is also a risk of floating, peeling, and cranking.

2L, pudding 1 ~ By hand-fitting and installing a jig plate with lead wires passing through the back side of the plate, the lead wires can be cut to a uniform length using the thickness of the jig plate. A flexible one was proposed in Japanese Patent Publication No. 19789/1978. Because it requires preliminary half-ul fjj work before cutting, it is not suitable for mass production as in 1 and 6 above. The influence of the culm, which becomes the doll's pudding 1 to plate, is noticeable in these.

However, in the present invention, 1, the lead wires of the electronic components are inserted into the printed board and the board that are stacked on each other from the printed board 1 to the board side, and the board is pressed against the printed board 1 toward the printed board side using a print temporary press. , Cut the lead wire protruding from the back side of the board by holding the printed board with electronic component lead wires inserted between the board holder and the board. Before cutting the lead wires. Spare solder (=J can be applied to the entire surface of the printed board without any damage.) You can cut the re-lead wires to uniform lengths beautifully in a short time, and since the printed board is pressed against a rigid board, it will not warp. This means that the lead wire can be cut to an even length over the entire surface using the board 1.
], there is no extra length of lead wire, so half-in icicles and half-Ill bridging cannot be done, and half-in (
There is no pressure or vibration at the base of the plate, and you can finish the board with high reliability and beautiful mounting. Moreover, since the spare half III step is omitted, it becomes a device suitable for mass production.

[Brief explanation of drawings]

1 and 2 are cross-sectional views of the proposed device. 1...Print 1~board 2...board 33...electronic r
Part 4...Print temporary holding procedure amendment (method) Kazuo Wakasugi, Commissioner of the Japan Patent Office1, '1 display 1981 Load: '1 Application No. 46836 2 Name of invention Mounted printed board manufacturing device 3. Person making the amendment Patent applicant Address: 2-6 Ibarame, Aizaki-shi @27 Name: M-D-K Co., Ltd. 4. Agent: 5: Date of amendment order: October 25, 1980 Date of dispatch: 71 Schiff; Engraving of the statement of contents of the amendment (no change in contents)

Claims (1)

[Claims] This method omits the 11 steps of "1" which is done before cutting the lead wires.
': Insert the wire and place J stiffness 1 on the pudding 1~board presser.
Print 1 ~ Push the board towards the IJ board side J;L L, press the 111 lead wires of electronic components onto the Print 1 ~ board with the Print 1 ~ plate holder and the board in a clamped state - C board A mounting printed board manufacturing apparatus characterized in that the lead wire protrudes from the back surface of the board.