JPH0548297A - Method and apparatus for lead-wire cutting of board - Google Patents

Abstract

PURPOSE:To provide the lead-wire cutting method, of a board, and its apparatus wherein a lead wire protruding to the lower part from the board on which a mounting component provided with the lead wire called a long pin can be cut without performing a temporary soldering and with out requiring a manual operation such as cutting operation by means of nippers or the like and the lead wire can be cut precisely to a desired length. CONSTITUTION:An insertion plate 4 composed of a soft material is placed under a board 1; lead wires 3 are inserted into lead-wire insertion holes ion the board 1 and into the insertion plate 4 from the surface side of the board 1; mounting components 2 are fixed to the board; lead-wire protruding under the board 1 are cut to a definite size. When the lead wires 3 are cut, the many mounting components 2 are simultaneously pressed and fixed elastically from above and the lead wires are then cut. A pressure member 12 for pressure and fixation use is installed in a cutting apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting method and a device for cutting a lead wire when a component is soldered to a board such as a printed board.

[0002]

2. Description of the Related Art Conventionally, components mounted on a substrate such as a printed circuit board have a mixture of components called short pins and long pins depending on the length of a lead wire. However, in the jet tank used for soldering, the solder jet height is about 5 mm and the long pin length is 50 mm.
Therefore, when a long pin component is used, it cannot be used in a jet tank because of the long length of the pin.

Therefore, the following two methods have been conventionally used. That is, this is a method in which the long pin lead wire extending from the substrate on which the component is mounted is cut with a nipper and then soldered in a jet tank. Another method is to perform temporary soldering for temporarily fixing the lead wires in a stationary tank after mounting the components on the board, and then, for example, the applicant of the present application has filed a patent and has already acquired the right. There is a method of cutting to a desired cutting leg length of 2 mm, 4 mm, etc. with a rotary cutter as shown in No. 26782, and then performing soldering in a jet tank. The reason for fixing it with temporary solder before cutting with a rotary cutter is that if it is not fixed in advance, the lead wire will wobble and accurate cutting with the cut legs aligned will not be possible. As for the frequency of use, about 90% of the first method is performed by using a nipper, and 10% of the second method is performed by temporary soldering in advance.

[0004]

However, the first method of cutting with a nipper does not require temporary soldering as with the second method, but it is costly because it depends on human labor, and cutting is performed. An accident such as a lead wire flying off and hitting the operator's eyes has occurred. On the other hand, the second method requires temporary soldering to prevent the lead wires from wobbling during cutting when using a rotary cutter. That is, soldering is required twice, resulting in high cost. Further, even if temporary soldering is performed in advance and then soldering is performed, the cutting is performed with the cut legs of 2 mm, 4 mm, etc. left, so that there is a drawback that precision cutting cannot be performed due to wobbling of the cut legs. Further, when the rotary cutter is used, the lead wire and the entire component are lifted up by the reaction of the rotation of the rotary cutter immediately after cutting, and there is a drawback that accurate cutting cannot be performed.

In addition to the above method, there is a method using a robot for soldering. This does not require the work of cutting the lead wire of the long pin as described above, but the types of parts that can be used are limited, and industrial products cannot be used because there are few dots. Therefore, it cannot be used for general purposes, and as a result, the work of cutting the lead wire as described above is required. Therefore, the present invention does not require provisional soldering to cut the lead wire protruding downward from the substrate on which the mounting component having the long pin is mounted, and can be performed without the need for manual labor. Another object of the present invention is to provide a method and apparatus for cutting a lead wire of a substrate, which is capable of precisely cutting a cut leg having a desired length.

[0006]

A method of cutting a lead wire of a substrate according to the present invention which solves the above-mentioned problems is as follows.
The insertion plate 4 made of a soft material into which the lead wire 3 can be inserted and inserted is superposed on the back surface side of the substrate 1 in which the lead wire insertion hole 1a is formed, and the lead wire difference of the substrate 1 from the front surface side of the substrate 1 is overlapped. The lead wire 3 of the mounting component is inserted into the insertion hole 1a and the insertion plate 4, and the mounting component 2 is mounted and fixed on the substrate.
Secondly, the protruding end of the lead wire on the back surface of the substrate is cut to a certain size. Secondly, the lead protruding below the substrate 1 formed by inserting the lead wire 3 of the mounting component 2 into the substrate 1 is inserted. When the wire 3 is cut, a large number of mounting components 2 are simultaneously pressed and fixed from above, and thirdly, the back surface of the substrate 1 in which the lead wire insertion holes 1a are formed. The insertion plate 4 made of a soft material into which the lead wire 3 can be inserted and inserted, and the lead wire insertion hole 1a of the substrate 1 and the lead of the mounting component 2 on the insertion plate 4 from the front side of the substrate 1 Insert the wire 3 to mount and fix the mounting component 2 on the board,
The present invention is characterized in that a lead wire projecting end on the back surface of the substrate 1 is cut to a predetermined size while simultaneously pressing and fixing a large number of mounting components 2 from above. Substrate 1 in which lead wire 3 of mounting component 2 is inserted
In the cutting device for cutting the lead wire 3 projecting downward, a pressing member 12 for elastically pressing and fixing a large number of mounting components 2 simultaneously from above when the lead wire 3 is cut is provided. is there.

[0007]

In the present invention, the insertion plate 4 is superposed on the back surface side of the substrate 1, and since the insertion plate 4 is made of a soft material that can be inserted and inserted, the lead wire of the substrate is inserted from the front surface side of the substrate. The lead wire 3 of the mounting component 2 is inserted into the hole 1a and the insertion plate 4, the mounting component 2 is mounted and fixed on the substrate 1, and the protruding end of the lead wire on the back surface of the substrate 1 is cut to a predetermined size.
In addition, the lead wire 3 of the mounting component 2 protruding below the substrate 1
At the time of cutting, a large number of mounting components 2 are pressed and fixed simultaneously from above. Furthermore, both methods described above are used in combination. Further, in the case of the lead wire cutting device, in the cutting device that cuts the lead wire 3 protruding below the substrate 1 formed by inserting the lead wire 3 of the mounting component 2 to the board 1, the lead wire 3 is cut upward when the lead wire 3 is cut. Presser member 1 for more elastic pressing and fixing
Since the holding member 12 is provided, the holding member 12 prevents the mounting component 2 from being lifted up due to a reaction at the time of cutting.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. First, as shown in FIG. 1, the lead wire is cut by placing the printed circuit board 1 on a plate member 4 made of expanded polystyrene as an insertion plate having a thickness of a desired length of the lead wire to be cut and closely contacting it. Then, the lead wire 3 of the mounting component 2 is inserted from the upper surface of the printed board 1 into the lead wire insertion hole 1a of the printed board 1, and as shown in FIG.
Is formed so as to penetrate the lead wire insertion hole 1a and the plate member 4 and project downward, and the printed board 1, the mounting component 2, and the plate member 4 are formed.
Forming a block 5 consisting of

Then, the block 5 is attached to a cutting device and cut by a rotary cutter 6 of the cutting device as shown in FIG. That is, the block 5 is replaced with the rotary cutter
As shown in FIG. 4, the cut surface is adjusted and attached so as to pass through the bottom surface of the plate material 4, and cut along the bottom surface of the plate material. The lead wire of the component shown in this embodiment is called a long pin, and the length of the lead wire is about 50 mm. It cannot be used in the jet bath for soldering as it is, and therefore it needs to be cut. .. After the cutting, if the plate material 4 is removed, the printed board on which the lead wire 3 has been cut can be easily obtained.

Here, the plate member 4 used is made of a polystyrene foam material which is usually commercially available and used, and the protruding length from the bottom surface of the printed circuit board 1 is, for example, 2 mm.
If mm is desired, the thickness S of the plate member 4 is 2 mm.
To the thickness of.

If the lead wire is cut as described above,
Conventionally, the lead wire of the mounted component is inserted into the lead wire insertion hole of the printed circuit board and the nipper is manually cut by hand, or temporary soldering is performed in advance in a stationary tank to print the lead wire and the lead wire. The board was fixed and cut with a cutter, but such manual work is not necessary and preliminary soldering is not necessary.

In particular, when the rotary cutter is used as in this embodiment, the temporary soldering is conventionally performed as described above, and the cut surface of the rotary cutter 6 is the printed circuit board 1 as shown in FIG. Although it was cut at a predetermined distance from the bottom, although the bottom of the printed circuit board 1 and the lead wire 3 are fixed by the solder 7 on the upper side, the lead wire below the portion fixed by the solder is fixed. Therefore, the lead wire 3 wobbles when it is cut by the rotary cutter 6, and precise cutting is impossible. If cutting is performed along the bottom of the plate material 4 as in the present embodiment, the necessary portion of the lead wire protruding downward from the printed circuit board 1 is the plate material 4.
Since it is embedded and fixed inside, there is no wobbling,
Precise cutting can be performed.

In the above embodiment, a method of preparing a styrofoam plate material having a desired lead wire thickness, cutting along the bottom surface of the plate material, and not cutting the styrofoam plate material itself was shown. , It is also possible to use a plate material that is sufficiently thicker than the desired length and cut the Styrofoam plate material at the same time, so that there is no need to prepare a Styrofoam plate material having various thicknesses. .. In addition, in the above-mentioned embodiment, the plate member 4 has been described as being made of styrofoam, but it is also possible to use paper or a synthetic wood material.

Further, when the lead wire is cut by the rotary cutter, the lead wire above the cut surface is pushed upward immediately after cutting by the rotational force of the rotary cutter, and the position of the component cannot be stabilized. Therefore, what is provided is the cutting device shown in FIG. 6 and FIG.
An elastic pressing member 1 such as a sponge for the lid 11 of 0
2 is provided, and when the lid 11 is closed at the time of cutting, the holding member 12 holds the mounting component 2 on the printed circuit board 1 from above, so that the position of the component can be ensured, and in particular, the height, size, and shape of the component can be ensured. It is possible to equally press and fix the mounted parts having different characteristics. In addition, since this pressing member is provided with the sponge-shaped uneven portion 13 at the bottom, it is possible to more securely fix the components. Furthermore, by using an elastic brush as the pressing member, it is possible to reliably press the respective mounting components even if the mounting components have different heights and shapes.

Further, in FIGS. 6 and 7, the insertion plate 4 is used together with the pressing member 12, but a strong pressing force is applied to each mounted component by the elastic pressing member such as a brush. For example, there is no blur during cutting, and there is no problem in the method without using the insertion plate 4.

[0016]

Since the present invention is configured as described above, the following effects can be obtained. (1) The lead wire protruding downward from the board on which the mounting component having the long pin is mounted can be cut by the rotary cutter without temporary soldering for fixing the lead wire to the board. Therefore, soldering is required only once, and the cost can be reduced. (2) Since cutting with a nipper is not required manually as in the prior art, labor costs are not incurred, and the lead wire cut by the nipper does not fly and an accident that hits the eyes does not occur. (3) Since the lead wire projecting downward from the substrate is embedded and fixed in the insertion plate made of foam material or the like, there is no wobbling at the time of cutting and precise cutting can be performed. (4) In the cutting method and the cutting device according to the present invention, since the mounted component is pressed from above during cutting, it is possible to prevent the mounted component from moving upward due to the rotational force of the rotary cutter. Done. In addition, if the mounting component is pressed from above, cutting will not be hindered without using the insertion plate.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state before a lead wire is inserted.

FIG. 2 is a perspective view showing a state before a lead wire is inserted.

FIG. 3 is a perspective view showing a state at the time of cutting.

FIG. 4 is a front view showing a state at the time of cutting.

FIG. 5 is a front view showing a conventional state during cutting.

FIG. 6 is a perspective view showing a cutting device.

FIG. 7 is a front view showing a cutting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Mounting parts 3 Lead wire 4 Plate material 5 Block 6 Rotating cutter 10 Cutting device 11 Lid part 12 Holding member 13 Uneven part

Claims (4)

[Claims] 1. An insertion plate (4) made of a soft material, into which a lead wire (3) can be inserted and inserted, is superposed on the back surface side of a substrate (1) having a lead wire insertion hole (1a) formed therein, From the front surface side of the substrate (1), the lead wire insertion hole (1
Insert the lead wire (3) of the mounting component (2) into a) and the insertion plate (4), mount and fix the mounting component (2) on the substrate, and fix the protruding end of the lead wire on the back surface of the substrate (1). A method of cutting a lead wire of a substrate, which is characterized by cutting to a certain size. 2. When cutting the lead wire (3) protruding downward of the board (1) which is formed by inserting the lead wire (3) of the mounting component (2) to the board (1), the elastic force is applied from above. 1. A method of cutting a lead wire of a substrate, which is characterized in that a large number of mounting parts (2) are simultaneously pressed and fixed. 3. An insertion plate (4) made of a soft material, into which a lead wire (3) can be inserted and inserted, is superposed on the back surface side of a substrate (1) having a lead wire insertion hole (1a) formed therein, From the front surface side of the substrate (1), the lead wire insertion hole (1
a) Insert the lead wire (3) of the mounting component (2) into the insertion plate (4) to mount and secure the mounting component (2) on the board, and elastically mount a large number of mounting components (2) from above. A method for cutting a lead wire of a substrate, characterized in that the projecting end of the lead wire on the back surface of the substrate (1) is cut to a predetermined size while simultaneously pressing and fixing. 4. A cutting device for cutting a lead wire (3) projecting below a substrate (1), which is obtained by inserting a lead wire (3) of a mounting component (2) to a board (1). A lead wire cutting device for a substrate, comprising: a pressing member (12) for elastically pressing and fixing a large number of mounting components (2) from above at the time of cutting (3).