JPS5963794A - Method of fixing conductor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] This invention provides a method for fixing conductors for a simple test/prototype board instead of a printed cutting board when assembling a prototype electronic circuit, rather than making a printed board from scratch. This is related to.

Conventionally, for this type of purpose, there are boards with a general-purpose printed pattern in advance, and perforated boards with copper foil for inserting elements such as resistors, capacitors, and semiconductors. .

However, since this type of device requires a wiring route that is completely different from the actual printed pattern, it can be used for simple functional testing and single-piece prototyping, but it can be used as a reference for printed circuit boards for mass production. It couldn't be. For this reason, after the function test, it is necessary to take a step to confirm the performance of the prototype pudding 1 board using a pattern similar to the one used in the production 9. L/Rubble, which did not appear at all on the prototype board, occurred due to the change to the pudding 1 board. , the pattern often had to be changed again and again. Particularly in high-frequency circuits, the presence of copper foil for mounting elements and unnecessary copper foil wiring paths affected the circuit, and printed circuit boards were often used from the functional testing stage.

This invention improves the above-mentioned drawbacks by using resistors, capacitors,
In the substrate 2 on which the element l such as a semiconductor is mounted fτ1,
When at least the surface portion of the substrate 2 from which the conductive end 3 of the element 1 protrudes is brought into contact with a synthetic resin that is softened at the melting temperature of the solder, such as a synthetic resin such as polyamide or polypropylene, that is, the melting temperature of the solder is touched. It uses a synthetic resin that deforms but does not burn.

The melting temperature of solder can be changed depending on the composition and additives used when making the alloy, so it is possible to freely manufacture solder that matches the temperature characteristics of the synthetic resin, and the soldering iron 5 can also be used with solder or synthetic resin using a temperature controller. Since the temperature can be maintained constant, the temperature characteristics of the synthetic resin, solder, and soldering iron can be adjusted freely.

In addition, the entire board 2 may be made of synthetic resin if the melting temperature of the solder is close to the softening temperature of the synthetic resin, and if strong fixation of the element l to the board 2 is required, phenolic resin may be used. A thin synthetic resin (film) may be provided on a substrate made of synthetic resin such as epoxy.

The conductor fixing method of the present invention is to solder the solder-plated wire 4 soldered to the conductive end 3 of the element 1, preferably a twisted wire rather than a solid wire, using a soldering iron 5.
The synthetic resin is softened by being melted and pressed against the surface of the substrate 2, and the solder-plated wire 4 is fixed to the surface of the substrate 2 as the synthetic resin hardens.

Therefore, the conductor wire can be fixed on the board 2 by bending the solder-plated wire 4 freely and pressing it against the surface of the board 2 with a soldering iron 5, following the pattern of a printed bag designed for 14M production. Furthermore, since the distance between the conductor wires can be placed close together, the mounting density of the elements is almost the same as that of a mass-produced printed circuit board, and the pattern whose performance has been confirmed using this conductor fixing method can be directly mounted on a mass-produced printed circuit board. It has become possible to put it into practical use without any trouble.

In addition, as a structure for attaching the element 1 to the substrate 2, a copper foil is pasted on a phenol-based or epoxy-based synthetic resin board, a synthetic resin board with predetermined properties is provided on top of this, and a mounting plate provided on the copper foil part is attached.
= Protrude the conductive end 3 of the element l from the hole 1, and use the soldering iron 5
This is done by softening the synthetic resin layer and soldering it directly to the copper foil. If the solder and synthetic resin have good adhesion, copper foil is not used and the conductor of the element protruding from the first hole is
Any method of applying solder directly to the end 3 and directly fixing it with a hardened synthetic resin can be used.

Furthermore, if a stranded wire is used as the bank plated wire 4, it can be handled in the same way as a solid wire due to the solder applied, and when the solder is melted with the soldering iron 5, it can be bent freely at the melted part. This allows for excellent adaptability to patterns with complex shapes.

As described above, the method of the present invention provides excellent operational performance that cannot be obtained with conventional prototype boards, and allows a board with mounted elements to be completed in a short period of time in a form that is very close to the actual state. be. Furthermore, if a predetermined performance can be achieved with this board, nearly perfect reproducibility can be obtained in mass-produced printed circuit boards, so it is a practical invention that can significantly shorten the development period of devices.

[Brief explanation of drawings]

The figure is a sectional view of the main part during the conductor fixing work according to the method of the present invention. ■...Element 2...Substrate 3...
...Conductive end of element 4...)...Hunter Meggi M
, 5...---Hunter Kote Tokkyo Applicant
Takehisa Yashima

Claims (1)

[Claims] In a substrate 2 on which an element 1 such as a resistor, a capacitor, or a semiconductor is mounted, at least the surface portion of the substrate 2 from which the conductive end 3 of the element 1 protrudes is softened at the melting temperature of the solder. The solder of the solder-plated wire 4 formed of resin and electrically connected to the conductive end 3 of the element ~r-1 is melted with a soldering iron 5 while softening the synthetic resin on the surface of the board 2, and the solder plating is performed. A method for fixing conductive wires on a board by fixing wires 4 to the surface of a board 2 with hardened synthetic resin.