JPS5963794A - Method of fixing conductor - Google Patents
Method of fixing conductorInfo
- Publication number
- JPS5963794A JPS5963794A JP17484482A JP17484482A JPS5963794A JP S5963794 A JPS5963794 A JP S5963794A JP 17484482 A JP17484482 A JP 17484482A JP 17484482 A JP17484482 A JP 17484482A JP S5963794 A JPS5963794 A JP S5963794A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- board
- synthetic resin
- substrate
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は電子回路の試作組立時に於て、始めからプリ
ント基板を作るのではなくて、プリント裁板に代る簡易
なテスト用・試作用基板の為の導線固定方法に係るもの
である。[Detailed Description of the Invention] This invention provides a method for fixing conductors for a simple test/prototype board instead of a printed cutting board when assembling a prototype electronic circuit, rather than making a printed board from scratch. This is related to.
従来この種の目的の為にあらかじめ汎用性あるプリント
パタ−ンを設けた基板とか、孔あき基板で抵抗・コンデ
ンサー・半導体などの素子を取1」ける為の銅箔を設け
たものなどがある。Conventionally, for this type of purpose, there are boards with a general-purpose printed pattern in advance, and perforated boards with copper foil for inserting elements such as resistors, capacitors, and semiconductors. .
しかしこの種のものは大際のプリントパターンとは全く
異なった配線路をとらざるを得ないことから、単なる機
能テスト・単品試作の為には利用できても、多量生産用
のプリント基板の参考にはなり得なかった。この為機能
テスト後、改めて試作のプリン1基板を作9火際に即し
たパターンによって性能確認する手順が必要で、試作基
板では全く現れなかっだl・ラブルがプリン1基板に変
更した為に起り、再々パターン変更しなければならない
ことが多かった。特に高周波回路などでは素子を取付け
る為の銅箔や不用の銅箔配線路の存在が回路に影響して
機能テストの段階からプリント基板を用いることも多か
った。However, since this type of device requires a wiring route that is completely different from the actual printed pattern, it can be used for simple functional testing and single-piece prototyping, but it can be used as a reference for printed circuit boards for mass production. It couldn't be. For this reason, after the function test, it is necessary to take a step to confirm the performance of the prototype pudding 1 board using a pattern similar to the one used in the production 9. L/Rubble, which did not appear at all on the prototype board, occurred due to the change to the pudding 1 board. , the pattern often had to be changed again and again. Particularly in high-frequency circuits, the presence of copper foil for mounting elements and unnecessary copper foil wiring paths affected the circuit, and printed circuit boards were often used from the functional testing stage.
上記の欠点を改善するこの発明は抵抗・コンデンサー・
半導体などの素子lが取fτ1けられる基板2に於て、
素子lの導電端3が突出する基板2の少くとも表面部を
、ハンダの溶融温度で軟化状態にある合成樹脂、例えば
ポリアミド系、ポリプロピレン系などの合成樹脂、即ち
、ハンダの溶融温度に触れると変形するがこげることは
ない、といった性能の合成樹脂を使用する。This invention improves the above-mentioned drawbacks by using resistors, capacitors,
In the substrate 2 on which the element l such as a semiconductor is mounted fτ1,
When at least the surface portion of the substrate 2 from which the conductive end 3 of the element 1 protrudes is brought into contact with a synthetic resin that is softened at the melting temperature of the solder, such as a synthetic resin such as polyamide or polypropylene, that is, the melting temperature of the solder is touched. It uses a synthetic resin that deforms but does not burn.
尚、ハンダの溶融温度は合金を作る時の配合や添加物に
よって変化できるから、合成樹脂の温度特性に合ったハ
ンダを自由に製造することができ、ハンダゴテ5も温度
コントローラによってハンダや合成樹脂と合った温度に
一定に保つことができるから、合成樹脂・ハンダ・ハン
ダゴテの温度特性を自由にそろえることができる。The melting temperature of solder can be changed depending on the composition and additives used when making the alloy, so it is possible to freely manufacture solder that matches the temperature characteristics of the synthetic resin, and the soldering iron 5 can also be used with solder or synthetic resin using a temperature controller. Since the temperature can be maintained constant, the temperature characteristics of the synthetic resin, solder, and soldering iron can be adjusted freely.
また基板2はハンダの溶融温度と合成樹脂の軟化始める
温度とが近いものは基板2全体をこの合成樹脂で形成し
てもよく、素子lの基板2へ強度ある固定が必要な時は
フェノール系、エポキシ系などの合成樹脂で形成する基
板上に薄い合成樹脂(膜)を設けたものでよい。In addition, the entire board 2 may be made of synthetic resin if the melting temperature of the solder is close to the softening temperature of the synthetic resin, and if strong fixation of the element l to the board 2 is required, phenolic resin may be used. A thin synthetic resin (film) may be provided on a substrate made of synthetic resin such as epoxy.
この発明の導線固定方法としては素子1の導電端3にハ
ンダ接続したハンダメッキ線4、望ましくは単線よりも
撚線によるハンダメッキ線4のハンダを、ハンダゴテ5
にて溶融させつつ基板2表面に押付けて合成樹脂を軟化
させ、該ハンダメッキ線4を合成樹脂の硬化にともない
基板2表面に固定させていくものである。The conductor fixing method of the present invention is to solder the solder-plated wire 4 soldered to the conductive end 3 of the element 1, preferably a twisted wire rather than a solid wire, using a soldering iron 5.
The synthetic resin is softened by being melted and pressed against the surface of the substrate 2, and the solder-plated wire 4 is fixed to the surface of the substrate 2 as the synthetic resin hardens.
従って多14M生産を想定したプリントバクーンになら
って、ハンダメッキ線4を自由に曲げ、ハンダゴテ5で
基板2表面に押付けていけば導線は基板2上に固定でき
る。また導線間の距離も接近し゛て取[jけることがで
きるから、素子の実装密度も多量生産用の基板とほとん
ど同一となり、この導線固定方法によって性能確認した
パターンは直接多量生産用のプリント基板に利用しても
ほとんどトラブルなく実用化できるようになった。Therefore, the conductor wire can be fixed on the board 2 by bending the solder-plated wire 4 freely and pressing it against the surface of the board 2 with a soldering iron 5, following the pattern of a printed bag designed for 14M production. Furthermore, since the distance between the conductor wires can be placed close together, the mounting density of the elements is almost the same as that of a mass-produced printed circuit board, and the pattern whose performance has been confirmed using this conductor fixing method can be directly mounted on a mass-produced printed circuit board. It has become possible to put it into practical use without any trouble.
尚、素子1を基板2に取付ける構成としてフェノール系
・エポキシ系の合成樹脂基板に銅箔を貼つけ、この上に
所定の性状の合成樹脂板を設け、銅箔部分に設けた取f
=1孔から素子lの導電端3を突出させ、ハンダゴテ5
で合成樹脂層を軟化させつつ直接銅箔にハンダづけして
同定する。ハンダと合成樹脂との接着性のよいものでは
銅箔を利用せず取ト1孔から突出した素子の導′C[〔
端3に直接ハンダを盛りあげ、硬化した合成樹脂で直接
固定するいずれの方式も利用できる。In addition, as a structure for attaching the element 1 to the substrate 2, a copper foil is pasted on a phenol-based or epoxy-based synthetic resin board, a synthetic resin board with predetermined properties is provided on top of this, and a mounting plate provided on the copper foil part is attached.
= Protrude the conductive end 3 of the element l from the hole 1, and use the soldering iron 5
This is done by softening the synthetic resin layer and soldering it directly to the copper foil. If the solder and synthetic resin have good adhesion, copper foil is not used and the conductor of the element protruding from the first hole is
Any method of applying solder directly to the end 3 and directly fixing it with a hardened synthetic resin can be used.
更にバンクメッキ線4として撚線を利用すれば通常時は
イ;[着したハンダによって単線と全く同様に取扱うこ
とができ、かつハンダゴテ5によってハンダがとけた状
態ではとけた部分で自由に曲げることができるから、複
雑な形状のパターンにも優れた適応性が生れるものであ
る。Furthermore, if a stranded wire is used as the bank plated wire 4, it can be handled in the same way as a solid wire due to the solder applied, and when the solder is melted with the soldering iron 5, it can be bent freely at the melted part. This allows for excellent adaptability to patterns with complex shapes.
以」二の様にこの発明の方法によれば従来の試作用基板
では得られない優れた操作性能があり、短時間で素子を
実装した基板が実用状態に非常に近い形で完成できるも
のである。またこの基板で所定の性能が得られれば、多
量生産用のプリント基板に於て完全に近い再現性が得ら
れるから、機器の開発期間が大巾に短縮できる実用性あ
る発明である。As described above, the method of the present invention provides excellent operational performance that cannot be obtained with conventional prototype boards, and allows a board with mounted elements to be completed in a short period of time in a form that is very close to the actual state. be. Furthermore, if a predetermined performance can be achieved with this board, nearly perfect reproducibility can be obtained in mass-produced printed circuit boards, so it is a practical invention that can significantly shorten the development period of devices.
図はこの発明の方法による導線固定作業時に於る要部断
面図である。
■・・・・・・素子 2・・・・・・基板 3・・・・
・・素子の導電端4・・)・・・ハンタ゛メッギM
、5 ・・・・−・ハンタ゛コ゛テ特凶°出願人
八 島 武 久The figure is a sectional view of the main part during the conductor fixing work according to the method of the present invention. ■...Element 2...Substrate 3...
...Conductive end of element 4...)...Hunter Meggi M
, 5...---Hunter Kote Tokkyo Applicant
Takehisa Yashima
Claims (1)
られる基板2に於て、少くとも素子lの導電端3が突出
する基板2の表面部を、ハンダの溶融温度で軟化状態に
ある合成樹脂にて形成し、該素〜r−1の電導端3と電
気的に接続したハンダメッキ線4のハンダを、ハンダゴ
テ5にて溶融させつつ基板2表面の合成樹脂を軟化させ
、該ハンダメッキ線4を基板2表面に硬化した合成樹脂
にて固定させてなる基板に於ける導線固定方法。In a substrate 2 on which an element 1 such as a resistor, a capacitor, or a semiconductor is mounted, at least the surface portion of the substrate 2 from which the conductive end 3 of the element 1 protrudes is softened at the melting temperature of the solder. The solder of the solder-plated wire 4 formed of resin and electrically connected to the conductive end 3 of the element ~r-1 is melted with a soldering iron 5 while softening the synthetic resin on the surface of the board 2, and the solder plating is performed. A method for fixing conductive wires on a board by fixing wires 4 to the surface of a board 2 with hardened synthetic resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17484482A JPS5963794A (en) | 1982-10-05 | 1982-10-05 | Method of fixing conductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17484482A JPS5963794A (en) | 1982-10-05 | 1982-10-05 | Method of fixing conductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5963794A true JPS5963794A (en) | 1984-04-11 |
Family
ID=15985639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17484482A Pending JPS5963794A (en) | 1982-10-05 | 1982-10-05 | Method of fixing conductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5963794A (en) |
-
1982
- 1982-10-05 JP JP17484482A patent/JPS5963794A/en active Pending
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