JPS5961197A - Device for removing flat ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flat IC removal device for removing a flat IC from, for example, a printed wiring board.

[Technical background of the invention]

As is well known, flat type 1. C is Figure 1a.

As shown in b, a plurality of connection terminals 1 are connected to opposite sides 111 and 112 of a package 11 formed in a substantially box shape.
2 protrudes from the conductive pattern l of the printed wiring board 13.
A connecting terminal 12 is brought into surface contact with 4 and soldered.

[Problems with background technology]

By the way, the flat type IC connected to the printed wiring board 13 as described above is removed from the printed wiring board 1 when it is replaced or repaired.
3, the connection terminal 12 and the conductive pattern 14 are in surface contact, so there is a problem that the solder cannot be sufficiently removed even with a solder sucker or the like, making the removal work difficult. In addition, in recent printed wiring boards 13, the conductive pattern 14 is formed extremely thin due to high-density packaging, so if you try to remove it forcibly, the conductive pattern 14 may be damaged. This also makes the removal work even more difficult.

[Purpose of the invention]

This invention was made in consideration of ``2 articles + 7 frogs''.
It is an object of the present invention to provide an extremely good flat-type IC removal device fM' that can easily and safely remove a flat-type IC with a simple configuration.

[Summary of the invention]

That is, the present invention provides a flat IC removal device for removing a flat IC formed by connecting a plurality of connection terminals protruding from opposite sides of a substantially box-shaped package to a supplementary base from a mounting base. A soldering tip that can be brought into contact with a plurality of connecting terminals and can heat the plurality of connecting terminals (a soldering tip to which a tool is attached), a soldering tip extending from a handle of the soldering tip, and a tip of the soldering tip capable of heating the plurality of connecting terminals; The device is characterized by comprising a pair of clamping members capable of clamping opposing sides of the connecting member from which the connecting member is not protruded.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. In FIG. 2, reference numeral 15 is a soldering iron, which has a wooden handle 16 and a heating tool 17 attached to the tip thereof. This heating tool 17 has a pair of heating pieces 171 and 172 arranged in parallel with each other. The spacing between these heating pieces 171 and 172 is such that the connection terminal 12 protruding from one side of the package 11 is connected to the conductive pattern 14.
The distance is made equal to the distance between the portion connected to the conductive pattern 14 and the portion where the connection terminal I2 protruding from the other side of the housing 11 is connected to the conductive pattern 14.

On the other hand, one end of each of a pair of clamping members 18 and 19 is attached to the handle portion 16 of the soldering tip 15. The other end portions of the sandwiching portion sides 18 and 19 extend so as to face both side surfaces from which the connection terminals 12 of the i4 package 1 are not protruded, and extend in their respective extending directions. The tip has a locking part 181°1° bent inwardly.
9 nos are formed respectively. Furthermore, the sandwiching member 1
8,191'i elasticity, and when pressed in the direction of the arrow in FIG. 2 by an external force, a restoring force is generated to return to the original state.

When the flat type Ic is removed from the printed wiring board 13, as shown in FIG.
172 to each of the connection terminals 12 to melt the solder, and push the sandwiching members 18 and 19 in the direction of the arrow in FIG. let At this time, both sandwiching members 18°1
The locking portions 181 and 191 of 9 are locked to the lower downward slope in FIG. Therefore, by lifting the soldering iron 15, the flat IC is removed from the printed wiring board 13.

Therefore, according to the configuration of the above embodiment, the connecting terminals 12 are heated all at once by the heating pieces 171 and 172 to melt the solder, and the flat type iC is lifted by the sandwiching members 18 and 19, so that it is easy to remove it. 7 operations can be performed extremely easily, and damage to the conductive wire turn 14 can also be prevented.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be implemented with various modifications without departing from the gist thereof.

〔Effect of the invention〕

Therefore, as described in detail above, according to the present invention, it is possible to provide an extremely effective flat-type IC removal device that can easily and safely remove a flat-type IC with a simple configuration.

[Brief explanation of drawings]

FIGS. 1a and 1b are a plan view and a side sectional view showing a state in which a flat IC is connected to a printed wiring board, respectively, and FIG. 2 is a perspective view showing an embodiment of a flat IC removing device according to the present invention. , 3rd V is an explanatory diagram of the same embodiment. 11...Package, 12...Connection terminal, 13...
・Printed wiring board, 14... Conductive/yaturn, 15 Soldering iron, 16... Handle, 17... Heating tool, '18.1
9...Pinching member.

Claims (1)

[Claims] A flat IC formed by connecting a plurality of connection terminals protruding from opposite sides of a substantially box-shaped package to a mounting base.
In a flat type IC removal device for removing a IC from the mounting base, a solder tip is attached with a heating tool that comes into contact with the plurality of connection terminals and can heat the plurality of connection terminals;
a pair of clamping members extending from the handle of the "half H" and capable of clamping opposing sides of the package from which the connection terminals are not protruded at the distal end thereof; Features: Flat IC removal device.