JPS5961195A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing printed wiring boards, and in particular, to rationally manufacture printed wiring boards of various types and in small quantities by carefully considering circuit design information and required number of sheets for each type. The present invention relates to a fully automatic manufacturing method for printed wiring boards that can be manufactured.

Conventional printed wiring board manufacturing methods include the etched foil method (subtractive method), in which a copper foil-clad laminate is used as a starting substrate and unnecessary copper foil is etched away to form a conductive circuit pattern; There is an additive method in which a starting substrate is used and the required areas are chemically plated with copper or electroplated on top of the substrate to directly form a conductive circuit pattern.

In the conventional printed wiring board manufacturing method using Towara's technology, a plurality of printed wiring boards of the same type are arranged on multiple sides on a large starting board, and then the desired board is manufactured from this starting board. The unit printed wiring board was cut out.

Printed wiring boards require high-mix, low-volume production.
Although the conventional methods described above are not sufficient to rationally meet this need, there is a very high demand for the development of a new production form that will also reduce manufacturing costs. There is.

In view of the above points, it is an object of the present invention to provide a method for rationally manufacturing printed wiring boards of various types and in small quantities.

In order to achieve this objective, the present invention uses a computer-aided computer (CAD) system to print a plurality of high-mix, low-volume unit printed wiring boards of different types onto each of a plurality of starting boards.
Using additive design technology, the unnecessary parts of the starting board can be rationally allocated to a minimum, and the well-known additive method is used to form the conductor circuit pattern, thereby streamlining the manufacturing process. It is.

Hereinafter, the present invention will be explained in detail using the flowchart shown in FIG.

[■] It is assumed that the following information has been given.

(a) Circuit role information 1 for each type of rectangular unit printed wiring boards (hereinafter referred to as unit wiring boards) of various types to be manufactured
and information on the required number of sheets 2゜(b) Dimensional information on a rectangular starting board of a predetermined size sufficient to make multiple sheets of the unit wiring board 3゜(c) Among the manufacturing processes of the unit printed wiring board In a predetermined step, a peripheral portion of the starting substrate (
For example, position information 4 of at least two board fixing through poles (for example, round holes with a predetermined diameter) of a predetermined shape to be provided at predetermined positions on the workbench (for example, both ends of one side of a rectangle). A bottle that can be inserted into the through hole is provided at a position corresponding to the position of the through hole for fixing the board]
Then, the bottle is inserted into the through hole, and the starting board is pressed from the peripheral side of the board to fix the board to the workbench. However, the through holes for fixing the board are not necessary, and the 11.11 board may be fixed to the workbench without the bin by other methods. ).

(d) In order to accurately bring the starting substrate fixed on the workbench to a predetermined processing position by moving and rotating the workbench in mutually perpendicular X and Y directions, At least two substrate alignment marks (for example, Location information of the + mark of the predetermined dimensions.

[Eye 1: Please enter the above information into the data processing device and perform the following processing.

(d) From the circuit design information of the unit wiring board for each type, the circuit pattern of the unit wiring board for each type and the position of the circuit connection through hole of a predetermined diameter are determined.

(b) From the circuit pattern information of the unit wiring board for each type designed in la above, determine the dimensions of the unit wiring board for each type.

(C) Said I1. Based on the dimensions of the unit wiring boards for each type obtained in step b and the required number of unit wiring boards for each type given in a, Unit wiring boards are arranged in a mixed manner, and at the same time they are laid out on multiple sides so that the unnecessary parts of each board are minimized.At the same time, each board (hereinafter, different layout is referred to as a board) has a different layout due to the layout. The required number of substrates with the same allocation (hereinafter, the same allocation will be referred to as substrates) and the different allocation are determined by the number of sets of substrates, and furthermore, the different allocation sets the processing order among the boards.

(d) The circuit pattern of the unit wiring board for each type determined by the IJa, the position of the circuit connection through-hole, and the IJa.
The above-mentioned heterogeneous layout obtained by I The position of a circuit connection through hole (hereinafter, the open side will be referred to as a circuit connection through hole) to be provided at a predetermined position of the pattern is determined.

[111] As described above, the take processing device outputs various pieces of information in advance to create an information recording medium like a queen.

(a) The positional information of the board alignment mark given in 1d above, the positional information of the through pole for fixing the board obtained in 1.18 above, and the different open side obtained in 11C above are the circuits for each board. The position information of the through pole for connection is shown in 11 above.
The different layouts made by C are outputted from the take processing device according to the processing order between the substrates, and an information recording medium 7 for controlling the NC drilling machine is created.

(1)) The position information of the board alignment mark given in 1 (1) above, the different open side obtained in 1.1 d above, the open side of each board, the circuit pattern information and JJ, C above. The obtained heterogeneous layout is outputted from the take processing device according to the processing order of the different types of substrates with information on the required number of sheets for each board added by +1c, and the layout creates the information recording medium 8 for circuit pattern formation.

(C) The heterogeneous layout obtained by the IJc is outputted from the take processing device according to the processing order between the boards, and the unit wiring board layout information and required number information for each board are outputted. An information recording medium 9 for controlling an NC cutter for cutting out a plurality of unit wiring boards allocated to each board from each board is created.

(d) The layout created in step 111b is transferred from the circuit forming information recording medium 8 to the board alignment mark using COM (copy/peater output microfilm technology), and the different layout is created for each board. The layout is a circuit pattern, and the different layout is an optically readable symbol (for example, an optically readable character or barcode) indicating the number of sheets required for each board.
The negative or positive image of the microfilm 1 is reduced at a predetermined reduction ratio according to the processing order of the substrate.
Create 0.

[I■] Next, the starting substrate is processed in the following order using the information recording medium 7 for controlling the NC drilling machine, the microfilm 10, and the information recording medium 9 for controlling the NC cutter.

(a) The starting board 11 is mounted in a predetermined arrangement on the workbench of the NC drilling machine 12, and the drilling machine 12 is driven by the command of the information recording medium 90 for controlling the NC drilling machine, and the board is aligned with the starting board 11. At the same time, the through-holes 14 for fixing the board and the through-holes 15 for connecting circuits are engraved according to the processing order of the different side + 1 board. Return the board alignment mark 13
, the fixing through hole 14, and the allocation is the required number of starting boards 15 having circuit connection through holes (not shown) (the different allocation is the required number of boards for each board x the different allocation is the number of sets of boards).

(b) The board alignment mark 16 and the board alignment mark 16 are placed on the surface of the starting board 15 obtained in IVd on which the board alignment mark 13 is engraved and on the inner surface of the through-hole for circuit connection of the single cutter of the board. Coat or apply a positive type photosensitive agent except for the edge part where the through hole 14 for fixing the board is located.
After drying, a starting substrate 17 having a photoresist film 16 on its surface is prepared.

In the present invention, a so-called additive method is used to form a conductive circuit pattern, in which a conductive metal is selectively deposited only at necessary locations to obtain a wiring circuit.

Representative examples of this circuit formation technology will be described below.

In addition to these techniques, other M(υ techniques) can be used in the present invention.

(1) Apply a mixture of palladium chloride and a photosensitive reducing agent (for example, stannous chloride) onto an insulating substrate, dry it, and...
This is then irradiated with ultraviolet light using a negative image of the circuit pattern to impart reducibility to the circuit pattern area and deposit palladium, which is then used as a catalyst nucleus for electroless plating to form a conductor circuit pattern (2) Insulation The surface of the substrate is treated with palladium chloride, a photosensitive resin is applied to this surface, and this is exposed and developed using a positive image of the circuit pattern to form a resist layer in areas other than the one circuit pattern. , the exposed palladium chloride is reduced, and a conductive circuit pattern is formed thereon by electroless plating.

(b) When a photosensitive resin film is provided on an insulating substrate and exposed to light using a positive image of a circuit pattern, the exposed area (hardens,
Unexposed areas remain uncured. After fixing the metal powder to this part using the adhesiveness of the uncured part corresponding to this circuit pattern, the uncured resin is cured by full exposure (-), and then electroless plating is performed on the metal powder. , a conductor circuit pattern is formed.In the above method, electroplating can be further performed on the electroless plating film.

The following steps will be explained using the method (6) above.

(C) The starting substrate 17 having the photosensitive resin film 16 obtained in IVb was placed on a workbench having the substrate fixing pin of the exposure machine 18, and the pin was inserted into the substrate fixing through hole 14. The upper limb substrate 17 is fixed by pushing it from one predetermined side, and the entire photosensitive resin film 16 is covered with a 7-layer coating, except for the portions of the substrate 17 where the fixing through holes 16 and the alignment marks 14 are located. . on the other hand,
The microfilm 10 is set in the exposure device 18, the magnification of the exposure device 18 is set to the reciprocal of the reduction ratio of the microfilm 10, and film feeding is started. The photosensitive resin film 16 on the microfilm 10 is not separated.
A predetermined frame of the microfilm 10 covered with a 7-yen tar is sent out and exposed, the substrate alignment mark on the microfilm is projected onto the starting substrate 17, and the workbench of the exposure machine 18 is After moving the microfilm 10 to visually match the projected image of the substrate alignment mark on the microfilm 10 with the alignment mark of the starting substrate on the workbench, the scanner is moved and the photosensitive A positive image of the circuit pattern is projected onto the resin film by the microfilm, and the exposed portion is cured. A starting substrate 20 that is left as is is created. Thereafter, such an operation of taking out the exposed starting substrate 20 from the exposure machine 18 is performed, and the different types of layout is repeated for the required number of substrates for each substrate according to the processing order of the substrates. The required number of starting boards 20 having a latent image of a circuit pattern is obtained.

Next, metal powder such as copper is spread and pressed onto the starting substrate 20, and the entire surface is exposed to light to harden the uncured resin. After removing and collecting the unbonded metal powder, If electroless 5M plating is performed, a required number of starting boards 22 having conductive circuit patterns 21 (indicated by diagonal lines) with predetermined divisions corresponding to the circuit patterns can be obtained.

(d) The starting board 22 with the conductive circuit on the surface obtained in (C) is placed on the workbench of the NC cutter 26 (fixed and aligned using the board fixing through-hole 14 in I). After that, the NC cutter 26 is driven by the NC cutter control information recording medium, and the layout is of a rectangle corresponding to the outline of the unit wiring laid out on the starting board 22 having the conductive circuit nositter 721. The necessary number of starting substrates 25 containing 240 pieces of metal molds having a predetermined external shape are prepared in accordance with a predetermined processing order.

Finally, by folding the starting board 25 containing the half-cut 24 at the half-cut portion, a required number of unit wiring boards of each predetermined type can be obtained.

As is clear from the detailed explanation above, when manufacturing printed wiring boards of various types and in small quantities upon receiving orders, the conventional method is lenient and manufactures each type individually, resulting in a lot of wasted starting boards. It has been difficult to efficiently allocate manufacturing for each product type for short delivery times, which tends to lengthen delivery times and increase costs.In contrast, the present invention can Considering the delivery time of the product, it is possible to mix a wide variety of products onto multiple starting boards and simultaneously manufacture them sideways to minimize unnecessary parts of the board, reducing delivery time and costs. It has the feature of being able to measure down.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a flowchart of the present invention. In the figure, 1...Circuit design information for each product type 2...Required number of sheets information for each product type 6...Dimension information of the starting board 4...Through hole position information for fixing the starting board 5...Starting board position Alignment mark position information 6...Data processing device 7...NC drilling machine control information recording medium 8...Circuit pattern formation information recording medium 9...NC cutter control information recording medium 10...Microfilm 11... Starting board 12... NC drilling machine 16
... Mark for substrate alignment 14 ... Through hole for fixing the board 16 ... Photoresist film 18 ... Exposure machine 19 ...
Portion 21 with circuit pattern latent image formed by metal powder...Portion 26 with conductor circuit pattern...NC canoter

Claims (1)

[Claims] 1. (a) Circuit division, information and required number information for each type of multi-product rectangular unit printed wiring board (hereinafter referred to as unit wiring board) to be manufactured, (b) Multi-faceted wiring of multiple units of the unit wiring board In order to accurately bring the fixed substrate to a predetermined position sufficient to increase the processing speed by moving the workbench in mutually perpendicular X and Y directions and rotationally moving the edge of the substrate to a predetermined processing position, It is assumed that the positional information of at least two predetermined shapes of substrate alignment marks to be provided in the above is stored in advance, and the various information is inputted into the data processing device, and (d) the above (8) is performed. From the circuit stage information of the unit wiring board for each product type obtained in step 2, determine the circuit pattern of the unit wiring board for each product type as well as the position of the through hole for circuit connection (e)
The unit wiring board times for each product type obtained in Ail (d) (
The position information of the board alignment mark obtained in step C), the above (
The open side of the different type obtained in g) is the open side of each board with the position information of the through hole for circuit connection, and the open side of the different type obtained in above (f) is the information of the required number of sheets for each board. The open side is outputted from the data processing device according to the processing order between the substrates to create an information recording medium for controlling the NC drilling machine.
1) The position information of the board alignment mark given in (C) above, and the different open side obtained in (g) above are divided for each board.
The circuit pattern information and the required number of sheets for each board for the different types of open sides obtained in (f) above are output from the data processing device according to the processing order of the boards, and the layout is determined by the circuits. Create an information recording medium for pattern formation,
(J) The heterogeneous layout obtained in (f) above is the information on the layout of unit wiring boards for each board, and the information on the required number of boards for each board on the heterogeneous open side obtained in (f) above. producing an information recording medium for controlling an NC cutter for outputting from the data processing device according to the processing order, and cutting out a unit wiring board from each of the substrates on the different open side; (k) The layout created in (1) above indicates the board alignment mark from the information recording medium for circuit pattern formation, the different type layout indicates the layout for each board, the circuit pattern, and the different type layout indicates the required number of sheets for each board. A microfilm is created by reducing the negative or positive image of the optical read symbol at a predetermined reduction ratio, and then (1) fixing the starting substrate in a predetermined position on the workbench of the NC drilling machine, and performing the steps described in (1) above. ) The drilling machine is driven by the information recording medium for controlling the NC drilling machine, which stamps the board positioning mark on the board, and also drills through-holes for circuit connection in the board. 5. Repeat this operation for the required number of boards for each board according to the processing order of the boards on the open side of the different types, and create the required number of starting boards having the board alignment marks and the through holes for circuit connection on the open side. death,
(m) The board alignment marks on the starting board created in (1) above (■) and the layout of the board are as follows: A negative or positive photoresist film is provided except for (1
)) The starting substrate with the photoresist film obtained in (1η) above was fixed with the photoresist film side up on the workbench of an exposure machine that can be moved and rotated at right angles to each other and in the Y direction. , the photoresist film is covered with a shutter, the microfilm is set in the exposure machine, and predetermined images of the microfilm are sequentially sent out, and the projected image of the substrate alignment mark on the microfilm and the After aligning the substrate alignment marks on the starting substrate by moving the workbench, the shutter is moved to expose the photoresist film with a negative or positive image of the circuit pattern on the microfilm; The operation of forming a conductor circuit pattern of a predetermined size on the starting board by a well-known additive method is repeated for the required number of sheets of the different type open side for each board according to the processing order of the board. For the layout, a predetermined number of starting boards having conductor circuit patterns are created, and (0) the above (n
) The starting board with conductor circuit ζ turns is fixed in a predetermined arrangement on the workbench of the NC cutter, and the NC cutter is driven by the information recording medium for controlling the NC cutter. The operation of inserting rectangular holes corresponding to the outline of the unit wiring boards allocated to the starting board with the circuit pattern is performed according to the processing order of the board. A method for manufacturing a printed wiring board characterized by repeated steps.