JPS596020B2 - Gas Hoden Panel Noseisaku Hohou - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an indirect discharge type gas discharge panel in which an electrode covered with a dielectric layer is faced to a gas discharge space, and particularly relates to a method for manufacturing an indirect discharge type gas discharge panel including an improved electrode manufacturing process. It concerns the manufacturing capabilities and methods of discharge panels.

In this type of indirect discharge type gas discharge panels (referred to as P, D, P), an electrode group is formed on the surface of a transparent glass substrate, and a transparent dielectric layer (I, F) is formed on the entire surface of the electrode group. (referred to as layers) are laminated.

This dielectric layer is made by applying a glass paste of specific components to the entire surface and firing it.

Currently, noble metals such as gold (Au) are used as electrode materials.

Conventionally, this type of noble metal electrode was formed by preparing a paste containing noble metal and glass material, applying this to P, D, and P substrates in a predetermined pattern by screen printing, and then firing the applied paste. .

In this case, the electrode is in close contact with the glass substrate due to its glass component.

By the way, according to the above method, the electrodes are formed by screen printing and baking a paste, so screen printing has a printing limit in thin lines, and the edges of the thin lines tend to bleed and spread due to baking, so there is a certain limit. It is difficult to form electrodes with the following precise fine line patterns.

However, an object of the present invention is to provide an electrode manufacturing method that can form gold electrodes with fine line patterns with extremely high accuracy.

In short, the present invention is a method for manufacturing an indirect discharge type gas discharge panel as described above, in which a titanium base layer is formed on a glass substrate, a gold vapor-deposited film is laminated thereon, and a photoresist having a desired pattern is laminated thereon. Then, a gold plating process is performed to stack a gold plating layer on the parts of the gold vapor deposited film exposed in the voids of the photoresist pattern, and then an electrode consisting of a titanium base layer, a gold vapor deposit film layer, and a gold plating layer is formed by an etching process, and the electrode is The present invention provides a method for manufacturing a gas discharge panel, which includes the steps of laminating and firing a dielectric paste to become a dielectric layer after firing in a vacuum.

According to the present invention, as shown in FIG.
First, a base layer of the vapor deposited film 2 of i) is formed, and gold (A
A vapor deposited film 3 of u) is formed.

Then, a thin line pattern is formed on the deposited film 3 using photoresist 4.
A gold plating layer 5 is formed in accordance with the gap pattern of the photoresist by applying gold plating thereon.

For this plating, for example, an electrolytic plating method using a gold cyanide solution can be applied.

When the photoresist is removed and the entire surface is immersed in a gold etching solution, both the gold vapor deposited film 3 and the gold plating layer 5 are etched, but since the gold vapor deposited film 3 is thin, the gold plating layer 5 is etched.
Only the area remains.

Subsequently, the Ti layer 2 is etched using this gold plating layer as a resist.

As a result, unnecessary material can be removed as shown by the dotted line in the figure, resulting in a Ti layer on the first layer. A vapor deposited layer of Au on the layer,
A thin line pattern electrode is formed by stacking a gold plating layer on the third layer.

In this method, the higher the patterning accuracy, the more precisely fine wire electrodes can be obtained.

By the way, since the gold plating layer has many voids, it will not become a good conductor unless it is fired.

Therefore, this firing is performed in a vacuum at about 5,800 ℃.

If this firing is performed in the air, the first titanium layer (Ti) is oxidized and becomes mainly titanium oxide TiO2, which impedes the adhesion to gold.

This causes the electrode to peel off from the substrate.

By the way, after the electrode firing, the dielectric layer 6 is formed as usual.
is formed by applying a low point glass paste and firing in the atmosphere.

Therefore, if during the firing of this dielectric layer 6, the above-mentioned T i
If 02 is generated, bubbles will be generated violently from the separated voids of the electrode and remain in the dielectric layer, which will lead to P and D.
, inhibits the uniformity of the discharge characteristics of P.

However, according to the method of the present invention, the discharge characteristics are not inhibited, and
Moreover, since electrodes with fine line patterns can be obtained with high precision, the method of the present invention is advantageous in manufacturing P, P, and D with a higher electrode pattern density than conventional methods.

[Brief explanation of drawings]

FIG. 1 is an explanatory cross-sectional view showing a laminated structure of P, D, and P substrates according to the method of the present invention. In the figure, 1 is a substrate, 2 is a titanium underlayer, 3 is a gold vapor deposited layer, 4 is a photoresist layer, 5 is a gold plating layer, and 6 is a dielectric layer.

Claims (1)

[Claims] 1. In a method for manufacturing a gas discharge panel in which an electrode covered with a dielectric layer faces a gas discharge space, a titanium base layer is formed on a glass substrate, a gold vapor-deposited film is laminated thereon, and then a titanium base layer is formed on a glass substrate. A photoresist layer is deposited on top to destroy the patterning, and then gold plating is performed, and a gold plating layer is laminated on the parts of the gold vapor deposited film exposed in the voids of the photoresist pattern, and then the metal parts covered with the photoresist are etched. to form an electrode pattern consisting of a titanium base layer, a gold vapor deposited film layer, and a gold plating layer, and then firing the electrode in a vacuum, followed by laminating and firing a dielectric paste. How to make a gas discharge panel.