JPS5954310A - Lumped constant filter - Google Patents

Abstract

PURPOSE:To attain ease of manufacture, miniaturization, uniform characteristic and cost reduction, by providing an inductance forming electrode and a capacitor electrode film on a dielectric green sheet. CONSTITUTION:The lumped constant filter is constituted by overlapping plural elements 1 provided as required with the inductance forming electrode films 3, 4 and the capacitor electrode films 6, 8 on the surface of the high frequency dielectric green sheet made of a material having a high Q and epsilongamma at a high frequency region and by connecting an external lead electrode film or an external lead to a prescribed position 5 of the electrode film for burning. Thus, the filter is more miniaturized in comparison with that using a mica plate as the dielectric sheet, the manufacture is made easy, the characteristic is uniform and the cost reduction is attained.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention aims at easy cleaning, 1/G shape, custom-made uniformity, and cost reduction: f:1.

An embodiment of this invention will be explained in detail.

Figure 1 2.1 shows a circuit 11# configuration (QIJ) which is intended to be used as a practical example in January (M!J). .That is, it includes January coils 11.L2 that are M-coupled to each other, and each coil Ll, L2 is connected to a capacitor C1, C, respectively.
2 is connected in parallel. In this way, a capacitor C6 is connected in series to one coil L I L- and a condenser C1 connected in parallel, and one end of the capacitor C6 is used as an input terminal IT. And also to the capacitor C2, six rows of Nigon capacitors C4 are connected, and one end of the capacitor C4 is used as the output terminal OT.
, C2 are connected to each other in common, and a ground terminal f-BT is ejected.As is clear from FIG. 1, the circuit shown here is symmetrical in appearance, Each of these left and right parts is made up of element elements as described below.
L1 In relation to the right half RH in Fig.
jl configuration, omitting detailed explanation of the left half1
-ru.

FIG. 2 is a perspective view of the right half of the circuit shown in FIG. 1, showing the elements 11 and 11 from relatively above. FIG. m5 is a perspective view of the device element shown in FIG. 2, viewed from relatively above. FIG. 4 is a top view of the element of FIG. 2, with insulation lI) added.

The device element 1 has a high Q and a high εr(k
, e.g. ir = 20 □”i U I) ), e.g. IVI Q 'E' i J (-
L 'II' 1.03: Lice 1 r'02 J r
102-T i02 series, +l! L'l'i, 06 series, t
ia2'ri2su,-(J3a,Pb)TlO,-T
i O = $ 118 + 1 box 1 A net 1 υ green / 5 condensers with a distance of 1 x 5 condensers. Before that, a layer of gold (4) was formed, which was to become C2, C, 4. +i mini is a dielectric 1t auxiliary burnout θ 11 degrees, from Wolf, Pl・P
This is done by using C1 analogy (・zu, 41 'fill, vapor deposition, etc.). The outside of the ring IB is shown in °C.

The coil L2 is formed by a metal strip 3.times.4 having a relatively narrow width and spirally extending along the circumference of the dielectric substrate 20. One gold 4 strip 6 is formed on the upper surface of the dielectric 5-piece substrate 2, and the oil metal strip 4 is
All four strips 6.4 formed on the underside of the dielectric substrate 2 are electrically connected by connecting strips 5 extending over the sides of the dielectric substrate 2. The capacitor C2 is formed on the upper surface of the dielectric substrate 2 and is made of gold 2! ! Itt1M6 connected to the 4 strip 6 is used as one electrode, and the dielectric
A part of the +Juli 7 formed over a relatively wide area on the lower surface of the substrate 2 is used as the other electrode. it71M
7 is connected to the IJ tube 4. The condenser C4 is a heavy double layer 8 formed on the upper surface of the dielectric substrate 2.
is one electrode, and the other part of the above-mentioned electrode 7 is the other,
! Become the pole. .

In this state of forming a metal loop of 1 m, if the C1Iα poles 6 and 8 are respectively used as terminals, L (H
The circuit is +i).

In FIG. 4, cs 18i'i+φ9 covering a part of the part of the electrical substrate 2 where the metal film is formed is given 41.
ing. This insulating film 9 will be described later;
This is to prevent this terminal from coming into contact with the metal plate 4 strip 6 when connecting to +i6.8 respectively. It is also possible to change the formation pattern of the metal film so that no other metal blemishes are formed at the position where the terminal connected to the C1 electric droplet 6.8 passes.

With reference to FIGS. 2 to 4, for the fourteen LC filters C2(1)
η was prepared, and later t-' was made by Hiroko 1id.
Through this process, an I, C filter with a circuit as shown in FIG. 1 is obtained. In order to make the M connection 11j at the time of setting the green sheet 1 and the same bush material 1'-F, at least - C211 bar'b, 4<child element 15τiI(NeaiJ:)-t
Cru. At this point, as is clear from the development diagram of No. 51>1, the Q positions of each other are forced to J, but the stiffness, the stiffness, and the
Yu'vB Bell. , , :: Connecting the A element with 1 C11 ・I: each '11 of the element element 1 between the two with the fif element
1, (6 times: J12 +ii'l 4" Ruda 1^〆)σ) so that it can be connected in a similar manner.

・:(S 11°!, 1 sea urchin shown in j, Kono IJ C7
rru! 'rJ,, 6 terminals T'l', OT, E',
What is T?

Each corresponding to each of these, jj4 child 14.15.16
forms a one-way C1 branch at each tip Q:IA.

Each terminal j4.15.16 and F of each cable chain 1/ment 1
The concubinage with Masakoshi 6 and 8 is as follows. i) "The branch on the front side of the terminal 14 is in contact with the electric current of the element element 1 on the front side (the branch on the back side is in contact with the element element 1 on the back side), and the green sheet 1 is not connected.
Touch 0. The branch on the front side of the terminal 15 (1j) contacts the element element 10 on the front side, and the branch on the back side contacts the electrode 6 of the element element 1 on the back side. 14 of the element 1 on the back side and the electrode 8 of the element element 1 on the back side of the element 1 on the back side.When considering such a contact state, state the correspondence with Fig. 1. For example, terminal 14 is input +, 1
! The terminal 15 becomes the child IT or the output terminal OT, the terminal 15 becomes the ground terminal ET, and the end f16 becomes the output terminal OT or the input terminal T. Each terminal 1.15.16 has a coil L11
It passes close to the metal strip 6 that borrows L2, but as mentioned above, it is completely covered by J: IIA 9, so that no undesired gas connections can occur here. do not have. It is also conceivable to create a chip-type filter using a chip capacitor method without using terminals.

In any case, in the end, the sheet and Y[Ii are +
J,, i'fi IH [~C7 Heron 1 Shiba Kishiel.

May I meet your needs? l i: 3 foreign tribes? What? )1shiii).

, k L-1 height j, -1 wave' low ii
j lff1 Shrine Department 5=Use Bi) can be done.

Further, the green sheet 1 set 10 is, for example, (BrC
a) ZrO, +MnO2 system (family, Ha ZrO, +M s
o. It is also possible to use yarn 41 material, use N1 + J' for each city and pole, use a mixture of N2 and 1 (, etc.), and simultaneously fire the sheet and Jffi in a vertical atmosphere.

Here, ML for 11 days is 1 month, 1t, =-CJl
, 通I+'；l 4 侃とし5. Compared to pt- and Pl-1-, which are used for There are some things that prevent the acclimatization of the NL standard and reduce the E-I low resistance.However, , ++Ti '+i
J
If you do AHr, 1 piece of work will become ■original 5 J't, and it will become a semiconductor and become C tight. However, the body material v (1tel
:, (BaCa)ZrO, -IMnO, as described above
.

Materials such as threads, aZrO, I-MntJ, etc., cannot be converted into semiconductors even if baked in an atmosphere of deformation.

It is clear from the above embodiments that according to the present invention, the Jj I! j lI*, -f/y
The external drawer 1 electrode membrane and the external drawer lead are connected to the i [(ffi 1ir).
Since it is connected to a predetermined position of J and fired to form C, it is smaller in size, easier to manufacture, has more uniform properties, and is cheaper than a sheet made of mica. You can also measure down.

[Brief explanation of the drawing]

FIG. 1 shows a circuit Iv & circuit which is intended to be implemented in one embodiment of the present invention. =It is a perspective view. FIG. 5 is a perspective view of the cable j', rainbow, and mate of FIG. 2, taken relatively from the direction F. Figure 4 is the second
FIG. 2 is a top view of the device element shown in FIG. 1 with an insulating film added; Figure 5 is an illustration 1; Figure 14) Figure 6 (l, internal plane 1゛z1. 1...-4's-f element, IO...ri I
J-y seat.・IY1 production finish・1 person production・■4 meeting finishing point] Manufacturing plant Fig. 4 3 50-

Claims (1)

[Claims] The long side of the high-frequency J conductor green sheet, the inductance forming precaution (MEL), the capacitor, and the Lp provided as necessary are laminated together. At the same time, the external drawer is 1lIJ or the external drawer is +111J-de total.