JPS595062A - Phenol-resin laminated board - Google Patents

Phenol-resin laminated board

Info

Publication number
JPS595062A
JPS595062A JP11509382A JP11509382A JPS595062A JP S595062 A JPS595062 A JP S595062A JP 11509382 A JP11509382 A JP 11509382A JP 11509382 A JP11509382 A JP 11509382A JP S595062 A JPS595062 A JP S595062A
Authority
JP
Japan
Prior art keywords
laminate
resin
melamine
resin liquid
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11509382A
Other languages
Japanese (ja)
Inventor
邦夫 坂本
野村 誠七
根本 一彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP11509382A priority Critical patent/JPS595062A/en
Publication of JPS595062A publication Critical patent/JPS595062A/en
Pending legal-status Critical Current

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Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は電子機器、電気機器、コンピューター機器等に
用いられるフェノール樹脂積層板に関するもので、その
目的とするところはパンチング加工性を維持(7たまま
で難燃性を向上させることにある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a phenolic resin laminate used for electronic equipment, electric equipment, computer equipment, etc., and its purpose is to maintain punching processability (improve flame retardancy while maintaining 7). It's about letting people know.

従来、電子機器、電気機器、コンピューター機器等に用
いられるフェノール樹脂yINI板はIC、トランジス
ター、LSI等の電気部品を多数装着せしめるために@
層板VC装着用穴を多数設ける必要があり装着用穴をパ
ンチング等で作成時に積層板にワV、クツツクを発生す
ることが多かった。
Conventionally, phenolic resin yINI boards used in electronic equipment, electrical equipment, computer equipment, etc. are used to mount a large number of electrical components such as ICs, transistors, and LSIs.
It is necessary to provide a large number of holes for mounting the VC in the laminate, and when the mounting holes are created by punching, etc., the laminate often gets cracked and cracked.

更に難燃化の要求に対処する丸めフェノール樹脂に難燃
剤を多量に混入することがありワレ、クラ、りの発生を
益々多発化させていたものである。
Furthermore, a large amount of flame retardant is sometimes mixed into the rolled phenol resin that meets the demand for flame retardancy, which increases the occurrence of cracks, cracks, and gluing.

本発明は上記欠点を解決するもので、積層板用基材に熱
硬化性樹脂液を含浸、乾燥したプリプレグを所要枚数積
層し、加熱加圧成形してなる積層板において、熱硬化性
樹脂液に難燃剤含有メラミン変性フェノール樹脂液を用
いたフェノール樹脂積層板であるため難燃剤添加量を大
巾に減少せしめることができるのでパンチング加工性を
維持したままで難燃性を向上せしめることができたもの
である。
The present invention solves the above-mentioned drawbacks.The present invention is intended to solve the above-mentioned drawbacks, and provides a laminate made by impregnating a base material for a laminate with a thermosetting resin liquid, laminating a required number of dried prepregs, and molding them under heat and pressure. Since this is a phenolic resin laminate using a melamine-modified phenolic resin liquid containing a flame retardant, the amount of flame retardant added can be greatly reduced, making it possible to improve flame retardancy while maintaining punching processability. It is something that

以下本発明の詳細な説明する。本発明に用いる積層板用
基材としては、ガラス、アスベスト等の無機繊維やポリ
エステル、lリアミド、ポリビニルアルコール、アクリ
ル等の有機合成繊維や木綿醇の天然繊維からなる織布、
不織布、マット或は紙又はこれらの組合せ基材等である
。熱硬化性樹脂液としてはクレジルジフェニルホスフェ
ート。
The present invention will be explained in detail below. The base materials for the laminate used in the present invention include woven fabrics made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, laryamide, polyvinyl alcohol, and acrylic, and natural fibers made of cotton.
The base material may be nonwoven fabric, matte, paper, or a combination thereof. Cresyl diphenyl phosphate is used as a thermosetting resin liquid.

トリスβクロロエチルホスフェート、トリスνクロルグ
ロビルホスフエート、トリス2.887プロム10ビル
ホスフエート、トリスブロムクロルプロピルホスフェー
ト、トリブチルホスフェート、トリオクチルホスフェー
ト、トリプトキVエチルホスフェート%テトラブロモジ
フェニルエーテル、トリブロモフェニルへイドロキVエ
チルエーテル。
Tris beta chloroethyl phosphate, tris ν chlorglovir phosphate, tris 2.887 prom 10 vinyl phosphate, tris bromo chlorpropyl phosphate, tributyl phosphate, trioctyl phosphate, tryptoki V ethyl phosphate % tetrabromodiphenyl ether, to tribromophenyl Idokki V Ethyl Ether.

ジブロモクレジルグリVジルエーテル等の難燃剤を含有
するメラミン変性フェノール樹脂を用いる。
A melamine-modified phenol resin containing a flame retardant such as dibromocresyl glycyl ether is used.

難燃剤としては皇紀を含め特に限定する屯のではないが
好ましくけ奥票系化合物と燐素化合物の単独又は併用が
より難燃効果を向、ヒさせるため望ましいことである。
Although there are no particular restrictions on the flame retardant, including Koki, it is preferable to use a backing type compound and a phosphorus compound alone or in combination to further enhance or reduce the flame retardant effect.

又メラミン変性フェノール1モル特に限定するものでは
ないが望ましくはメチロールメラミン存在下で7エノー
ル、クレゾール、キシレノール尋のフェノール類又はフ
ェノール類及びフェノール類と変性可能な植物油、リグ
ニン、キシレン、ナフタリン、石油樹脂停とホルムアル
デヒド、バラホルムアルデヒド停のホルムアルデヒド類
とをアンモニア、アミン等のアルカリ触媒テ[応させて
得られるメラミン変性フェノール樹脂が樹脂液及びデリ
グレグの保存性がよいので好ましく、更にアルカリ触媒
としては特に限定するものではないが望ましくはアンモ
ニア水とトリエチルアミンの混合触媒を用いることが好
ましくトリエチルアミンl容量部に対し5重量%(以下
単に%と紀す)アンモニア水8〜7容量部を用いること
が好ましい。即ちアンモニア水が8容量部未満では硬化
速度が遅くなり、7容量部をこえると樹脂が高分子化し
積層板用基材への含浸性が低下する傾向にあるからであ
る。なおグリプレグ積層体の片面或はE、下面に銅箔醇
を載置してから加熱加圧成形することにより銅張積層板
を得ることができるものである。
In addition, 1 mole of melamine-modified phenol, preferably but not limited to, 7 enol, cresol, or xylenol phenols in the presence of methylolmelamine, or phenols and vegetable oils that can be modified with phenols, lignin, xylene, naphthalene, or petroleum resins. The melamine-modified phenol resin obtained by reacting formaldehyde with formaldehyde, formaldehyde, and formaldehyde with an alkali catalyst such as ammonia or amine is preferable because it has good storage stability for the resin liquid and derigreg, and is particularly limited as an alkali catalyst. It is preferable to use a mixed catalyst of aqueous ammonia and triethylamine, although it is not necessary, and it is preferable to use 8 to 7 parts by volume of aqueous ammonia at 5% by weight (hereinafter simply referred to as %) per 1 part by volume of triethylamine. That is, if the amount of ammonia water is less than 8 parts by volume, the curing speed will be slow, and if it exceeds 7 parts by volume, the resin will become polymerized and the impregnation into the base material for the laminate will tend to decrease. Note that a copper-clad laminate can be obtained by placing a copper foil on one side or the lower side of the Gripreg laminate and then heating and press-molding it.

以下本発明を!A!施例にもとすいて説明する。Below is the invention! A! This will be explained by referring to examples.

実施例 フェノール1モルに対シホルムアルデヒド1.8モルを
η%ホルマリンで加え更にメチロールメラミンlo9を
加tでから25%アンモニア水とトリエチルアミンの醇
容量混合触媒でアルカリ性圧してから76℃で60分間
反応させてメラミン変性フェノール樹脂を得、該メラミ
ン変性フェノール樹脂100重量部(以下単に部と起す
)に対し?トラプロモジフェニルニー11部とりVジル
ジフェニルホスフェートlO部を加えて難燃剤含有メラ
ミン変性フェノール樹脂液脂た。次に該難燃剤含有メラ
ミン変性フェノール樹脂をメチルアルコールで樹脂量5
0%Vclli!整した樹脂液を厚さくti藺のクラフ
ト紙に含浸、乾燥してグリグレグを得、該グリプレグ8
枚を重ねた積層体を成形グレート間に挾んで成形圧力1
00−1成形製度160″Cで60分間(6) 積層成形してフェノール樹脂積層板を得た。
Example: To 1 mole of phenol, 1.8 mole of cyformaldehyde was added in η% formalin, and then methylolmelamine LO9 was added, followed by alkaline pressure using a mixed catalyst of 25% ammonia water and triethylamine, and then reacted at 76°C for 60 minutes. A melamine-modified phenol resin is obtained, and the melamine-modified phenol resin is made to contain 100 parts by weight (hereinafter simply referred to as "parts") of the melamine-modified phenol resin. To 11 parts of trabromodiphenyl phosphate was added 10 parts of V-dyldiphenyl phosphate to form a melamine-modified phenolic resin liquid containing a flame retardant. Next, the flame retardant-containing melamine-modified phenol resin was added with methyl alcohol in an amount of 5%.
0%Vcli! The prepared resin liquid is impregnated into a thick layer of kraft paper and dried to obtain a Gripreg.
The stacked laminate is sandwiched between molding plates and the molding pressure is 1.
00-1 was laminated and molded at a molding degree of 160''C for 60 minutes (6) to obtain a phenolic resin laminate.

従来例 樹脂食間%の7工ノール樹脂100部に対しデトヲグロ
モジフェニルエーデyv 70 部とクレジμジフェニ
ルホスフェート加部を加工た難燃性フェノール樹脂液を
用いた以外は実施例と同様に処理してフェノール樹@積
層板を得た。
Conventional Example Processed in the same manner as in the example except that a flame-retardant phenol resin liquid prepared by adding 70 parts of detoglomodiphenyl ade yv and a part of credit μ diphenyl phosphate to 100 parts of 7-functional ethanol resin was used. A phenolic resin @ laminate was obtained.

実施例と従来例の積層板の難燃性及びパンチング加工性
は第1表に明白なように本発明の7″に、ノール樹脂積
層板はパンチング加工性を維持したままでW&燃性がよ
く本発明の優れている仁とを確認した。
As is clear from Table 1, the flame retardancy and punching processability of the laminates of the example and the conventional example are 7" of the present invention, while the nol resin laminate has good W&flammability while maintaining punching processability. The superiority of the present invention was confirmed.

第   1   表 注帯パンチング用金型にてパンチング試験をおこないそ
の外観判定による。
Table 1 Note: Perform a punching test using a belt punching mold and judge its appearance.

(6)(6)

Claims (1)

【特許請求の範囲】 +1)  積層板用基材に熱硬化性樹脂液を含浸、乾燥
したプリプレグを所要枚数積層し、加熱加圧成形してな
る積層板において、熱硬化性樹脂液に難燃剤含有メラミ
ン変性フェノール樹脂液を用いたことを特徴とするフェ
ノール樹脂積層板。 12)  メラミン変性フェノール樹脂がメチロールメ
ラミン存在下でフェノール類とホルムアルデヒド類とを
アルカリ触媒で反応させた本のであることを特徴とする
特許請求の範囲第1項記載の7工ノール樹脂積層板。 (8)  アルカリ触媒がアンモニア水とトリエチルア
ミンの混合触媒であることを特徴とする特許請求の範囲
第1項、第2項6載のフェノ−Iv樹脂積層板。
[Scope of Claims] +1) In a laminate formed by impregnating a base material for a laminate with a thermosetting resin liquid, laminating a required number of dried prepregs, and molding them under heat, a flame retardant is added to the thermosetting resin liquid. A phenolic resin laminate characterized by using a melamine-modified phenolic resin liquid. 12) The 7-Nol resin laminate according to claim 1, wherein the melamine-modified phenol resin is a product obtained by reacting phenols and formaldehydes with an alkali catalyst in the presence of methylolmelamine. (8) The pheno-IV resin laminate according to claims 1 and 2, wherein the alkali catalyst is a mixed catalyst of aqueous ammonia and triethylamine.
JP11509382A 1982-07-01 1982-07-01 Phenol-resin laminated board Pending JPS595062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11509382A JPS595062A (en) 1982-07-01 1982-07-01 Phenol-resin laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11509382A JPS595062A (en) 1982-07-01 1982-07-01 Phenol-resin laminated board

Publications (1)

Publication Number Publication Date
JPS595062A true JPS595062A (en) 1984-01-11

Family

ID=14654026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11509382A Pending JPS595062A (en) 1982-07-01 1982-07-01 Phenol-resin laminated board

Country Status (1)

Country Link
JP (1) JPS595062A (en)

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