JPH01242633A - Laminate - Google Patents
LaminateInfo
- Publication number
- JPH01242633A JPH01242633A JP7080288A JP7080288A JPH01242633A JP H01242633 A JPH01242633 A JP H01242633A JP 7080288 A JP7080288 A JP 7080288A JP 7080288 A JP7080288 A JP 7080288A JP H01242633 A JPH01242633 A JP H01242633A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- thermosetting resin
- base material
- varnish
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 abstract description 9
- 239000002904 solvent Substances 0.000 abstract description 9
- 239000002966 varnish Substances 0.000 abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 6
- 150000002989 phenols Chemical class 0.000 abstract description 5
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 241001504424 Zosteropidae Species 0.000 abstract 2
- 150000002148 esters Chemical class 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 239000004014 plasticizer Substances 0.000 description 7
- -1 brominated phenols Chemical class 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 4
- 239000002383 tung oil Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- UUGLJVMIFJNVFH-UHFFFAOYSA-N Hexyl benzoate Chemical compound CCCCCCOC(=O)C1=CC=CC=C1 UUGLJVMIFJNVFH-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N Methyl ethyl ketone Natural products CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- LMCLPMXCYFSRNG-UHFFFAOYSA-N (4-nonylphenyl) diphenyl phosphate Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 LMCLPMXCYFSRNG-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は難燃性および打扱き加工性に優れた積層板に関
する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a laminate having excellent flame retardancy and handling properties.
（従来技術）
最近、電子機器の高密度化に伴い、安全性の面から、プ
リント配線板用積層板に対する難燃性の要求が一段と激
しくなっており、米国ＵＬ規格等の法制、規格にも代表
されるように、その規制はますます強化されつつある。(Prior art) Recently, with the increasing density of electronic equipment, the demand for flame retardancy for printed wiring board laminates has become even more intense from the standpoint of safety, and legislation and standards such as the U.S. UL standard have also increased. As can be seen, regulations are becoming increasingly strict.
また、プリント配線板には、電子部品実装技術の進歩に
伴い、より激しい寸法精度が要求されており、この要求
を満たすため、低温打法き加工が行なわれるようになっ
ている。Further, as electronic component mounting technology advances, printed wiring boards are required to have even greater dimensional accuracy, and in order to meet this requirement, low-temperature stamping processing is being performed.
従来、積層板の難燃化の要求に対しては、リン酸エステ
ル類等のリン系化合物、ブロム化フェノール類、ブロム
化エポキシ化合物、ブロム化ビフェニルエーテル類等の
ブロム系化合物、トリアジン化合物等の窒素系化合物お
よびアンチモン等の無機化合物を単独または併用して用
い、これらを熱硬化性樹脂に添加することによりなされ
ている。Conventionally, in response to the demand for flame retardant laminates, phosphorus compounds such as phosphoric acid esters, bromine compounds such as brominated phenols, brominated epoxy compounds, brominated biphenyl ethers, and triazine compounds have been used. This is accomplished by using a nitrogen compound and an inorganic compound such as antimony alone or in combination, and adding these to the thermosetting resin.
一方、打抜き加工性を向上させるためには、熱硬化性樹
脂にリン酸エステル類、ポリエーテル類。On the other hand, in order to improve punching workability, phosphoric acid esters and polyethers are used as thermosetting resins.
ポリエステル類等の可塑剤を添加したり、あるいは乾性
油類、ポリブタジェン類、不飽和ポリエステル類等の可
塑剤と熱硬化性樹脂との反応により樹脂の改質等がなさ
れている。Resins are modified by adding plasticizers such as polyesters, or by reacting plasticizers such as drying oils, polybutadienes, and unsaturated polyesters with thermosetting resins.
（発明が解決しようとする課題）
ところで上記の如き打扱き加工の低温化に伴い、ざらに
可塑剤の増量が必要となるが、これにより、熱硬化性樹
脂の架橋密度の低下が生じ、さらには打扱き加工によっ
て打扱き穴周囲の目白の発生や、耐熱性、耐溶剤性の低
下が著しいという問題点がある。(Problem to be Solved by the Invention) However, as the processing temperature becomes lower as described above, it becomes necessary to increase the amount of plasticizer, but this causes a decrease in the crosslinking density of the thermosetting resin, and furthermore, However, there are problems such as the occurrence of whitening around the punched holes and a significant decrease in heat resistance and solvent resistance due to the punching process.
一方、難燃性を付与するためには、さらに条苗の難燃剤
の添加が必要となるが、これにより打抜き加工性、耐熱
性、耐溶剤性の劣化が一層著しくなる。On the other hand, in order to impart flame retardancy, it is necessary to further add a flame retardant to the seedlings, but this further deteriorates the punching processability, heat resistance, and solvent resistance.
従来は、可塑剤および難燃剤を兼ねるものとして、トリ
フェニルホスフェイト、タレジルジフェニルホスフェイ
ト、イソプロピルフエニルジフェニルホスフェイトどう
のリン酸エステル類が使用されていたが、上記の如き増
量に伴い、特に目白等の打抜き欠陥が発生しやすいとい
う問題点がある。Conventionally, phosphoric acid esters such as triphenyl phosphate, talesyl diphenyl phosphate, and isopropylphenyl diphenyl phosphate have been used as plasticizers and flame retardants. In particular, there is a problem in that punching defects such as the white of the eyes are likely to occur.
本発明は、上記問題点に鑑み、目白が発生しないととも
に耐熱性、耐溶剤性にも優れ、かつ難燃性および打抜き
加工性に優れた積層板を提供することを目的とする。In view of the above-mentioned problems, an object of the present invention is to provide a laminate that does not cause whitening, has excellent heat resistance and solvent resistance, and has excellent flame retardancy and punching workability.
（課題を解決するための手段）
本発明は、一般式（１）
％式％
で示されるリン酸エステルを含有してなる熱硬化性樹脂
を塗布含浸させた基材を成型してなることを特徴とする
積層板に関する。(Means for Solving the Problems) The present invention is formed by molding a base material coated and impregnated with a thermosetting resin containing a phosphoric acid ester represented by the general formula (1). The present invention relates to a characteristic laminate.
本発明に使用される熱硬化性樹脂としては、フェノール
樹脂、エポキシ樹脂、メラミン樹脂、不飽和ポリエステ
ル樹脂等が挙げられる。Thermosetting resins used in the present invention include phenolic resins, epoxy resins, melamine resins, unsaturated polyester resins, and the like.
特に乾性油変性フェニル樹脂を熱硬化性樹脂として用い
た場合、低温打法き加工性がざらに良好となる。この場
合、上記乾性油としては、桐油。In particular, when a drying oil-modified phenyl resin is used as the thermosetting resin, the low-temperature processing processability becomes much better. In this case, the drying oil is tung oil.
脱水ヒマシ油、オイナシカ油等が使用され、フェノール
類としては、フェノールメタクレゾール、パラクレゾー
ル、オルリフレゾール、イソプロピルフェノール、パラ
タシＶリープチルフェノール、バライソプロペニルフェ
ノールオリゴマー、ノニルフェノール、ビスフェノール
Ａ等が使用される。Dehydrated castor oil, oinica oil, etc. are used, and as phenols, phenolmetacresol, paracresol, orrifresol, isopropylphenol, paratasi V-leaptylphenol, barisopropenylphenol oligomer, nonylphenol, bisphenol A, etc. are used. Ru.
次に本発明に使用される一般式（Ｉ）で示されるリン酸
エステルは、上記熱硬化性樹脂１００部（重量部をいう
。以下同じ）に対して、３〜１００部含有されるのが好
ましく、さらに好ましくは５〜６０部の範囲で使用され
るのが良い。１００部以上の場合、成型した積層板の層
間接着性が低下し、打抜き加工で剥離や目白を生じやす
くなる。Next, the phosphoric acid ester represented by the general formula (I) used in the present invention is contained in an amount of 3 to 100 parts based on 100 parts (by weight) of the above thermosetting resin. Preferably, it is more preferably used in a range of 5 to 60 parts. If the amount is 100 parts or more, the interlayer adhesion of the molded laminate will decrease, and peeling or whitening will easily occur during punching.
ここで、一般式（Ｉ）で示されるリン酸エステルを含有
した熱硬化性樹脂に、トルエン、アルコール、メチルエ
チルケトン、アセｌ−ン、ジメチルホルムアミド、スチ
レン等の溶剤を用いてワニスとし、紙、ガラスクロス、
ガラス不織布、合成繊維等の基材に所定＠塗布含浸させ
、成形して積層板とする。Here, a thermosetting resin containing a phosphoric acid ester represented by the general formula (I) is made into a varnish using a solvent such as toluene, alcohol, methyl ethyl ketone, acetone, dimethylformamide, styrene, etc. cross,
A base material such as glass non-woven fabric or synthetic fiber is coated and impregnated in a prescribed manner, and then formed into a laminate.
成形は、基材の１枚または複数枚を重ね合わせ、加熱、
加圧して行なわれる。Molding involves stacking one or more base materials, heating,
It is done under pressure.
また、補助的に、難燃剤として、トリフェニルホスフェ
イト、クレジルジフェニルホスフェイト、イソプロピル
フエニルジフェニルホスフェイト等のリン酸エステルや
、ブロム化フェノール、ブロム化エポキシ化合物、ブロ
ム化ビフェニルエーテル化合物等の臭素化合物を用いて
も良い。In addition, as an auxiliary flame retardant, phosphoric acid esters such as triphenyl phosphate, cresyl diphenyl phosphate, isopropylphenyl diphenyl phosphate, brominated phenol, brominated epoxy compounds, brominated biphenyl ether compounds, etc. A bromine compound may also be used.
（実施例） 次に本発明を実施例および比較例により説明する。(Example) Next, the present invention will be explained with reference to Examples and Comparative Examples.
桐油とフェノールを酸性触媒下に反応させ、次に８５％
パラホルムアルデヒドとアルカリ触媒下でクレゾール化
した桐油変性率３９％の桐油変性フェノール樹脂１００
部と、
次式（ＩＩ）で示されるノニルフエニルジフェニルホス
フェイト３０部と、
テトラブロモごスフエノールＡジグリシジルエーテル２
５部と、
を配合して含浸用ワニスとした。Tung oil and phenol are reacted under acidic catalyst, then 85%
Tung oil modified phenolic resin 100 with a tung oil modification rate of 39% cresolized under paraformaldehyde and an alkali catalyst
1 part, 30 parts of nonylphenyl diphenyl phosphate represented by the following formula (II), and 2 parts of tetrabromo-sphenol A diglycidyl ether.
A varnish for impregnation was prepared by blending 5 parts and 5 parts.
次に予め水溶性メラミン変性フェノール樹脂で処理（樹
脂付着量１５〜１７％）したクラフト基材に、上記含浸
用ワニスを樹脂付着量５５〜５８％になるように含浸乾
燥させ、このプリプレグ７枚と接着剤付銅箔とを重ね合
せて、加熱加圧積層して、１．６ｍｍ厚の片面銅張積層
板を得た。Next, a kraft base material previously treated with water-soluble melamine-modified phenol resin (resin adhesion amount: 15-17%) was impregnated with the above-mentioned impregnating varnish to a resin adhesion amount of 55-58% and dried, and 7 sheets of the prepreg were prepared. and adhesive-coated copper foil were superimposed and laminated under heat and pressure to obtain a single-sided copper-clad laminate with a thickness of 1.6 mm.
比較例
上記実施例で用いた樹脂と同様の桐油変性フェノール樹
脂１００部に、トリフェニルホスフェイト３０部、テト
ラブロモごスフエノールＡジグリシジルエーテル２５部
を配合して含浸用ワニスとした。そして、上記実施例と
同様な方法で片面銅張積層板を得た。Comparative Example A varnish for impregnation was prepared by blending 30 parts of triphenyl phosphate and 25 parts of tetrabromosphenol A diglycidyl ether with 100 parts of a tung oil-modified phenolic resin similar to the resin used in the above example. Then, a single-sided copper-clad laminate was obtained in the same manner as in the above example.
上記実施例および比較例で１ｑられた銅張積層板の特性
を次の表に示す。The properties of the copper-clad laminates obtained in the above Examples and Comparative Examples are shown in the following table.
表
本発明では、上記の如く一般式（Ｉ＞で示されるリン酸
エステルを難燃性可塑剤として熱硬化性樹脂に添加し、
溶剤で調整する。この場合上記リン酸エステルは、リン
を有するため、難燃性効果があるとともに、トリフェニ
ルホスフェイト、タレジルジフェニルホスフェイト等と
同様に、可塑剤としての効果もある。特に上記の如く芳
香環にＣ９Ｈ１９基（ノニル基）を有しているため、可
塑性に優れるとともに熱硬化性樹脂と適度に相溶し、成
型、硬化したとき均一な可Ｉ尭性を有する樹脂となる。Table In the present invention, as described above, a phosphoric acid ester represented by the general formula (I>) is added to a thermosetting resin as a flame retardant plasticizer,
Adjust with solvent. In this case, since the phosphoric acid ester contains phosphorus, it has a flame retardant effect and also has an effect as a plasticizer like triphenyl phosphate, talesyl diphenyl phosphate and the like. In particular, since it has a C9H19 group (nonyl group) in the aromatic ring as mentioned above, it has excellent plasticity and is moderately compatible with thermosetting resins, and when molded and cured, it has a uniform I-flexibility. Become.
本発明になる積層板は上記一般式（Ｉ）で示されるリン
酸エステルを含有する熱硬化性樹脂ワニスを紙等の基材
に所定量塗布含浸させ、これを乾燥してプリプレグとし
、必要枚数加熱加圧して積層形成することにより、上記
表に明らかな如く難燃性および打法き加工性に優れた積
層板が製造できることになる。The laminate of the present invention is produced by applying and impregnating a predetermined amount of a thermosetting resin varnish containing a phosphoric acid ester represented by the above general formula (I) onto a base material such as paper, and drying this to form a prepreg. By heating and pressurizing to form a laminate, it is possible to produce a laminate with excellent flame retardancy and punching workability, as is clear from the table above.
（発明の効果）
本発明は上記の如く、リン酸エステルを難燃性可塑剤と
して熱硬化性樹脂に含浸させたので、口内が発生しない
とともに、耐熱性、耐溶剤性に優れ、難燃性および打法
き加工性にも優れた積層板を得ることができる等の効果
を有する。(Effects of the Invention) As described above, the present invention impregnates thermosetting resin with phosphoric acid ester as a flame-retardant plasticizer, so it does not cause cavitation, has excellent heat resistance and solvent resistance, and has excellent flame retardant properties. It also has effects such as being able to obtain a laminate with excellent hammering workability.
Claims (1)
＿１＿９、他はＨ） で示されるリン酸エステルを含有してなる熱硬化性樹脂
を塗布含浸させた基材を成型してなることを特徴とする
積層板。 ２、上記熱硬化性樹脂が乾性油変性フェノール樹脂であ
ることを特徴とする請求項１記載の積層板。[Claims] 1. General formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) (At least one of R_1, R_2, and R_3 is C_9H
_1_9, others are H) A laminate formed by molding a base material coated and impregnated with a thermosetting resin containing a phosphoric acid ester. 2. The laminate according to claim 1, wherein the thermosetting resin is a drying oil-modified phenolic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7080288A JPH01242633A (en) | 1988-03-24 | 1988-03-24 | Laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7080288A JPH01242633A (en) | 1988-03-24 | 1988-03-24 | Laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01242633A true JPH01242633A (en) | 1989-09-27 |
Family
ID=13442046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7080288A Pending JPH01242633A (en) | 1988-03-24 | 1988-03-24 | Laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01242633A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1074016C (en) * | 1995-04-10 | 2001-10-31 | 大八化学工业株式会社 | Flame-retarded thermosetting resin composition |
-
1988
- 1988-03-24 JP JP7080288A patent/JPH01242633A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1074016C (en) * | 1995-04-10 | 2001-10-31 | 大八化学工业株式会社 | Flame-retarded thermosetting resin composition |
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