JPS5945373A - Binder composition for paste - Google Patents

Binder composition for paste

Info

Publication number
JPS5945373A
JPS5945373A JP57154496A JP15449682A JPS5945373A JP S5945373 A JPS5945373 A JP S5945373A JP 57154496 A JP57154496 A JP 57154496A JP 15449682 A JP15449682 A JP 15449682A JP S5945373 A JPS5945373 A JP S5945373A
Authority
JP
Japan
Prior art keywords
paste
binder
polyvinyl butyral
ethyl cellulose
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57154496A
Other languages
Japanese (ja)
Other versions
JPS6047314B2 (en
Inventor
Seiichi Yamada
山田 成一
Toshio Matsuzaki
松崎 壽夫
Shinkichi Shimizu
信吉 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57154496A priority Critical patent/JPS6047314B2/en
Publication of JPS5945373A publication Critical patent/JPS5945373A/en
Publication of JPS6047314B2 publication Critical patent/JPS6047314B2/en
Expired legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To prepare the titled composition having high leveling property and flexibility, and resistant to cracking in drying, by adding a dispersing agent and a solvent to a binder containing ethyl cellulose, polyvinyl butyral and n-dibutyl phthalate at specific ratios. CONSTITUTION:The objective binder composition for paste can be prepared by mixing (A) binder composed of 60-75wt% of ethyl cellulose, 5-17.5wt% of polyvinyl butyral and 10-30wt% of n-dibutyl phthalate with (B) a polyoxyethylene alkylamine surface active agent as a dispersing agent, and (C) a terpineol as a solvent. EFFECT:It improves the handleability of a ceramic paste, and gives a multi-layer ceramic substrate and multi-layer ceramic capacitor in high yield by multi-layer printing process.

Description

【発明の詳細な説明】 (1)発明の技術分野 本発明は多層セラミック基鈑又は多層セラミックコンデ
ンサ等の多層構造物を形成するペーストを製造する際に
用いるバインダー糸組成に関−Jるものである。
DETAILED DESCRIPTION OF THE INVENTION (1) Technical field of the invention The present invention relates to a binder yarn composition used in manufacturing a paste for forming a multilayer structure such as a multilayer ceramic substrate or a multilayer ceramic capacitor. be.

(2)技術の背景 従来よシ訪電体層および導体層をスクリーン印刷によシ
形成し、印刷乾燥を繰シ返すことによって多層化を行な
った後、焼成する印刷多層法によってセラミック多層基
板、多層セラミックコンデンサを得る方法がある。この
方法における誘電体および導体ペーストには下記のよう
な性質が要求される。
(2) Background of the technology Conventionally, a ceramic multilayer substrate is produced by a printing multilayer method in which a current-visiting body layer and a conductor layer are formed by screen printing, and the layers are formed by repeated printing and drying, and then fired. There is a way to obtain multilayer ceramic capacitors. The dielectric and conductor pastes used in this method are required to have the following properties.

■ 乾燥時に割れが発生せず、印刷時に用いた台(例え
ば枠にはったアルミ箔)よシ取りはずしたときに適当な
柔軟性を有し取扱易いこと。
■ It should not crack when drying, and should have appropriate flexibility and be easy to handle when removed from the stand used for printing (for example, aluminum foil attached to a frame).

■ 乾燥時にピンホールが発生しないこと。■ No pinholes should occur during drying.

■ 乾燥が速く、かつ印刷時に粘度が変化しにくいこと
■ It dries quickly and its viscosity does not change easily during printing.

■ レベリング性がよいこと。■ Good leveling properties.

一般に厚膜用ペーストの結合剤にはエチルセルロース、
ニトロセルロースなどが用いられているがこれらの結合
剤だけでは上記性質を得ることはできない。このため上
記性質を壱する結合剤が要求されている。
Generally, ethyl cellulose is used as a binder for thick film pastes.
Although nitrocellulose and the like are used, the above properties cannot be obtained with these binders alone. Therefore, there is a need for a binder having the above-mentioned properties.

(3)発明の目的 ネ発りJは上記費求に基づいて、ペーストに加えたとき
印刷の17ペリング性が良好で、乾燥時に割れ、ピンホ
ール等が発生せず、且つ適当な柔軟性があるようなバイ
ンダー系組成を提供することを目的とするものである。
(3) Purpose of the Invention Based on the cost requirements mentioned above, Nehatsuri J is a material that, when added to a paste, has good printing properties, does not cause cracks or pinholes when drying, and has appropriate flexibility. The purpose is to provide such a binder system composition.

(4)発明の構成 そしてこの目的は本発明によf L iJ:エチルセル
ロース、ポリビニルブチラール、フタル酸−n−ジブチ
ルよりなる結合剤に分散剤としてポリオキシエチレンア
ル片ルアビン界11Ii活性剤を加え、溶剤としてテル
ピネオールを加えたイースト用バインダー系において前
記結合剤はエヲルセルロース60〜75乗量チ、ポリビ
ニルブチラール5〜17.5重量%、フタル酸−n−ノ
ブチル10〜30重月、チよりなることを% wtとす
るペースト用バインダー系組成を提供することによって
達成さ1する。
(4) Structure and object of the invention according to the present invention: f L iJ: Adding a polyoxyethylene albylabine world 11Ii activator as a dispersant to a binder consisting of ethyl cellulose, polyvinyl butyral, and n-dibutyl phthalate; In the binder system for yeast with terpineol added as a solvent, the binder consists of Ewol cellulose 60 to 75% by weight, polyvinyl butyral 5 to 17.5% by weight, and n-butyl phthalate 10 to 30% by weight. % wt.

(5)発明の実施例 以下本発明実施例について詳細に説明する。(5) Examples of the invention Examples of the present invention will be described in detail below.

実施例1 誘電体粉末としてBaTi05(平均粒径13μm)\
電極粉末としてpd(平均粒径0.9μm)を用い第1
表に示すA−Eのバインダー糸により誘電体ペーストを
作成し/ζ。ただし結合剤のS数は原料粉末ioog当
シの添加量であシ、(イ)は結合剤全量に対する各成分
の割合である。またPdペーストのバインダ系添加量は
誘電体ペーストのそれの0.9倍とした。またテルピネ
オールの添加量は結合剤の種類により異なる。
Example 1 BaTi05 (average particle size 13 μm) as dielectric powder
The first electrode powder was PD (average particle size 0.9 μm).
A dielectric paste was prepared using the binder yarns A-E shown in the table/ζ. However, the S number of the binder is the amount added per raw material powder ioog, and (a) is the ratio of each component to the total amount of the binder. Further, the amount of binder added to the Pd paste was 0.9 times that of the dielectric paste. Further, the amount of terpineol added varies depending on the type of binder.

この添加はペーストの粘度が50000cps(於27
℃)になるように調節した。
This addition increases the viscosity of the paste to 50,000 cps (at 27
℃).

以1・余白 なおエチルセルロース、ポリビニルブチラールは高分子
であるため分子量に%6変化する。ここではエタノール
/トルエン=1/HDIO%溶液の粘度が30〜60 
cpsのものを用いた。
1. Margin: Since ethyl cellulose and polyvinyl butyral are polymers, their molecular weights change by 6%. Here, the viscosity of the ethanol/toluene = 1/HDIO% solution is 30 to 60.
cps was used.

上記ペーストを用いてアルミ箔土に誘電体イーストを印
刷しその土に導体のPdペーストと厚さ25μmの誘電
体ペーストとを交互に10層印刷したのち120℃で6
分間乾燥を行なった。その結果は第2表の如くであった
Dielectric yeast was printed on aluminum foil soil using the above paste, and 10 layers of conductor Pd paste and 25 μm thick dielectric paste were printed on the soil alternately, and then 6 layers were heated at 120℃.
Drying was performed for minutes. The results were as shown in Table 2.

第  2  表 即ち試料Aは誘電体層にピンホールが発生し、試料Eは
取扱性が悪く且っ導体が移動し位置ずれを生じたが、本
発明の%#’fm求範囲内の組成のバインダー系を用い
た試料B、C,Dは何ら問題は生じなかった。
In Table 2, sample A had pinholes in the dielectric layer, and sample E had poor handling and the conductor moved and misaligned, but the composition was within the %#'fm range of the present invention. Samples B, C, and D using the binder system did not cause any problems.

なお、ポリビニルブチラール樹月りおよびフタル酸−n
−ジブチルは主結合剤であるニブA7セルロースの性質
を改善するもので、ともに割れの防止おjびJtaい性
の向上の/こめに添加しているものであるが、ポリビニ
ルプグラールが5弼より少ない場合は割れが発生し易く
なる。フタル酸−n−ツブチルが10チより少ない場合
は柔軟性がなくなシJ佼扱性が悪くなり、35%より多
い場合tユ乾燥速度が遅くなる。また結合剤の添加量が
原オ(粉末100I当り17gより少ない場合は割ルが
発生し易くなシ、35gよシ多い場合にj、乾燥速度が
遅くなシ、また焼成収縮率が大きくなシ過ぎる。
In addition, polyvinyl butyral Jugetsuri and phthalic acid-n
- Dibutyl improves the properties of nib A7 cellulose, which is the main binder, and is added to prevent cracking and improve Jta resistance. When the amount is less, cracks are more likely to occur. If the amount of n-butyl phthalate is less than 10%, flexibility will be lost and handling properties will be poor, and if it is more than 35%, the drying rate will be slow. In addition, if the amount of binder added is less than 17g per 100I of powder, cracks are not likely to occur, and if it is more than 35g, the drying speed is slow, and the firing shrinkage rate is high. Pass.

乾燥速度が遅くなると同一乾燥条件で多層化を行なった
場合、導体ずれが発生−Jる可能性が大きくなる。
If the drying speed is slow, there is a greater possibility that conductor misalignment will occur when multilayering is performed under the same drying conditions.

実施例2 ii表の試料Cのバインダー系をBaTiO3100,
!9に対して0.6 、0.8 、1.2 、1.4倍
添加した誘電体ペーストを作成し導体ペース)Pd10
1’に対し試料Cのバインダー系を0.9倍添加したも
のを用いて、前実施例と同様に多層化を行なった。その
結果0.6倍の場合は多層化中に割れが発生し、1.4
倍の場合は導体の位屑ずれが発生したが、他は問題が発
生し2なかった。
Example 2 The binder system of sample C in Table ii was changed to BaTiO3100,
! A dielectric paste containing 0.6, 0.8, 1.2, and 1.4 times the amount of Pd10 (conductor paste) Pd10 was prepared.
Multilayering was performed in the same manner as in the previous example using a binder system in which sample C was added in a ratio of 0.9 times to 1'. As a result, in the case of 0.6 times, cracks occur during multilayering, and 1.4
In the case of double the number, displacement of the conductor occurred, but no problem occurred in the other cases.

上記の実施例1,2で多層化上問題が生じなかったもの
をパーンアウト後、1350℃で焼成した結果、目的と
する多層構造物が得らfi、た。この時の焼成収縮率t
よ20〜25%であった。
As a result of baking at 1350° C. after punching out those in Examples 1 and 2 that did not cause problems in multilayering, the desired multilayer structure was obtained. Firing shrinkage rate t at this time
It was about 20-25%.

実施例3 実施例1,2では溶剤としてテルピネメールを用いてい
るがテルピネオールの代シにグチルカルピトール、ブチ
ルカルピト−ルアセテートなどのカルピトール、カルピ
トールアセテート類の溶剤を用いても多層化に問題は生
じなかった。
Example 3 In Examples 1 and 2, terpinemer was used as a solvent, but problems in multilayering did not occur even if a solvent such as carpitol or carpitol acetate such as butyl carpitol or butyl carpitol was used instead of terpineol. There wasn't.

(6)発ツ」の効果 以上詳細に説明したように本発明のペースト用バインダ
ー系組成は、セラミックペーストのJlソ扱性を良好と
なし、且つピンホール、割れ等の発生がなく、印刷多層
法による多層セラミック基板、多層セラミックコンデン
サを歩留シよく製造することができ、且つ誘電体のピン
ホールを皆無にすることができるため信頼性も向上され
るといった効果大なるものである。
(6) Effect of ``Starting'' As explained in detail above, the binder composition for the paste of the present invention improves the handling properties of the ceramic paste by JL, and there is no occurrence of pinholes, cracks, etc. This method has great effects in that multilayer ceramic substrates and multilayer ceramic capacitors can be manufactured with high yield, and reliability is also improved because pinholes in the dielectric can be completely eliminated.

特許出願人 富士通株式会社 特許出願代理人 弁理士 官 木   朗 弁理士 西 舘 和 之 弁理士 内 1)幸 男 弁理士 山 口 昭 之patent applicant Fujitsu Limited patent application agent Patent Attorney Official Akira Ki Patent attorney Kazuyuki Nishidate Patent attorney 1) Yukio Patent attorney Akira Yamaguchi

Claims (1)

【特許請求の範囲】[Claims] 1、  エチルセルロース、ポリビニルブチラール、7
タル酸−n−ジプチルよりなる結合剤に分散剤としてポ
リオキシエチレンアルキルアミン界面活性剤を加え、溶
剤としてテルピネオールを加えたペースト用バインダー
系において、前記結合剤はエチルセルロース60〜75
]j[H%、ポリビニルブチラール5〜17.5重量%
、フタル[−n−・シブチル10〜30重量%よシなる
ことを特徴とするペースト用バインダー系組成。
1. Ethyl cellulose, polyvinyl butyral, 7
In a paste binder system in which a polyoxyethylene alkylamine surfactant is added as a dispersant to a binder made of n-diptylate tarate, and terpineol is added as a solvent, the binder is ethyl cellulose 60-75
]j[H%, polyvinyl butyral 5-17.5% by weight
, Phthal [-n-.Sibutyl 10 to 30% by weight.
JP57154496A 1982-09-07 1982-09-07 Binder composition for paste Expired JPS6047314B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57154496A JPS6047314B2 (en) 1982-09-07 1982-09-07 Binder composition for paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57154496A JPS6047314B2 (en) 1982-09-07 1982-09-07 Binder composition for paste

Publications (2)

Publication Number Publication Date
JPS5945373A true JPS5945373A (en) 1984-03-14
JPS6047314B2 JPS6047314B2 (en) 1985-10-21

Family

ID=15585512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57154496A Expired JPS6047314B2 (en) 1982-09-07 1982-09-07 Binder composition for paste

Country Status (1)

Country Link
JP (1) JPS6047314B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
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WO2015107811A1 (en) * 2014-01-17 2015-07-23 昭栄化学工業株式会社 Method for producing binder resin, method for producing resin composition, binder resin, and resin composition
WO2017014295A1 (en) * 2015-07-22 2017-01-26 昭栄化学工業株式会社 Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste
JP2019157089A (en) * 2018-03-16 2019-09-19 住友金属鉱山株式会社 Method for producing organic vehicle and method for producing conductive paste

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015107811A1 (en) * 2014-01-17 2015-07-23 昭栄化学工業株式会社 Method for producing binder resin, method for producing resin composition, binder resin, and resin composition
CN105916928A (en) * 2014-01-17 2016-08-31 昭荣化学工业株式会社 Method for producing binder resin, method for producing resin composition, binder resin, and resin composition
JPWO2015107811A1 (en) * 2014-01-17 2017-03-23 昭栄化学工業株式会社 Binder resin production method, resin composition production method, binder resin and resin composition
US9845397B2 (en) 2014-01-17 2017-12-19 Shoei Chemical Inc. Method for producing binder resin, method for producing resin composition, binder resin, and resin composition
CN105916928B (en) * 2014-01-17 2019-01-08 昭荣化学工业株式会社 The manufacturing method of adhesive resin and the manufacturing method of resin combination and adhesive resin and resin combination
WO2017014295A1 (en) * 2015-07-22 2017-01-26 昭栄化学工業株式会社 Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste
JP6119939B1 (en) * 2015-07-22 2017-04-26 昭栄化学工業株式会社 Binder resin for inorganic particle dispersion paste and inorganic particle dispersion paste
US10392535B2 (en) 2015-07-22 2019-08-27 Shoei Chemical Inc. Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste
JP2019157089A (en) * 2018-03-16 2019-09-19 住友金属鉱山株式会社 Method for producing organic vehicle and method for producing conductive paste

Also Published As

Publication number Publication date
JPS6047314B2 (en) 1985-10-21

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