JP2006210399A - Conductive paste for ceramic electronic component, and ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive paste for a ceramic electronic component which is used to form an external conductor formed on a ceramic blank, can easily control the surface shape of the external conductor, and also can suppress the generation of a cavity on the surface. <P>SOLUTION: The conductive paste for a ceramic electronic component containing a metal powder, a glass powder, an organic binder and organic solvent is a mixed solvent containing a cyclic type terpene system compound solvent. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a conductive paste for ceramic electronic components suitable for forming an outer conductor of a ceramic electronic component, and a ceramic electronic component using the same.

  2. Description of the Related Art A ceramic electronic component, such as a multilayer ceramic capacitor, has an external electrode that is an external conductor formed on the surface of a multilayer ceramic capacitor body that is a ceramic body. Such an external electrode is formed as follows, for example. First, a metal powder, a glass powder, an organic binder and an organic solvent are mixed to prepare a conductive paste, this conductive paste is applied to the surface of the multilayer ceramic capacitor body by a dipping method, and after a binder removal treatment, Bake and bake in a furnace. In general, after this baking, Ni plating is performed, and further, Sn plating or Sn—Pb alloy plating is performed to form external electrodes (see, for example, Patent Document 1).

As the metal powder used for the preparation of the conductive paste, for example, a metal powder such as Ni, Cu, or Ag is used. Further, as the organic binder, for example, cellulose resins such as ethyl cellulose and nitrocellulose, and acrylic resins such as methyl methacrylate and butyl methacrylate are used. Further, the organic solvent is a single system such as butyl cellosolve (bp 170 ° C.), methyl carbitol (bp 194 ° C.), ethyl carbitol (bp 202 ° C.), butyl carbitol (bp 230 ° C.), benzyl alcohol (bp 205 ° C.). , Terpineol (bp 210 ° C.) and the like are used.
Japanese Patent Laid-Open No. 10-177931

  Incidentally, for example, as shown in FIG. 7, in the ceramic electronic component 1 such as a multilayer ceramic capacitor, the shape of the external conductor 3 formed at both ends of the ceramic body 2 is not rounded. It is required to be smooth along the end surface, and the surface portion of the outer conductor 3 is required not to have a dent.

  That is, when the outer conductor 3 of the ceramic electronic component 1 is rounded, for example, when the solder paste is placed on the circuit board and the ceramic electronic component 1 is sequentially placed in a reflow furnace for mounting, the solder is not removed. Therefore, a so-called solder wetting defect that does not sufficiently crawl up the surface of 3 is likely to occur, or a so-called tombstone phenomenon in which one of the external conductors 3 at both ends is separated from the circuit board. Further, if there is a dent in the surface portion of the outer conductor 3 of the ceramic electronic component 1, when the mounting is performed as described above, the solder crawl-up stops at the dent portion, resulting in a solder wetting defect.

  Such indentation in the outer conductor 3 occurs in the process of applying and drying the conductive paste, and is likely to occur when a single organic solvent is used as the organic solvent of the conductive paste. For this reason, it is conceivable to use two or more organic solvents to make a conductive paste, but even if two or more organic solvents are simply mixed together, the overall shape can be reduced even if the generation of dents on the surface portion can be suppressed. It does not have a flat shape, but a rounded so-called ship bottom shape.

  The present invention has been made to solve the above-described problems, and relates to a conductive paste for a ceramic electronic component used for forming an outer conductor formed on a ceramic element body. It is an object of the present invention to provide a conductive paste for a ceramic electronic component that can be easily controlled and hardly causes a dent on a surface portion, and a ceramic electronic component using the same.

The conductive paste for a ceramic electronic component of the present invention is a conductive paste for a ceramic electronic component comprising a metal powder, a glass powder, an organic binder, and an organic solvent, wherein the organic solvent comprises (A) the following chemical formula (1) ) And a monoacetate compound represented by the following chemical formula (2), and a cyclic terpene compound solvent containing a diacetate compound represented by the following chemical formula (3), and (B) the following chemical formula (4) It is a mixed solvent containing the cyclic terpene-type compound solvent shown by these.

  The cyclic terpene compound solvent of the component (A) used in the conductive paste for ceramic electronic parts of the present invention contains 70% by weight or more and less than 90% by weight of the diacetate body represented by the chemical formula (3). It is preferable. The organic solvent containing the cyclic terpene compound solvent of the component (A) and the cyclic terpene compound solvent of the component (B) is 10% by weight or more of the cyclic terpene compound solvent of the component (A). 20% by weight or less is preferable.

  The ceramic electronic component of the present invention is a ceramic electronic component in which an outer conductor is formed on the surface of a ceramic body, and the conductive paste for a ceramic electronic component as described above is applied to the surface of the ceramic body. It is characterized by being formed by baking.

  According to the present invention, the organic solvent in the conductive paste for ceramic electronic parts is a mixed solvent containing the cyclic terpene compound solvent of the component (A) and the cyclic terpene compound solvent of the component (B) as described above. Thus, for example, when the outer conductor is formed on the ceramic body, the shape thereof can be made smooth and not rounded, and the occurrence of a dent in the surface portion can also be suppressed. In addition, by producing a ceramic electronic component using such a conductive paste for ceramic electronic components, it is possible to obtain a ceramic electronic component that is less likely to cause a tombstone phenomenon and is excellent in mountability.

Hereinafter, the conductive paste for ceramic electronic components of the present invention will be described. The conductive paste for a ceramic electronic component of the present invention is a conductive paste for a ceramic electronic component comprising a metal powder, a glass powder, an organic binder, and an organic solvent, and the organic solvent comprises (A) the following chemical formula (1) ) And a monoacetate compound represented by the following chemical formula (2), and a cyclic terpene compound solvent containing a diacetate compound represented by the following chemical formula (3), and (B) the following chemical formula (4) It is a mixed solvent containing the cyclic terpene-type compound solvent shown by these. In the following chemical formulas (1) to 3, Ac represents an acetyl group (CH ₃ CO—).

  The metal powder used in the present invention is not particularly limited, and is selected from, for example, a single metal element composed of one metal element selected from silver, palladium, gold, platinum, nickel and copper, or the metal element group. Examples thereof include powders made of an alloy containing at least one metal element. Only one kind of metal powder composed of such a simple metal or alloy may be used, or two or more kinds may be mixed and used.

  The metal powder is more preferably composed of two kinds of average particle diameters, a spherical powder having an average particle diameter of 0.1 μm to 0.5 μm and a spherical powder having an average particle diameter of 0.8 μm to 2.0 μm. By using two types of spherical metal powders having different average particle diameters, it is possible to form an outer conductor that is filled with metal powder at a high density and has excellent electrical characteristics and uniform characteristics.

  For spherical powders with an average particle size of 0.1 μm or more and 0.5 μm or less and spherical powders with an average particle size of 0.8 μm or more and 2.0 μm or less, the particle size distribution is D10, 50% Is more preferable if it satisfies (D90−D10) / D50 ≦ 3, where D is D50 and the 90% particle diameter is D90. By setting the particle size distribution of each spherical powder to such a value, it is possible to form an outer conductor that is further filled with metal powder at a high density and has excellent electrical characteristics and uniform characteristics.

  As described above, when the metal powder is composed of two different average particle sizes, the spherical powder having an average particle size of 0.8 μm or more and 2.0 μm or less is 70% by weight out of the total amount of metal powder of 100% by weight. The above is preferable. By making the spherical powder with an average particle size of 0.8 μm or more and 2.0 μm or less 70% by weight or more, it is possible to form an outer conductor that is filled with metal powder at high density and has excellent electrical characteristics and uniform characteristics. It becomes.

  The spherical powder having an average particle size of 0.8 μm or more and 2.0 μm or less is more preferably 90% by weight or less of the total amount of the metal powder. If the spherical powder having an average particle size of 0.8 μm or more and 2.0 μm or less exceeds 90% by weight, it is not preferable because the metal powder is not sufficiently filled when the outer conductor is formed, and the electric characteristics vary.

  The content of the metal powder in the conductive paste for ceramic electronic components is preferably 60% by weight or more and 90% by weight or less of the entire conductive paste for ceramic electronic components. If it is less than 60% by weight, pores and cracks are likely to occur in the outer conductor, and the electrical characteristics are also deteriorated, which is not preferable. On the other hand, if the content exceeds 90% by weight, the content of the glass powder is relatively reduced, and firing at the time of forming the outer conductor becomes difficult.

  The glass powder used in the present invention is added to facilitate firing when an external conductor is produced using a conductive paste for ceramic electronic components. The average particle size of the glass powder is preferably 5.0 μm or less. When the average particle size of the glass powder exceeds 5.0 μm, the dispersibility in the conductive paste for ceramic electronic components is deteriorated, and when the external conductor is formed, the electric characteristics are likely to vary, which is not preferable.

  As the glass powder, borate glass, silicate glass, borosilicate glass, or the like is used. More specifically, bismuth borate glass, bismuth borosilicate glass, zinc borosilicate glass, or the like is used.

  The content of the glass powder in the conductive paste for ceramic electronic parts is preferably 5% by weight or more and 15% by weight or less with respect to the entire conductive paste for ceramic electronic parts. When the content is less than 5% by weight, the effect of facilitating the firing of the conductive paste for ceramic electronic components is low. When the content exceeds 15% by weight, the conductive paste for ceramic electronic components is fired to form an external conductor. Since the glass component covers the surface of the outer conductor and plating is difficult, it is not preferable.

  As the organic binder used in the present invention, those mainly composed of an iso-butyl methacrylate resin having a molecular weight of 100,000 to 900,000 are preferably used. When the molecular weight of the iso-butyl methacrylate resin is less than 100,000, when the external conductor is formed by firing the conductive paste for ceramic electronic parts, the shape of the external conductor is difficult to be a predetermined shape, and the molecular weight exceeds 900,000. Things take time to produce and are generally difficult to become products.

  As the organic binder, another resin may be used together with the iso-butyl methacrylate resin. In this case, the iso-butyl methacrylate resin is preferably 90% by weight or more with respect to 100% by weight of the total amount of the organic binder. By making such a range, when the conductive paste for ceramic electronic components is baked to form the outer conductor, the shape of the outer conductor is likely to be a predetermined shape, and the organic binder can be sufficiently removed, Generation of pores and cracks can be suppressed.

  As other resins used together with the iso-butyl methacrylate resin, for example, acrylic resins other than the iso-butyl methacrylate resin, specifically, those obtained by polymerizing acrylic acid, methacrylic acid and esters thereof can be used. .

  Examples of acrylic esters include methyl acrylate, ethyl acrylate, n-butyl acrylate, iso-butyl acrylate, tert-butyl acrylate, 2-ethylhexyl acrylate, glycidyl acrylate, and methyl glycidyl acrylate. Examples thereof include methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, tert-butyl methacrylate, 2-ethylhexyl methacrylate, and glycidyl methacrylate.

  The content of the organic binder in the conductive paste for ceramic electronic parts is preferably 2% by weight or more and 15% by weight or less in 100% by weight of the entire conductive paste for ceramic electronic parts. When the organic binder content is less than 2% by weight, it is difficult to form a paste and it is difficult to apply to the ceramic body. When the organic binder content exceeds 15% by weight, the conductive paste for ceramic electronic components is used. When the outer conductor is formed by baking, the shape of the outer conductor does not become a predetermined shape, and the organic binder is not sufficiently removed, and pores and cracks are generated.

  The organic solvent used in the present invention is a mixed solvent containing the cyclic terpene compound solvent as the component (A) and the cyclic terpene compound solvent as the component (B) as described above. The cyclic terpene compound solvent of the component (A) includes at least one of the monoacetate compounds represented by the chemical formula (1) and the chemical formula (2), and is a diacetate compound represented by the chemical formula (3). Is included. Further, the cyclic terpene compound solvent of the component (B) contains the cyclic terpene compound represented by the chemical formula (4).

  In the present invention, a mixed solvent containing the cyclic terpene compound solvent of the component (A) and the cyclic terpene compound solvent of the component (B) is used as the organic solvent of the conductive paste for ceramic electronic components. For example, when an external conductor is formed by applying to a ceramic body and firing, the shape of the external conductor can be made smooth and rounded, and the generation of dents on the surface portion is suppressed. be able to.

  The organic solvent as such a mixed solvent preferably contains 10% by weight or more and 20% by weight or less of the cyclic terpene compound solvent of the component (A). When the content of the cyclic terpene compound solvent of the component (A) is less than 10% by weight, the content of the cyclic terpene compound solvent of the component (A) is too small, so that the effect as a mixed solvent hardly appears. When the outer conductor is formed on the ceramic body using the conductive paste for ceramic electronic components, there is a possibility that a dent will occur in the outer conductor. On the other hand, if the content of the cyclic terpene compound solvent of the component (A) exceeds 20% by weight, the content of the cyclic terpene compound solvent of the component (A) is too large, so that the conductive paste for ceramic electronic components When the external conductor is formed on the ceramic body, the shape of the external conductor may not be a predetermined shape.

  The cyclic terpene compound solvent of the component (A) preferably contains 70% by weight or more and less than 90% by weight of the diacetate compound represented by the chemical formula (3). When the content of the diacetate compound represented by the chemical formula (3) in the cyclic terpene compound solvent of the component (A) is less than 70% by weight, the viscosity of the cyclic terpene compound solvent of the component (A) becomes low, When the conductive paste for ceramic electronic components including this is applied on the ceramic body and fired to form the external conductor, the shape may not be a predetermined shape. On the other hand, when the content is 90% by weight or more, the viscosity of the cyclic terpene compound solvent of the component (A) is increased, and the conductive paste for ceramic electronic parts is applied on the ceramic body and fired to obtain an external conductor. When the is formed, there is a possibility that the shape becomes difficult to be a predetermined shape.

  Further, the cyclic terpene compound solvent of the component (A) includes a monoacetate compound represented by the chemical formula (1) or the chemical formula (2) in addition to the diacetate compound represented by the chemical formula (3). The monoacetate represented by (1) or chemical formula (2) may contain only one or both. Furthermore, the cyclic terpene compound solvent of the component (A) may contain a compound that is not an acetate body. In this case, the content of the non-acetate compound in the cyclic terpene compound solvent of the component (A) Is preferably 10% by weight or less.

  The organic solvent used in the present invention is preferably a mixed solvent comprising only the cyclic terpene compound solvent of the component (A) and the cyclic terpene compound solvent of the component (B) as described above. Accordingly, other organic solvents generally used in this type of conductive paste for ceramic electronic components can be added as long as they do not contradict the spirit of the present invention.

  Examples of other organic solvents include dioxane, toluene, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl cellosolve acetate, butyl carbitol, butyl carbitol acetate, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, and diacetone alcohol. It is done. When such other organic solvent is added, 100% by weight of the total organic solvent comprising the cyclic terpene compound solvent of component (A) and the cyclic terpene compound solvent of component (B), and the other organic solvent Among them, the other organic solvent is preferably 5% by weight or less.

  The organic solvent used in the present invention varies depending on the desired viscosity of the conductive paste for ceramic electronic parts, but for example, 5% by weight or more, 25% by weight in 100% by weight of the entire conductive paste for ceramic electronic parts. % Or less is preferable.

  The conductive paste for ceramic electronic parts of the present invention can be obtained by adding the above-described metal powder, glass powder, and organic binder as essential components, further adding an organic solvent, and mixing to obtain a paste. In addition, in the electroconductive paste for ceramic electronic components of this invention, you may add another component in the range which is not contrary to the objective of this invention as needed.

  Such a conductive paste for ceramic electronic parts preferably has a viscosity of 20 to 100 Pa · s (E-type viscometer, 3 ° cone, 25 ° C.). In order to adjust the viscosity of the conductive paste for ceramic electronic components to such a range, for example, it is performed by adjusting the addition amount of metal powder, glass powder, organic binder and organic solvent within the above-described range. it can.

  The conductive paste for ceramic electronic parts of the present invention can be used when forming an external conductor on a ceramic body in various ceramic electronic parts. As the ceramic electronic component, for example, a multilayer ceramic capacitor can be cited, and when forming an external electrode as an external conductor on a multilayer ceramic capacitor body which is a ceramic body, by using the conductive paste for ceramic electronic component of the present invention, Thus, an external electrode can be formed in which the formation of a dent in the surface portion is suppressed.

  Next, production of a ceramic electronic component using the conductive paste for ceramic electronic component of the present invention will be described. Hereinafter, a multilayer ceramic capacitor will be described as an example of a ceramic electronic component.

  In the production of the multilayer ceramic capacitor, a known method for producing a multilayer ceramic capacitor can be applied except that the conductive paste for a ceramic electronic component of the present invention is used as the conductive paste.

  That is, first, a dielectric ceramic raw material powder such as barium titanate is used as a slurry, and the slurry is formed into a sheet to produce a ceramic green sheet. The internal electrode is formed on the ceramic green sheet by applying a known internal electrode material directly on the ceramic green sheet in a desired pattern using screen printing, an inkjet method, or the like.

  For example, about 30 to 500 ceramic green sheets on which internal electrodes are formed as described above are laminated, and then heat treated at a predetermined temperature and time to obtain a laminated ceramic capacitor body (sintered body). The multilayer ceramic capacitor main body thus obtained is polished at both ends, and only odd-numbered internal electrodes are exposed at one end, and only even-numbered internal electrodes are exposed at the other end.

  The formation of the external electrode at each end of the multilayer ceramic capacitor body is performed by applying the conductive paste for ceramic electronic components of the present invention to the end by a dipping method and drying, for example, at 700 to 900 ° C. for 30 minutes to It can be carried out by heat treatment for about 2 hours and baking. Further, the surface of the external electrode can be subjected to nickel plating, tin plating or the like for improving the solderability as required to obtain a multilayer ceramic capacitor.

(Examples 1-11, Comparative Examples 1-5)
As an organic binder, an acrylic resin binder iBMA (both manufactured by Negami Kogyo Co., Ltd.) having a weight average molecular weight of 740,000 or 200,000 was prepared. As an organic solvent for dissolving the organic binder, a cyclic terpene compound solvent of component (A), a cyclic terpene compound solvent of component (B), butyl cellosolve, and benzyl alcohol were prepared.

  The cyclic terpene compound solvent of component (A) is a cyclic terpene compound comprising a mixture of monoacetate compounds represented by chemical formulas (1) and (2) and a diacetate compound represented by chemical formula (3). It is a solvent. As the cyclic terpene compound solvent of the component (A), the content of the diacetate represented by the chemical formula (3) is 90% by weight or more (manufactured by Nippon Terpene Chemical Co., Ltd., TH-DAc-90), 70 50% by weight or more and less than 90% by weight (manufactured by Nippon Terpene Chemical Co., TH-DAc-70), 50% by weight or more and less than 70% by weight (manufactured by Nippon Terpene Chemical Co., Ltd., TH-DAc-50) Four types (TH-DAc-30, manufactured by Nippon Terpene Chemical Co., Ltd.) were used. Further, terpineol (Tarpineol, manufactured by Yasuhara Chemical Co., Ltd.) was used as the cyclic terpene compound solvent represented by the chemical formula (4) of the component (B).

  And about Examples 1-11, the cyclic terpene type compound solvent of (A) component and the cyclic terpene type compound solvent of (B) component are mixed so that it may become a ratio as shown in Table 1. After obtaining an organic solvent (mixed solvent), an organic binder was added and mixed to obtain a binder solution. Moreover, about Comparative Examples 1-5, only either one of the cyclic terpene type compound solvent of (A) component or the cyclic terpene type compound solvent of (B) component is used so that it may become a ratio as shown in Table 2. A binder solution was obtained using an organic solvent containing or not containing any of the above.

  Furthermore, the glass powders having an average particle diameter of 3 μm, the average particle diameters of 0.3 μm, 1.3 μm, 3.0 μm and flakes were added to the binder liquids of Examples and Comparative Examples so as to have the ratios shown in Tables 1 and 2. Two types of copper powder selected from among the shapes were added, dispersed with three rolls, and kneaded to obtain a copper paste (conductive paste for ceramic electronic parts).

  Next, a 1005-type chip is prepared as the ceramic capacitor body, and the copper pastes of the examples and comparative examples are attached to both ends of the ceramic capacitor body by the dipping method, and then the drying and firing processes are performed to form external electrodes. Thus, a ceramic capacitor was obtained.

  The ceramic capacitor thus obtained was evaluated for its external electrode shape, thickness, dent generation amount, and solder wetting, and comprehensive evaluation was performed based on these. Each evaluation was performed as follows. The results are shown in Tables 1 and 2.

(Shape evaluation)
For each of the 50 ceramic capacitors of the examples and comparative examples, the surface portion and the cross-sectional portion of the external electrode were observed using a microscope, and the occurrence of a depression and the cross-sectional shape in the surface portion were observed. The shape that was the most average in each example and comparative example was defined as the shape of the example and comparative example. Moreover, the pass / fail of the shape evaluation of each Example and the comparative example made pass what passed the shape demonstrated by the following FIG. 1, and made the other fail.

  The four types of shapes are as shown in FIGS. 1 to 4 are cross-sectional views showing one end portion of the ceramic capacitor 1, showing a state in which the external electrode 3 is formed on the ceramic capacitor body 2. FIG. 1 shows the most preferable shape of the external electrode 3, which shows that the external electrode 3 is smooth without being rounded, and that there is no dent in the surface portion. FIG. 2 shows that although the external electrode 3 is smooth without being rounded, a dent 4 is generated on the surface thereof. FIG. 3 shows that the surface portion of the external electrode 3 was not rounded but rounded. FIG. 4 shows that the external electrode 3 is rounded and a dent 4 is generated on the surface thereof.

(Thickness evaluation)
As shown in FIGS. 1 to 4, the thickness T from the end portion of the ceramic capacitor body 2 to the surface portion of the external electrode 3 formed on the surface of each of the 50 ceramic capacitors of the example and the comparative example is determined. Measured and averaged them. The thickness T is the maximum thickness measured. For example, as shown in FIGS. 3 and 4, when the external electrode 3 is rounded or has a dent, The thickness T was defined as the distance to the most protruding portion having a thickness of. In the pass / fail evaluation of the thicknesses of the examples and comparative examples, those having an average thickness of the external electrode of 40 μm or less were accepted.

(Evaluation of amount of indentation)
For each of the ten ceramic capacitors of the examples and comparative examples, the surface portion of the external electrode was observed with a microscope, and the number of samples in which the occurrence of dents was observed was measured (p / 10). For the evaluation of the dent generation amount in each of the examples and the comparative examples, the dent generation amount was 0/10 (the sample in which the dent was generated was none).

(Solder wetting evaluation)
For each of the 200 ceramic capacitors of the example and comparative example, cream solder and this ceramic capacitor were placed in this order on the circuit board, and then mounted in a reflow furnace. As shown in FIGS. 5 and 6, when the height of the external electrode 3 is 100%, the height of the solder 6 scooping up from the surface of the circuit board 5 along the surface of the external electrode 3 is less than 50%. The ratio of occurrence of solder wettability was defined as the solder wettability rate. The pass / fail of the solder wettability evaluation of each example and comparative example was determined to be acceptable if the solder wettability rate was 1% or less.

(Comprehensive evaluation)
In the evaluation of the above shape, thickness, amount of dents and solder wetting, all evaluations were accepted as comprehensive evaluations, and if there was even one failure, the overall evaluation was rejected. .

  As is clear from Tables 1 and 2, as in the copper pastes of Examples 1 to 11, the cyclic terpene compound solvent of the component (A) and the cyclic terpene system of the component (B) as described above as the organic solvent. It was confirmed that any of the mixed solvents composed of the compound solvent had a smooth external electrode shape, suppressed the formation of dents on the surface portion, and was excellent in solder wetting.

  On the other hand, like the copper pastes of Comparative Examples 1 to 5, those containing only one of the cyclic terpene compound solvent of the component (A) or the cyclic terpene compound solvent of the component (B) as the organic solvent, In addition, it was recognized that those not containing either were inferior in solder wetting due to the rounded bottom shape of the external electrodes or the formation of dents on the surface.

Sectional drawing which showed an example of the shape of the external electrode of a ceramic capacitor. Sectional drawing which showed the other example of the shape of the external electrode of a ceramic capacitor. Sectional drawing which showed the other example of the shape of the external electrode of a ceramic capacitor. Sectional drawing which showed the other example of the shape of the external electrode of a ceramic capacitor. Sectional drawing which showed an example of the solder wettability evaluation of a ceramic capacitor. Sectional drawing which showed the other example of the solder wettability evaluation of a ceramic capacitor. Sectional drawing which showed the preferable shape of the external electrode of a ceramic capacitor.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Ceramic capacitor (ceramic electronic component), 2 ... Ceramic capacitor body (ceramic body), 3 ... External electrode (external conductor), 4 ... Indentation, 5 ... Circuit board, 6 ... Solder

Claims (4)

A conductive paste for a ceramic electronic component comprising a metal powder, a glass powder, an organic binder and an organic solvent,
Cyclic terpene system in which the organic solvent includes (A) at least one of monoacetates represented by the following chemical formula (1) and the following chemical formula (2) and a diacetate represented by the following chemical formula (3) A conductive paste for ceramic electronic parts, which is a mixed solvent containing a compound solvent and (B) a cyclic terpene compound solvent represented by the following chemical formula (4).

  2. The ceramic electronic component according to claim 1, wherein the cyclic terpene compound solvent of the component (A) contains 70 wt% or more and less than 90 wt% of the diacetate represented by the chemical formula (3). 3. Conductive paste.   The conductive paste for ceramic electronic components according to claim 1 or 2, wherein the organic solvent contains 10% by weight or more and 20% by weight or less of the cyclic terpene compound solvent of the component (A).   4. A ceramic electronic component having an outer conductor formed on a surface of a ceramic body, wherein the outer conductor is formed by applying the conductive paste for a ceramic electronic component according to claim 1 to the surface of the ceramic body. 5. A ceramic electronic component, wherein the ceramic electronic component is formed by applying to and baking.

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