JPS5945090A - Laser condenser in laser working machine - Google Patents
Laser condenser in laser working machineInfo
- Publication number
- JPS5945090A JPS5945090A JP57155444A JP15544482A JPS5945090A JP S5945090 A JPS5945090 A JP S5945090A JP 57155444 A JP57155444 A JP 57155444A JP 15544482 A JP15544482 A JP 15544482A JP S5945090 A JPS5945090 A JP S5945090A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- cylinder
- pressure
- nozzle
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、レーザー加工機のレーザー集光装置の改良に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a laser focusing device for a laser processing machine.
従来のレーザー加工機におけるレーザー集光装置では、
レーザー光の焦点位置が加工物に対して固定である為、
厚さの違う加工物を加工する場合には、加工物の厚さに
応してそのつどレーサー光の焦点位置を調整しなければ
ならない煩雑さがあった・
また、加工物に反りがあったり、表面に凹凸がある場合
には、最適の焦点位置での加工ができない等の欠陥があ
った。In the laser focusing device in conventional laser processing machines,
Because the focal position of the laser beam is fixed relative to the workpiece,
When machining workpieces with different thicknesses, there is the hassle of having to adjust the focus position of the laser beam each time according to the thickness of the workpiece.In addition, the workpiece may warp. If the surface is uneven, there are defects such as the inability to perform processing at the optimal focal position.
本発明においては、現在レーサー加工時に常用されてい
るアシス1−ガスの圧力を利用し、特別の検出手段及び
駆シj源を用いることなく、レーザー光の焦点位置を加
]−物に対して自動的に一定位置に保つことにより、前
記の欠点を解消することを目的とするレーザー集光装置
を提供することにある。In the present invention, the focus position of the laser beam is adjusted by using gas pressure, which is currently commonly used in laser processing, without using any special detection means or drive source. It is an object of the present invention to provide a laser condensing device which aims to eliminate the above-mentioned drawbacks by automatically maintaining a constant position.
以下、本発明の一実施例を図面に基づいて説明する。Hereinafter, one embodiment of the present invention will be described based on the drawings.
第1図は、本発明に係るレーザー集光装置の一実施例を
示す全体図である。FIG. 1 is an overall view showing an embodiment of a laser focusing device according to the present invention.
圧縮気体容器1には、レーザー加工時に加工物に対して
噴射され仝高圧ガスが充填されており、該圧縮気体容器
1から噴射された高圧ガスは、圧力調節弁2を通り、一
定の圧力に設定され、その時の圧力は、圧力側3によっ
て表示される。The compressed gas container 1 is filled with high-pressure gas that is injected onto the workpiece during laser processing, and the high-pressure gas injected from the compressed gas container 1 passes through a pressure control valve 2 to maintain a constant pressure. The current pressure is displayed by the pressure side 3.
」二記圧力調節弁2を通った高圧ガスは、次に流量調節
弁4を通り、最後に、レーザー加工機の導光筒7の外周
に98されたガス導入口8及び」二記導光筒7に嵌合せ
るノズル筒10の軸方向に穿設された案内溝10aを通
りノズル筒10の中空部内に導入され、該ノズル筒10
の先端に形成されたノズル5により加」二物11に向し
ブて噴射される。。The high-pressure gas that has passed through the pressure regulating valve 2 described in "2" then passes through the flow rate regulating valve 4, and finally passes through the gas inlet 8 provided on the outer periphery of the light guide tube 7 of the laser processing machine and the light guide described in "2". The nozzle tube 10 is inserted into the hollow part of the nozzle tube 10 through a guide groove 10a bored in the axial direction of the nozzle tube 10 that fits into the tube 7.
A nozzle 5 formed at the tip of the ink jets the liquid toward the additional material 11. .
尚、流量調節弁4とノズル1¥’i31. Oの先端に
形成されたノズル5との間に生ずる圧力は、圧力n16
によって表示される。In addition, the flow rate control valve 4 and the nozzle 1\'i31. The pressure generated between the O and the nozzle 5 formed at the tip is the pressure n16
displayed by.
また、ノズル筒10内には、先端に形成されたノズル5
と同軸上に集光レンズ12が配置され、導光筒7内に配
置された全反射ミラー1Gによって反射したレーザー光
線15は該4.V光レンズ12で集光された後、ノズル
5の中心より加工物J1に照射される。Further, inside the nozzle cylinder 10, there is a nozzle 5 formed at the tip.
A condensing lens 12 is disposed coaxially with the laser beam 15 reflected by the total reflection mirror 1G disposed within the light guiding tube 7. After the light is focused by the V-light lens 12, it is irradiated from the center of the nozzle 5 onto the workpiece J1.
更に、ノズル筒】0は、該ノズル筒lOの案内(7り1
0a内に導光筒7に設けられた摺動ス1ヘソパー9が摺
動自在に挿入されていることから、導光筒7に対して軸
方向に摺動自在となっており、また、該ノズル筒]0と
導光筒7との間には釣合いはね13か弾装されていると
ころから、ノズル筒10の自重は釣合いばね13を介し
て導光筒7によって支えられている。Furthermore, the nozzle cylinder]0 is the guide (7ri1) of the nozzle cylinder lO.
Since the slider 9 provided on the light guide tube 7 is slidably inserted into the inside of the light guide tube 7, it is slidable in the axial direction with respect to the light guide tube 7. Since a balance spring 13 is mounted between the nozzle tube] 0 and the light guide tube 7, the weight of the nozzle tube 10 is supported by the light guide tube 7 via the balance spring 13.
次に、」二記のように構成されたレーザー集光装置に於
ける流量調節弁4とノズル5との間の圧力Poとノズル
@10の先端と加工物11との間の距離Qとの関係につ
いて説明する。Next, the pressure Po between the flow control valve 4 and the nozzle 5 in the laser condensing device configured as described in section 2 and the distance Q between the tip of the nozzle @10 and the workpiece 11 are calculated. Explain the relationship.
レーザー加工機に使用さオしるガスは一般に高圧である
ため流量調節弁4と先端ノズル5を通るガスは断熱膨張
を起こす。この時11次式の関係式が成り立つことが知
られている。Since the gas used in the laser processing machine is generally at high pressure, the gas passing through the flow control valve 4 and the tip nozzle 5 undergoes adiabatic expansion. At this time, it is known that an 11th order relational expression holds true.
但し、a4:流量調節弁4の流路断面積a :先端ノズ
ル5と加工物11との間の流路断面積
P :大気圧
PA:圧力側3によって示されるカス圧力Pc:圧力計
6によって示されるガス圧力γ :断熱指数
7−84 r PC+ PA + γを一定とすれ
ば、前人より次の関係式が導かわる。However, a4: Flow passage cross-sectional area of the flow rate control valve 4 a: Flow passage cross-sectional area between the tip nozzle 5 and the workpiece 11 P: Atmospheric pressure PA: The scum pressure indicated by the pressure side 3 Pc: According to the pressure gauge 6 Indicated gas pressure γ: adiabatic index 7-84 r PC+PA+If γ is constant, the following relational expression can be derived from the previous person.
a =f (PC) 又、a5は下式によって表わされる。a = f (PC) Further, a5 is expressed by the following formula.
a =πa5Q 但し、π :円周率 (J5:先端ノズル径 Q :先端ノズル5より加工物1.1までの距離 従って、次の関係式が成り立つ。a = πa5Q However, π: Pi (J5: Tip nozzle diameter Q: Distance from tip nozzle 5 to workpiece 1.1 Therefore, the following relational expression holds.
氾=に−f(PC) 但し、K = ] / x d 5 =const、。Flood=ni-f (PC) However, K = ] / x d 5 = const.
即ち、圧力I)cをある値に設定すれば、距1JIt、
Qも自づど一定に定まることになる。従って、流量調
節弁4により圧力PCを調節す扛ば、ノズル筒lOは導
光筒7に対して上下方向に摺動自在であり、且つ釣合い
ばね13を介して導光筒7に支えられているので、ノズ
ル筒10が軸方向に上下し、希望の距離Qに設定するこ
とが可能となり、加工進行中に加工物の表面に凹凸か、
llする場合には、その凹凸に追従してノズル筒]、O
が上下に動き、距訓Qが常に一定に保たれるので、集光
レンズJ2の焦点位1はも加」−物の上面に苅して常に
一定位置に保たれる。また、ノズル筒10と導光筒7と
の間に弾装された釣合いばね13のばね力を調整可能と
し、ガス噴射圧力とのバランスを変えることにより、圧
力1〕、の調節による距fi’i Qの設定範囲を広げ
ることも可能となる。更に、導光筒7に取り付けたスト
ッパー14により、ノズル筒10を導光筒7に対して固
定すれば従来の焦点位置固定方式としての使用も可能で
ある。That is, if the pressure I)c is set to a certain value, the distance 1JIt,
Q will also become fixed by itself. Therefore, when the pressure PC is adjusted by the flow rate control valve 4, the nozzle tube lO can freely slide vertically with respect to the light guide tube 7, and is supported by the light guide tube 7 via the balance spring 13. As a result, the nozzle tube 10 moves up and down in the axial direction, making it possible to set the desired distance Q.
ll, the nozzle tube follows the unevenness], O
moves up and down, and the distance Q is always kept constant, so the focal point 1 of the condenser lens J2 is always kept at a constant position as it is placed above the top surface of the object. In addition, the spring force of the balancing spring 13 elastically mounted between the nozzle tube 10 and the light guide tube 7 can be adjusted, and by changing the balance with the gas injection pressure, the distance fi' can be adjusted by adjusting the pressure 1]. It is also possible to widen the setting range of iQ. Furthermore, if the nozzle tube 10 is fixed to the light guide tube 7 using the stopper 14 attached to the light guide tube 7, it can also be used as a conventional focal position fixing method.
本発明は以上のように構成される所から、(1)特別な
駆動源を必要とせず低コス1−で軽量。The present invention is configured as described above, and has the following advantages: (1) It does not require a special driving source, is low in cost, and is lightweight.
小型の焦点位置自動調節可能なレーザー集光装置が実現
できる。A compact laser focusing device that can automatically adjust the focal position can be realized.
(2)加工物の表面に凹凸がある場合やシート、板材な
どの表面に反り等がある場合でも、レーザー光の焦点位
置が加工物の表面に対して常に最適な位置に保たれる。(2) Even if the surface of the workpiece is uneven or the surface of a sheet, plate, etc. is warped, the focal position of the laser beam can always be maintained at an optimal position relative to the workpiece surface.
(3)現行の人手によるめんどうな焦点位置合わせ作業
が不用になる。(3) The current laborious manual focus positioning work is no longer necessary.
(4)大凧生産用のレーザー加工装置に組込むこと1;
よって生産システムの自動化が容易になる。(4) Incorporation into laser processing equipment for large kite production 1;
Therefore, automation of the production system becomes easy.
などの効果を有するものである。It has the following effects.
第1図は本発明に係るレーザー欽光装置の一実施例を示
す全体図である。FIG. 1 is an overall view showing an embodiment of a laser beam illumination device according to the present invention.
Claims (1)
調節する手段と、前記のガス圧力の調節によりレーザー
光の加工物に対する焦点位置が設定でき、加工進行中は
加工物の凹凸に追従して前記設定位置を一定に保つ自動
焦点設定手段とから成ることを特徴とするレーザー加工
機におけるレーザー集光装置。 2 加工物にガスを噴射する手段が、圧縮気体容器と圧
力調節弁とから成ることを特徴とする特許請求の範囲第
1項記載のレーザー加工機におけるレーザー集光装置。 3 ガス圧力を調節する手段が、流量調節弁とから成る
ことを特徴とする特許請求の範囲第1項記載のレーザー
加工機におけるレーザー集光装置。 4 上記自動焦点設定手段が、レーザー光線の導光筒と
該導光筒に摺動自在に嵌合する中空なノズル筒とから成
り、該ノズル筒内には該ノズル筒の先端に形成されたノ
ズルと同軸上にあって」二記レーザー光線を加工物に集
光させる集光レンズが配置され、該ノズル筒は、釣合い
ばねを介して上記導光筒に支えられていることを特徴と
する特許請求の範囲第1項記戦のレーザー加工機におけ
るレーザー集光装置。[Claims] 1. Means for injecting gas onto the workpiece, means for adjusting the gas pressure, and adjusting the gas pressure allows the focal position of the laser beam to be set with respect to the workpiece, and during processing, the focus position of the laser beam can be set. 1. A laser focusing device for a laser processing machine, comprising automatic focus setting means that follows the irregularities of a workpiece and keeps the set position constant. 2. A laser focusing device in a laser processing machine according to claim 1, wherein the means for injecting gas to the workpiece comprises a compressed gas container and a pressure regulating valve. 3. A laser focusing device in a laser processing machine according to claim 1, wherein the means for adjusting the gas pressure comprises a flow control valve. 4. The automatic focus setting means comprises a light guide tube for the laser beam and a hollow nozzle tube that is slidably fitted into the light guide tube, and a nozzle formed at the tip of the nozzle tube is inside the nozzle tube. A condensing lens is disposed coaxially with the laser beam and condenses the laser beam onto the workpiece, and the nozzle tube is supported by the light guide tube via a balance spring. Laser condensing device for laser processing machines in scope 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57155444A JPS5945090A (en) | 1982-09-07 | 1982-09-07 | Laser condenser in laser working machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57155444A JPS5945090A (en) | 1982-09-07 | 1982-09-07 | Laser condenser in laser working machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5945090A true JPS5945090A (en) | 1984-03-13 |
Family
ID=15606165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57155444A Pending JPS5945090A (en) | 1982-09-07 | 1982-09-07 | Laser condenser in laser working machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5945090A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6122278U (en) * | 1984-07-10 | 1986-02-08 | 日本たばこ産業株式会社 | Laser hole drilling device |
JPS62134984A (en) * | 1985-12-09 | 1987-06-18 | Matsushita Electric Ind Co Ltd | Carbon dioxide gas laser working method |
WO2019093148A1 (en) * | 2017-11-07 | 2019-05-16 | 村田機械株式会社 | Laser processing machine and focus adjustment method |
-
1982
- 1982-09-07 JP JP57155444A patent/JPS5945090A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6122278U (en) * | 1984-07-10 | 1986-02-08 | 日本たばこ産業株式会社 | Laser hole drilling device |
JPS62134984A (en) * | 1985-12-09 | 1987-06-18 | Matsushita Electric Ind Co Ltd | Carbon dioxide gas laser working method |
WO2019093148A1 (en) * | 2017-11-07 | 2019-05-16 | 村田機械株式会社 | Laser processing machine and focus adjustment method |
CN111246961A (en) * | 2017-11-07 | 2020-06-05 | 村田机械株式会社 | Laser processing machine and focus adjusting method |
JPWO2019093148A1 (en) * | 2017-11-07 | 2020-11-12 | 村田機械株式会社 | Laser machine and focus adjustment method |
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