JPS5944895A - Method of producing multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention is applicable to multilayer printed wiring board VJ cover construction.

Multi-layer printing arrangement - Except for the 4Pi case, the guide mark and the required circuit pattern are placed on the inner layer circular board guide mark in advance #V41F! 'i'! Glue pasted on its surface with a glass base and a curved needle on the glass cloth material] Mountains are placed on the outside! [The entire surface of the deck is placed offshore (1 heat pressurized and integrated, then on the guide mark (/, 1 board and the base material is removed at the same time as type 4A) The marks were drawn, the awns were drawn, and the marks were used as reference points for the outer steel foil inner layer circuits and positioning, while the circuit processing industry was used to manufacture multi-layer printed circuit boards.

The multilayer printed wiring board assembled using the above method has P# and mold material on the guide marks. Due to the stickiness C, due to the kindness of metropolitan monthly fee, Hayabusa Nazari removal, glass force and dog friglex layer cause void grapes and almost all B. In addition, the anti-vibration material is exposed to the necessary 141-way patterns other than the kite mark, causing terrarism and causing an adverse effect on the multilayer printed wiring board.

In accordance with the present invention, the kite mark and the necessary circuit pattern must be placed at one point in the inner layer circuit board. Between the pieces of gold, there is a layer of gold and silver.
1) After attaching the fig and integrating all 14 bows with heat and pressure bonding layer, apply Kaidomatahi GiJ copper foil and base material layer. , separate the guide mark stand 44J and remove the base material layer that is in contact with the kite mark with a thick thickness, leaving the guide mark as a reference point...I tl'l? - The present invention is characterized by carrying out circuit processing of multi-layer printed cape & r mounting, kite mark, and inner layer circuit board with circuit pattern tray. Karasui IJ old and tsumigri pregke valve with a sushi mata f Yukarasu ayatai wood one side copper '71? Sheet metal copper? k is placed outside 1t11
At the time of 1b1, remove the whole part with a heating power of 11 pressure by using an integrated cutting edge, 1 mark, copper foil and a 9-material end mill, etc., or completely remove the private material layer. r, 0.05-0.50w11vI group 4J"r
The liquid with good IL properties is ethanol. : Glycerin = 0.1 to 0.5: Dissolution of I is obvious.

Manufacture multilayer printed wiring boards with recognized kites and holes.

The drawing shows a state where part of the copper foil and the base shrine on the kite mark have been removed and a mixture of alcohol and Chriselin (1) has been applied. mark,
5 is Motokito, 1. X Inner layer circuit pattern, 5t; I Inner layer circuit & base layer, 6 indicates a mixed board.

As explained above, in the present invention (Kri young fruit reaches fi
y, tl, ru〇(Re) 111 mark A11ll In the wiring board assembly, place it on the inner layer circuit board guide mark! Because the dust phase is not used, 'jti nese~button ゛Karakui 15 base material fiber 1ψ・'- has a separation material depending on the thickness, and the lv1 neutrality is the same as above. Circuit pattern 1.J7:
'A 6 raw terada nation〃) will be gone.

(2) A friend who knows about the guide mark case, -: IJJ disappearance and kidnapping - regarding the inspection on the kite mark except for the st take 9.
L sex l:/J 议水? Coating 1-1.1 (Yo, IH1 foil kite mark 3'θ is no, I can't make it to the kite mark such as ILll.

[Brief explanation of the drawing]

0 code CI which is drawing Vl multilayer printing distribution & Fgr side view
) 6th brother Akira

Claims (1)

[Scope of Claims] 1. Inner layer circuit board (1) on which guide marks and required JAI circuit patterns are carried (1) Copper foil straddled crow 2! ! Attach jl+ to L9 where j1 one side plane j tension layer & kai copper pongee are placed on the outer surface. The whole was heated and pressurized and laminated into one piece, and the copper foil and base JS notebook guide marks of 11" thickness were removed, leaving only the left material layer in contact, and the kite marks were removed. A method for producing a multilayer printed wiring board with an additional feature of performing an outward copper sludge turning process as a reference point.