JPS5941855A - Method for attaching lid member in semiconductor device - Google Patents
Method for attaching lid member in semiconductor deviceInfo
- Publication number
- JPS5941855A JPS5941855A JP57152462A JP15246282A JPS5941855A JP S5941855 A JPS5941855 A JP S5941855A JP 57152462 A JP57152462 A JP 57152462A JP 15246282 A JP15246282 A JP 15246282A JP S5941855 A JPS5941855 A JP S5941855A
- Authority
- JP
- Japan
- Prior art keywords
- lid member
- sheet
- package
- adhesive
- bonding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000007639 printing Methods 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 42
- 230000001070 adhesive effect Effects 0.000 claims description 42
- 239000011521 glass Substances 0.000 abstract description 16
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000007767 bonding agent Substances 0.000 abstract 6
- 238000010586 diagram Methods 0.000 description 13
- 239000000428 dust Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000001444 catalytic combustion detection Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半導体装置を構成するパッケージに半導体チッ
プを収容した後、蓋部材を取着する方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching a lid member to a package constituting a semiconductor device after accommodating a semiconductor chip therein.
従来から、セラミック製のパッケージを用いｌ、二手導
体装置では、パッケージのキャビティ中に半導体チップ
を収容し、結線した後、蓋部材を取着してキャビティ内
を気密に保持することが通常行なわれている。この場合
、蓋部材の周辺面あるいは蓋部材が当接するパッケージ
上面のいずれか一方面（両方の面でもよい）ｆこ予じめ
低融点ガラス又は合成樹脂系の接着剤が塗布してあり、
蓋をする場合には蓋部材を所定位置１こ載置した後、加
熱、圧着するなど？こより接着する方法がとられている
。Conventionally, in two-handed conductor devices using ceramic packages, the semiconductor chip is housed in the cavity of the package, and after wiring is connected, a lid member is attached to keep the inside of the cavity airtight. ing. In this case, either the peripheral surface of the lid member or the top surface of the package that the lid member contacts (or both surfaces may be used) is coated with a low-melting point glass or synthetic resin adhesive in advance;
When putting a lid on it, place the lid member in a predetermined position and then heat it and press it. A method of gluing is used.
一方、半導体素子に紫外線を照射して記憶信号を消去す
るＰＲＯＭ（Ｐｒｏｇｒａｍ Ｒｅａｄ ０ｎｌｙ Ｍ
□ｏｒｙ）や撮像装置としての利用範囲が拡大しつつあ
る電荷結合デバイス（以下、ＣＣＤと称す）などではキ
ャビティ内に収容された半導体素子に光をあてるため、
気密を保持する蓋部材として透光性の良好なガラスを使
用しているが、とりわけＣＤＤ の場合にヲ工鮮明で
ボケのないシャープで均質な画像を得るため、蓋部材に
は透光性を阻害するような塵埃の付着や汚れがあっては
ならない。On the other hand, PROM (Program Read Only M
□ory) and charge-coupled devices (hereinafter referred to as CCDs) whose use as imaging devices is expanding, in order to illuminate the semiconductor element housed in the cavity.
Glass with good translucency is used as the lid member to maintain airtightness, but especially in the case of CDDs, in order to obtain sharp and homogeneous images without blur, the lid member is made with translucent properties. There must be no dust or dirt that could interfere with the installation.
ところが、パッケージに取着する蓋部材には低融点ガラ
スあるいは合成樹脂系の接着剤が周辺面に予め塗布され
ているが、これら接着剤や低融点ガラス等は加温し、溶
融させて低粘度状態のものでもって王にスクリーン印刷
手法により塗布される。このように接着剤（シール剤と
いうこともできる）１ニスクリーン印刷によって塗布さ
れるが、この塗布工程時ｔこ接着剤が透光性蓋部材の所
定個所以外ｔこも飛着し易く透光性に支障を来たす恐れ
があった。特にＣＯＤの場合、撮像性能に重大な悪影響
を及ぼす結果となる。また透光性の蓋部材には接着剤の
飛着だけではなく、接着剤の印刷塗布工程時に他の塵埃
等が付着する恐れも大きかった。However, low-melting point glass or synthetic resin adhesives are pre-applied to the surrounding surface of the lid member attached to the package, but these adhesives and low-melting point glasses are heated and melted to create a low-viscosity adhesive. It is applied by screen printing method to the king with the condition. In this way, the adhesive (which can also be called a sealing agent) is applied by double-screen printing, but during this application process, the adhesive tends to fly to areas other than the designated areas on the transparent lid member, making the transparent lid member non-transparent. There was a risk that it would cause problems. Particularly in the case of COD, this results in a serious negative impact on imaging performance. In addition, there is a great possibility that not only the adhesive will fly onto the transparent lid member, but also other dust and the like will adhere to it during the printing and coating process of the adhesive.
他方、上記不都合を回避するため、半導体素子を収容す
るパッケージ側に接着剤を予じめ塗布しておくことも考
えられるが、半導体素子のマウントやワイヤボンディン
グ時の熱処理により接着剤が流れ去ってしまったり、ボ
ンディングに伴う機械的衝撃によって塗布しである接着
剤（常温で固化している）が部分的に剥離する恐れがあ
り、またボンディング作業の完了後、化学洗浄する場合
に接着剤をも洗い去ってしまう恐れがある。また、半導
体素子のマウント、ワイヤボンディング後に接着剤を塗
布する工程を経たとしても上記同様半導体素子上に生じ
た接着剤の飛着や塵埃等を容易に除去このような諸々の
理由によって蓋部材を取着するための接着剤を予じめパ
ッケージ側に塗布したものを使用することは回部である
。On the other hand, in order to avoid the above-mentioned inconvenience, it may be possible to apply adhesive in advance to the side of the package that houses the semiconductor element, but the adhesive may flow away due to heat treatment during mounting of the semiconductor element or wire bonding. There is a risk that the applied adhesive (hardened at room temperature) may partially peel off due to the mechanical shock that accompanies bonding. There is a risk that it will be washed away. In addition, even if the adhesive is applied after mounting the semiconductor element and wire bonding, it is possible to easily remove the flying adhesive and dust generated on the semiconductor element as described above. It is best to use adhesive that has been applied to the package side in advance for attachment.
本発明は上記の如き諸事情に鑑みて開発した半導体パッ
ケージ１こ対する蓋部材の取着方法−こ関するものであ
る。The present invention relates to a method for attaching a lid member to a semiconductor package, which was developed in view of the above circumstances.
以下、図ｔこよって本発明取着方法を具体的ｔこ詳述す
る。Hereinafter, the attachment method of the present invention will be specifically explained in detail with reference to Figures.
第１図の（Ａ）においては、耐熱性を有するシート１ｔ
こ所定の形状、例えばパッケージｔこおける半導体素子
を収容するキャビティの平面形状である方形状ｔこ対応
した打抜孔２を所定の配列で打抜いたものを準備する。In FIG. 1 (A), 1 t of heat-resistant sheet
A die is prepared in which punched holes 2 corresponding to a predetermined shape, for example, a rectangular planar shape which is the planar shape of a cavity for accommodating a semiconductor element in a package t, are punched out in a predetermined arrangement.
次の工程図（Ｂ）１こおいてはインクとしての接着剤３
を所定の版型ｔこ付着せしめた印刷版４をシート１ｔこ
当接させ、印刷版４よりシート１の所定位置に接着剤３
を付着した工程図（Ｃ）のシート１を得た後、必要１こ
応じて工程図ＣＤＩのよう１こ７−トｌを上下裏返しに
する。In the following process diagram (B) 1, adhesive 3 is used as ink.
A printing plate 4 with a predetermined plate shape t attached is brought into contact with the sheet 1t, and an adhesive 3 is applied from the printing plate 4 to a predetermined position on the sheet 1.
After obtaining the sheet 1 shown in the process diagram (C) to which the process diagram CDI is attached, turn the sheet 1 and 7 upside down as shown in the process diagram CDI as necessary.
このようｔこシート１に接着剤３が印刷された後、必要
に応じ、乾燥を行い、常温では固化したものとすること
により、多数枚のシートを積み重ねて保管、運搬等が行
い易いものとすることができる。After the adhesive 3 is printed on the sheet 1 in this way, it is dried as necessary and solidified at room temperature, making it easy to stack a large number of sheets and store and transport them. can do.
次に、第２図にて示した工程図（均では前記第１図の工
程により接着剤３が所定パターンに印刷されたシー）１
を、半導体装置−こおける透光性を有する蓋部材とする
ガラス板５を多数枚連設せシメたフレーム６上？こ載置
し、所定温度に加温することによりガラス板５の周辺面
上に転着し、工程図口で示したようｔこ接着剤３が所定
位置に付着したガラス板５は次の工程図ｐ）において、
半導体素子７が収容され、ボンディング作業が完了した
パッケージＢ上に載置され、所定の温度（例えば７０〜
ｔｓｏｔＣ）Ｋ−加熱された状態で加圧されることかこ
より接着剤３の接着及びシール性で蓋部材であるガラス
板５は第４図に示したようにパッケージ８に対し、強固
に、かつ気密裡に取着される。Next, the process diagram shown in FIG.
on a frame 6 in which a number of glass plates 5 are arranged in series and used as a cover member having light-transmitting properties for a semiconductor device. By placing the adhesive 3 and heating it to a predetermined temperature, the adhesive 3 is transferred onto the peripheral surface of the glass plate 5, and as shown in the opening of the process diagram, the glass plate 5 with the adhesive 3 attached to the predetermined position is ready for the next process. In figure p),
The semiconductor element 7 is accommodated and placed on the package B in which the bonding work has been completed, and heated to a predetermined temperature (for example, 70 to 70°C).
tsotC)K- Due to the adhesive and sealing properties of the adhesive 3 due to being pressurized in a heated state, the glass plate 5, which is a lid member, firmly and firmly attaches to the package 8 as shown in FIG. Installed airtight.
次に第３図に示した取着方法において、第１図の工程図
０１こ至るまでの工程で作製したシートｌを、半導体素
子７が収容され、ワイヤボンディング作業が完了したパ
ッケージ８の所定位置ｔこ重ね合わせ、加圧しつつ接着
剤３の溶融温度にまで加熱することによって接着剤３が
パッケージ８の上辺面ｔこ付着した工程回路のものが得
られる。Next, in the mounting method shown in FIG. 3, the sheet l produced in the steps up to step 01 in the process diagram of FIG. By stacking the package 8 and heating it to the melting temperature of the adhesive 3 while applying pressure, a process circuit in which the adhesive 3 is adhered to the upper side of the package 8 is obtained.
次にガラス板５を載置した後、加熱、加圧することｔこ
よって第４図で略示する如く、ハラケージ８内に半導体
素子７が収容され、蓋部材としてのガラス板５が強固ｔ
こ、かつ気密裡をこ取着された半導体装置を得ることが
できる。Next, after placing the glass plate 5, it is heated and pressurized.Thus, as shown schematically in FIG.
In this way, it is possible to obtain a semiconductor device which is hermetically attached.
なお、上述した工程ｔこおける接着剤の転写１こ用いる
シートとしてトエテトラロロエチレン、フッ化ビニリデ
ン、フッ化ビニル等のに）ｆｆ合体フィルムポリエチレ
ン、ボリグロビレンなとの有機性シートが適しており、
それらはシート自体が接着剤に対する離型性と、接着剤
を印刷塗布した後の熱乾燥ｔこ際し、接着剤の緑の部分
が丸味をもった断面形状となるいわゆるエイシング特性
を有しているので好都合である。また、シート１の厚さ
としては、種々の実験をくり返し得られたデーターによ
れば０．０５〜０．２ ｍ＋ ＠度のものが最適であっ
た。In addition, as the sheet used for the adhesive transfer step 1 in the above-mentioned step t, an organic sheet such as toetetraloethylene, vinylidene fluoride, vinyl fluoride, etc.) is suitable as a composite film of polyethylene, polyglopylene, etc.
The sheet itself has releasability for the adhesive, and has a so-called icing property in which the green part of the adhesive takes on a rounded cross-sectional shape when it is heated and dried after printing and applying the adhesive. It's convenient because there are. Further, as for the thickness of the sheet 1, according to data obtained through repeated various experiments, a thickness of 0.05 to 0.2 m+@ degrees was optimal.
以上のように、本発明によれば半導体装置の製造工程を
こおいて、特に蓋部材又はパッケージトこ接着剤を塗布
する工程での接着剤の飛着１こもとづく不都合を回避す
ることができ、また、他の塵埃等の付着する機会の少な
い蓋部材の取着方法をもたらすことが可能となる。その
結果、シャープで高解像度の特性をもったＣＯＤを提供
することができるとともに他の半導体装置では歩留の向
上など多くの効果をもたらすことができる。As described above, according to the present invention, it is possible to avoid the inconvenience caused by flying adhesive during the manufacturing process of semiconductor devices, especially in the process of applying adhesive to lid members or packages. Furthermore, it is possible to provide a method for attaching the lid member that has less chance of adhesion of other dust and the like. As a result, it is possible to provide a COD with sharp and high-resolution characteristics, and it is also possible to bring about many effects such as improved yield in other semiconductor devices.
なお、上述した実施例ではシートへの接着剤の塗布方法
としてスクリーン印刷方法をこよる場合を挙げたが、こ
れに限らず、接着剤等の吐出器として一般的に用いられ
るディスペンサ等を用いて塗布してもよいし、へヶ塗り
など−こよる手作業ｔこよることもできる。In addition, in the above-mentioned embodiments, the screen printing method is used as the method of applying adhesive to the sheet, but the method is not limited to this, and it is possible to use a dispenser, etc., which is generally used as a dispensing device for adhesive, etc. It can be applied by painting, or it can be done by hand, such as by applying it on the surface.
また、半導体素子として主にＣＯＤを対象とした説明を
行なったが、その他の受光素子、例えば、ＢＢＤ方、ｆ
：％ＩＤ方式等の固体撮像素子や紫外線消去方式のメモ
リー（例えばＰ−ＲＯＭ）等の受光型半導体素子への適
用も有効であることはぼりまで本ない。In addition, although the explanation mainly focused on COD as a semiconductor device, other light receiving devices, such as BBD, f
There is no evidence that application to light-receiving semiconductor devices such as solid-state image pickup devices using the %ID method or memories using the ultraviolet erasing method (for example, P-ROM) is also effective.
また、上記実施例ではシートに接着剤を印刷塗布する前
に打抜孔をあけたシートを用いたが、これシこ限らず、
ソー））こ接着剤を印刷塗布した後、打抜孔をあけたも
のでもよい。すｌｚわら、打抜孔は蓋部材もしくはパッ
ケージｔこ接着剤を付着する工程の前であれば本発明に
よる効果が期待できる。In addition, in the above embodiment, a sheet with punched holes was used before the adhesive was printed on the sheet, but this is not limited to this.
It is also possible to punch out holes after applying the adhesive by printing. The effects of the present invention can be expected if the punched holes are formed before the adhesive is applied to the lid member or package.
第１図囚〜！ｃ）は本発明方法ｅこおける接着剤をシー
トに印刷塗布する工程を説明する図、第２図停）〜ＩＧ
Ｉ及び第３図ψｊ）〜湖は本発明により接着剤を付着せ
しめ蓋部材を取着する工程を説明する図であり、第４図
Ｆ工本発明に係る蓋部材の取着方法シこより製作した半
導体装置の例を示す断面図である。
１：シート ２：打抜孔
３：接着剤 ４：印刷板
５ニガラス板 ６：フレーム
７：半導体素子 ８：パッケージ
出願人 京都セラミック株式会社
同 東京芝浦電気株式会社
手続補正書（方式）
昭和５７年１２月２８０
特許庁長官 若 杉 和 夫 殿
２、発明の名称
半導体装置における蓋部材の取着方法
３、補正をする者
４、補正命令の日付
昭和５７年１１月１２日
（発送日 昭和５７年１１月３０日）
５、補正の対象
（イ）発明の詳細な説明の欄
（ロ）図面の簡単な説明の欄
（ハ）図 面
６、補正の内容
（イ）「発明の詳細な説明の欄」を次の通り補正する。
（１）明細書２頁１２行目の「・・・とりわけＣＤＤの
場合」を「・・・とりわけＣＣＤの場合」と補正する。
（２）明細書５頁４行口の「・・・工程図（Ｅ ）では
・・・−１を「・・・工程図（Ａ）では・・・」と補正
する。
（３）明細書５頁９〜１０行目の１・・・転着し、工程
図（Ｆ）で示した・・・」を１・・・転着し、第２図（
Ｂ）で示した・・・」と補正する。
（４）明細書５頁１１１−１目の「・・・次の工程図（
Ｇ）において、・・・」を［・・・次の工程図（Ｃ）に
おいて、・・・」と補正する。
（５）明細書６頁１行口の「・・・所定位置に重ね・・
・」を「・・・所定位置に第３図（Ａ）に示したように
重ね・・・」と補正する。
（６）明細書６頁４行口の［・・・した工程図（Ｆ）の
もの・・・」を１・・・した第３図（Ｂ）のもの・・・
」と補正する。
（７）明細書６頁５行口の「次にガラス板５を・・・」
を「次に第３図（Ｃ）に示すようにガラス板５を・・・
」と補正する。
（８）明細書６頁１１行目の「・・・とじてはテトラロ
ロエチレン、・・・」を「・・・とじてはテＩ・ラフロ
ロエチレン、・・・」と補正する。
（ロ）「図面の簡単な説明の欄」について次のように補
正する。
（１１明細書８頁１０〜１２行目の［・・・を説明する
図、第２図（Ｅ）〜（Ｇ）及び第３図（Ｅ′）〜（Ｇ′
）は本発明により接着剤を付着せしめ蓋部材を取着する
工程を説明する図・・・」を「・・・を説明する断面図
、第２図（Ａ）〜（Ｃ）及び第３図（Ａ）〜（Ｃ）は本
発明により接着剤を付着せしめ蓋部材を取着する工程を
説明する断面図・・・」と補正する。
（ハ）図面を別紙のとおり補正する。
（内容に変更なし）
以 上Figure 1: Prisoner! c) is a diagram illustrating the process of printing and applying the adhesive on a sheet in the method of the present invention, Figure 2) to IG
I and Figures 3 ψj) to 3 are diagrams illustrating the process of attaching an adhesive and attaching a lid member according to the present invention, and Figure 4 F shows a method of attaching a lid member according to the present invention. 1 is a cross-sectional view showing an example of a semiconductor device. 1: Sheet 2: Punching holes 3: Adhesive 4: Printing plate 5 Glass plate 6: Frame 7: Semiconductor element 8: Package applicant Kyoto Ceramic Co., Ltd. Tokyo Shibaura Electric Co., Ltd. procedural amendment (method) December 1982 280 Japan Patent Office Commissioner Kazuo Wakasugi 2 Title of the invention Method for attaching a lid member in a semiconductor device 3 Person making the amendment 4 Date of amendment order November 12, 1980 (Shipping date November 1988) 5. Subject of amendment (a) Column for detailed explanation of the invention (b) Column for brief explanation of drawings (c) Drawing 6. Contents of amendment (a) Column for detailed explanation of invention ' shall be corrected as follows. (1) On page 2, line 12 of the specification, "...particularly in the case of CDD" is amended to "...particularly in the case of CCD." (2) Correct "...-1 in process drawing (E)..." at the beginning of line 4 on page 5 of the specification to "...in process drawing (A)...". (3) On page 5, lines 9-10 of the specification, 1... was transferred and shown in the process diagram (F)...'' was transferred and 1... was transferred and shown in Figure 2 (
Correct it with "B) indicated...". (4) On page 5, 111-1 of the specification, “...the following process diagram (
In G), "..." is corrected to "...in the next process diagram (C),...". (5) At the beginning of the first line on page 6 of the specification, "...overlaid it in the specified position...
.'' is corrected to ``...superimposed at a predetermined position as shown in FIG. 3(A)...''. (6) The item shown in Figure 3 (B) with 1... in the beginning of the 4th line of page 6 of the specification, ``Process drawing (F) that...'' was changed to 1...
” he corrected. (7) "Next, glass plate 5..." on page 6, line 5 of the specification
"Next, as shown in Figure 3 (C), the glass plate 5...
” he corrected. (8) On page 6, line 11 of the specification, "...totally means tetraloroethylene, ..." is amended to "...totally means tetrafluoroethylene, ...". (b) The "column for brief explanation of drawings" shall be amended as follows. (11 Specification, page 8, lines 10 to 12 [...] Figures 2 (E) to (G) and Figures 3 (E') to (G'
) is a diagram illustrating the process of attaching an adhesive and attaching a lid member according to the present invention...'' is a sectional view explaining ``..., Figures 2 (A) to (C), and Figure 3. (A) to (C) are cross-sectional views illustrating the process of applying an adhesive and attaching a lid member according to the present invention...'' is corrected. (c) Amend the drawing as shown in the attached sheet. (No change in content) That's all
Claims (1)
合した型に接着剤をシート面上ｔこ印刷塗布する工程と
、前記シート面上に印刷塗布した接着剤を蓋部付文１よ
パッケージの所定個所に付着せしめる工程を経た後、蓋
部材をパッケージに接着せしめることを特徴とする半導
体装置１こおける蓋部材の取着方法。A process of printing adhesive on the sheet surface in a mold that almost conforms to the peripheral shape of the cavity that accommodates the semiconductor chip, and applying the adhesive printed and applied on the sheet surface to predetermined locations of the package such as the label attached to the lid part 1. 1. A method for attaching a lid member to a semiconductor device, the method comprising: adhering the lid member to the package after a step of adhering the lid member to the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57152462A JPS5941855A (en) | 1982-08-31 | 1982-08-31 | Method for attaching lid member in semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57152462A JPS5941855A (en) | 1982-08-31 | 1982-08-31 | Method for attaching lid member in semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5941855A true JPS5941855A (en) | 1984-03-08 |
Family
ID=15541038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57152462A Pending JPS5941855A (en) | 1982-08-31 | 1982-08-31 | Method for attaching lid member in semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5941855A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100394488B1 (en) * | 2001-04-06 | 2003-08-14 | (주)트라이맥스 | pressure tray for semi-conductor protection package |
-
1982
- 1982-08-31 JP JP57152462A patent/JPS5941855A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100394488B1 (en) * | 2001-04-06 | 2003-08-14 | (주)트라이맥스 | pressure tray for semi-conductor protection package |
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