JPS5940409A - Insulated wire - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides wires for insulation, more specifically, heat-resistant wires useful as winding wires for electrical equipment used in harsh environments such as surrounding high-temperature hot water. , 1 [1: related to glandular pressure], which has excellent water resistance, hydrolysis resistance, solvent resistance, etc.

Conventionally, polyimide enameled wires, Kapton tape-wrapped polyimide wires, and the like, which have particularly excellent heat resistance, have been used for winding wires of this type of electrical equipment.

However, special electrical equipment used in oil drilling etc. is exposed to high temperatures (approximately 250°C) underground, the presence of hot water, and various other conditions (acidic, Since polyimide enamelled wires and Kapton tape-wrapped polyimide wires are often used in combination with alkaline materials (e.g. alkaline materials), solvents, etc. (11) can cause severe scratches and significantly shorten the service life of electrical equipment. The reason for this is that in the case of polyimide enameled wire, Kapton tape @ polyimide wire, etc., if the polyamic acid is not completely closed 1f4 to form an imide ring, water resistance, hydrolysis resistance, and resistance will deteriorate. Due to poor chemical resistance and solvent resistance, complete closure of polyamic acid is required during back-end manufacturing.
Are you looking forward to it? 1ili<, it is argued that the properties such as the above-mentioned water resistance become insufficient.

The inventors of the present invention have focused on these conventional problems, and have
! As a result of the R1 test of fi Needle ether ketone (hereinafter referred to as P11! [abbreviated as K)
I found [7]. This pp-published KFJ is a linear wholly aromatic resin whose molecular structure is as shown in the following formula.

(−Q −/L”) o CX 6 , c,・
-),・However, there was a slight sticking point at this point of P [1 cK x 4 heat 1'l].

Therefore, the present inventor, Kasa, developed a composite 11-layer structure of both polyimide and Pffi[K, in order to provide heat resistance superior to that of polyimide while compensating for its weak points such as water resistance. I wonder if there's anything I can do, j';'j fl!
,! I ended up doing it.

The present invention is based on such a construction, and its basic characteristics are that at least a polyimide enamel film and a PJ1'□+Ij K film,
1/3 i 2 W'r is at the point covered by the structure.

Such an insulated i! according to the present invention! l;! If we explain in detail by 1 so 1 n) 1, it will be as shown in Figure 1, and in the figure, 1 digit '1! I body, 2it polyimide enamel skin anus V,
The process up to the formation of this film can be carried out in the same manner as in the past, and it can be manufactured by attaching J3 to the enamel film 2 using a rolling machine.Next, on this enamel film 2, for example, press 1j to press 3 to the PE base.
Cover with 1L. Specifically, for example, as shown in the second rA, the polyimide enamel wire is fed out from the first feeder 4, then this wire is preheated to about 300oC in the preheating device 5, and the wire is heated to about 400oC in the high temperature extruder 6. Extrude and cover P play K with O. After that, the solid lubricant is passed through the solid lubricant treatment device R7 and coated with the solid side lubricant that has been heated and melted at -F above its melting point in a tank inside the device. Air cooling L7 or water cooling if necessary, and then pulling 1! using the pulling device 11! It is then taken up by the winder 12. In order to smoothly increase the crystallinity of T'JJKK, a series of cooling devices 8 to 10 were arranged in series to allow gradual cooling.

In the disconnected R electric wire of the present invention constructed as described above, PJ! [The thickness of the K film must be carefully considered in relation to the thickness of the polyimide enamel skin, which contributes to heat resistance, but for example, the thickness of the conductor diameter 1. In Qmm, the percentage of polyimide enamel film thickness of 10μ, duck bonding, sufficient water resistance, etc.
In order to obtain sexual value, it is desirable that the degree of C be at least 20/1. Also, PI! ! It is preferable to coat the EK by extrusion, but in some cases it is also possible to coat the EK by rolling. But Kt, P W 1. It is also possible to develop this when extruding r', K. On the other hand, for the enamel film side, it is also possible to use curved or twisted polyimide (polyamideimide, polyesterimide, polyester, etc., which have good heat resistance).

Next, a comparative example for comparing the effects with the embodiments of the present invention will be described.

Example 1 A polyimide enamel film with a thickness of 10 μm was formed on a conductor of 1.9 m + n using a baking machine, and then a PE mark was extruded using a high-temperature extrusion stone with a PE mark of 40 μm. Layered ladle construction.

Example ■ 1. A polyimide enamel film with a thickness of 20 μm was applied on a conductor of Q mm in the same manner as in Example 1 (0 m case), and P
f! J! ! The film was coated with a thickness of 30 μm to form a 2] stand structure.

Comparative Example (2) A polyimide enamel skin Y9 with a thickness of 50 II was formed on a 1.0 mm conductor using a baking machine.

Comparative Example ■ Polyimide enamel film A was formed on a 1.9 mm conductor 4 with a thickness of 50μ using a baking machine, and then Kapton tape was wrapped on top of it, and Kapton tape sebum was applied thickly. was covered with 70μ cedar.

Comparative Example IJ1 1, P) on the Qntm conductor! :f! ! Extrude K using a high-temperature extruder to obtain 11 pieces of PIK skin with a total thickness of 50 μm.
'Nono Zeseta.

The various properties of each of these Examples and Comparative Examples are as shown in Table 1 (Characteristic Value Table) and the graph in FIG. 3 (High Temperature and Humid Heat Deterioration Characteristics). In Figure 3, the measurement condition is 250'0°5F? In the figure, O corresponds to Example ■, × corresponds to Example ■, - Comparative Example I, ■ corresponds to Comparative Example ■, and Δ corresponds to Comparative Example III.

The following can be seen from Table 1 and FIG. 3 above.

That is, in the case of polyimide enamel door I (Comparative Example I) and Kabuton tape-wrapped polyimide wire (Comparative Example ■),
Regarding heat resistance, there is no problem, but water resistance etc.
1 In the corresponding high temperature and humidity heat deterioration characteristics, moisture 1; 1゛ is 0.
It can be seen that when the temperature exceeds 2Vo14, the dielectric breakdown strength decreases significantly. This tendency is particularly strong in Kabuton deep-wound polyimide wires. On the other hand, in the case of PJfi [K extruded wire (comparative example ■), although it has good high-temperature and moist heat deterioration characteristics, the heat softening temperature is low and it is insufficient in terms of heat resistance. I understand. On the other hand, PJfi,l! of the present invention! ! coated polyimide wire (Example 1.
In the 8j case of II), sufficient heat resistance was obtained and the moisture content was 0.2V. Even if it exceeds 1%, no decrease in dielectric breakdown strength is observed, indicating that C has excellent moist heat deterioration characteristics.

As is clear from the above description, according to the present invention, at least the polyimide enamel film and the PJliK film have a two-layer structure and I-. Hydrolysis resistance, chemical resistance, and solvent resistance are all excellent. J[Especially effective as a guide,
It has the effect of being able to significantly extend the lifespan of equipment.

[Brief explanation of the drawing]

Fig. 1 shows an end view of an insulating convergence groove according to the present invention, and Fig. 2 shows a schematic diagram of the formation of a PlugK film.
1 and 3 are graphs showing high temperature, humidity and heat deterioration characteristics. 1. φ conductor, 2. Polyimide enamel film, 3. IflK skin. Patent applicant: Fujikura Electric Cable Co., Ltd.'・,,) 35

Claims (1)

[Claims] Kojun's insulation '11 is characterized by having polyimide enamel (jLJF!) on the conductor and a polyetherketone (pggx) film on top of it.