JPS5939082A - Semiconductor laser - Google Patents
Semiconductor laserInfo
- Publication number
- JPS5939082A JPS5939082A JP14866182A JP14866182A JPS5939082A JP S5939082 A JPS5939082 A JP S5939082A JP 14866182 A JP14866182 A JP 14866182A JP 14866182 A JP14866182 A JP 14866182A JP S5939082 A JPS5939082 A JP S5939082A
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- thin film
- gaas
- face
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0281—Coatings made of semiconductor materials
Abstract
Description
【発明の詳細な説明】
本発明は半導体レーザ、特1′CGaAs(ガリウム砒
素)−CraA7As(ガリウムアルミ砒素)系材料か
らなる半導体レーザの共S、器端面のコートに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a coating on the end face of a semiconductor laser, particularly a semiconductor laser made of a 1'CGaAs (gallium arsenide)-CraA7As (gallium aluminum arsenide) based material.
半導体レーザは活性層を含む共振器の対向する2面をへ
き開面(以下端面と称す)とし、断る2面間で活性層よ
り発した光を共振させることによりエネルギーの大なる
レーザ光を得ること力(できるO
また断る共振器端面は従来8102(2酸化シリコン)
、51gN4(窒化シリコン)、A1203(酸化アル
ミニウム〕等からなる膜(結晶構造;非晶個もしくは多
結晶)でコートサれ、祈る端面に劣化が生じ々いように
保進されている。Semiconductor lasers use two opposing surfaces of a resonator, including the active layer, as cleavage planes (hereinafter referred to as end surfaces), and generate laser light with high energy by resonating the light emitted from the active layer between the two cleavage surfaces. force (possible O) Also, the resonator end face is conventionally made of 8102 (silicon dioxide)
, 51 g N4 (silicon nitride), A1203 (aluminum oxide), etc. (crystalline structure; amorphous or polycrystalline) is coated to prevent deterioration of the end face.
ところが上記した膜の材料はGaAs−GaAl!As
系材料と結晶構造が全く違うため密着性が悪く、特に高
温、多湿雰囲気中では上記端面に劣化が生じ長時間安定
な動作が得られないという問題があった。However, the material of the above film is GaAs-GaAl! As
Since the crystal structure is completely different from that of the system material, the adhesion is poor, and there is a problem in that the end face deteriorates particularly in a high temperature and humid atmosphere, making it impossible to obtain stable operation for a long time.
本発明は断る点VC鑑みてなされたもので、その特徴は
共振器端面をZnSθ(亜鉛セレン)単結晶薄膜でコー
トしたことである。The present invention was made in view of the point VC, and its feature is that the resonator end face is coated with a ZnSθ (zinc selenium) single crystal thin film.
Zn5e単結晶薄めは室温での光吸収端が48ooXと
低く、かっGaAs−GaAl!As単結晶と格子定数
が近いため断る単結晶との密着性が優れている。2VC
znse単結晶膜は分子線エピタキシャル成長方法(以
下単にMBEと称す)によ#)400℃以下の低温で形
成でき、かつそのノンドープ層は高抵抗となる。The thin Zn5e single crystal has a low optical absorption edge of 48ooX at room temperature, which is similar to GaAs-GaAl! Since the lattice constant is close to that of the As single crystal, it has excellent adhesion with the single crystal. 2VC
The Znse single crystal film can be formed at a low temperature of 400° C. or lower by a molecular beam epitaxial growth method (hereinafter simply referred to as MBE), and its non-doped layer has high resistance.
第1図、第2図は本発明の一実施例を示し、第1図は第
2図の1−1′線断面図であり、@2図は第1図のn−
n’線断面図である。1 and 2 show one embodiment of the present invention, FIG. 1 is a sectional view taken along the line 1-1' in FIG. 2, and FIG.
It is a sectional view taken along the n' line.
図において、(1)は−主面が(100)面であるn型
GaAs基板であシ、該基板の一生面には第1図に示す
ように紙面垂直方向に延在する溝(2)が形成され【い
る。(3)は上記基板(1)の−主面上に積層されたn
型Ga 1−xAJxAs (0<X<1)からなる第
1クラッド層であり、該第1ククツド層は基板(1)の
−主面形状に従って溝(2)上で凹状に湾曲している。In the figure, (1) is an n-type GaAs substrate whose main surface is the (100) plane, and the substrate has grooves (2) extending perpendicular to the page as shown in FIG. is formed. (3) is the n layer laminated on the -main surface of the substrate (1).
The first cladding layer is of the type Ga 1-xAJxAs (0<X<1), and the first cladding layer is curved concavely on the groove (2) according to the shape of the main surface of the substrate (1).
(41は上記第1クフツド層(3)上に積rfAすれた
Ga1−yA、JyAs(0≦Yく1゜X)Y)からな
る活性10、(5)は該活性層上に積層されたP型Ca
(−xA/xAsからなる第2クラッド層、(6)は
該第2クラッド層上に積層σれたオーミック特性が良好
なキャップ層である。上記第1クラッド層(3)、活性
層(4)、第2クラッド層(5)、キャップ層(6)は
順次エビタキンヤル成長によシ積層できる。(41 is an active layer 10 consisting of Ga1-yA, JyAs (0≦Yx1° P-type Ca
(The second cladding layer (6) consisting of -xA/xAs is a cap layer laminated on the second cladding layer and having good ohmic characteristics. The first cladding layer (3), the active layer (4) ), the second cladding layer (5), and the cap layer (6) can be sequentially laminated by epitaaxial growth.
祈る半導体レーザでは第1、第2クラッド層(3)(5
)のAI!濃度が活性層(4)のそれより大であるため
所るクラッド層は活性層に比べ℃バンドギャップが大で
かつ光屈折率が小となる。In the praying semiconductor laser, the first and second cladding layers (3) (5
)’s AI! Since the concentration is higher than that of the active layer (4), the cladding layer has a larger C band gap and a smaller optical refractive index than the active layer.
従って第1、第2クラッド層(3)(5)及び活性層(
4)によp光共成器が形成され、活性層(4)内で電子
及び正孔の再結合により生じた光は溝(2)に沿りて進
行しながら増幅芒れ溝(2)に対して垂直に位置する共
振器端面(1a)(1a)よシレーザ光として発振する
。Therefore, the first and second cladding layers (3) (5) and the active layer (
4), a p-light co-former is formed, and the light generated by recombination of electrons and holes in the active layer (4) is amplified while traveling along the groove (2). The resonator end faces (1a) (1a) located perpendicular to the laser beam oscillate as laser light.
f7Jf7Jは上記端面(ia)(1a)表面に形成さ
れたノンドープのZ n S e単結晶薄膜であり、斯
る薄膜はMBEで形成できる口
MBEによる上記薄膜(刀(刀の成長は真空度10−8
” T o r r以上の真空容詣内において、基板温
度550℃、Znソー:x温度300℃、5ey−ス温
度210℃として行える。向上記薄膜(7)の厚さCa
t面(1a)(1a)K対して垂直方向の厚さ〕は所る
レーザの発振波長をλ、Z rlSθ単結晶簿膜の光屈
折率をnとするとλ/2nが好ましい。f7Jf7J is a non-doped ZnSe single crystal thin film formed on the surface of the end face (ia) (1a), and such a thin film can be formed by MBE. -8
” In a vacuum capacity of T o r r or more, the substrate temperature is 550°C, the Zn saw temperature is 300°C, and the 5ey source temperature is 210°C.
The thickness in the direction perpendicular to the t-plane (1a) (1a)K is preferably λ/2n, where λ is the oscillation wavelength of a given laser and n is the optical refractive index of the ZrlSθ single crystal film.
このように・開面の保護膜としてZn5e単結晶膜を用
いると既述した如(ZnS8単結晶の格子定数はGaA
s−GaA/As系単結晶のそれと略同−であるので端
面(1a)への密着度が大となる。従って高温多湿雰囲
気中にかいても端面(1a)が断る雰囲気に晒されるこ
とはなく、ゆえVCIFrる端面(1a)が劣化する危
惧は減少し従来構造に比べて長時間安定な動作が得られ
る。またZn5e単結晶の光吸収端は4900にと低い
ので上記レーザ光が吸収されることがなく高効率の光取
出しが可能である。更に上記薄膜(7)は低温で成長で
きるので断る薄膜(7)の成長時に、第1、第2クラッ
ド層(3)(5)等の成長層に結晶欠陥が生じる危惧も
ない。As mentioned above, when a Zn5e single crystal film is used as a protective film for the open plane (the lattice constant of the ZnS8 single crystal is GaA
Since it is approximately the same as that of the s-GaA/As single crystal, the degree of adhesion to the end face (1a) is high. Therefore, even if the end face (1a) is placed in a high-temperature and humid atmosphere, the end face (1a) will not be exposed to the negative atmosphere, so the risk of deterioration of the VCIFr end face (1a) is reduced, and stable operation for a long time can be obtained compared to the conventional structure. . Furthermore, since the light absorption edge of the Zn5e single crystal is as low as 4900, the laser light is not absorbed and highly efficient light extraction is possible. Furthermore, since the thin film (7) can be grown at low temperatures, there is no risk of crystal defects occurring in the grown layers such as the first and second cladding layers (3) and (5) during the growth of the thin film (7).
次に本実施例レーザと端面(1a)を51gN4、Si
O2、AJzO3で夫々構岐した場合の寿命試瞭を行り
た結果を下表に示す。同所る試験は上記各材料で夫々端
面(1a)+ffiコートされたレーザを50℃の温水
中に浸漬し、A、P、C。Next, the laser of this embodiment and the end face (1a) are made of 51gN4 and Si.
The table below shows the results of a life test when O2 and AJzO3 were used. In the same test, a laser whose end face (1a)+ffi was coated with each of the above materials was immersed in warm water at 50°C.
(Automatic Power Control
) 法を用いた。具体的には出力を5mWに固定して
駆動電流が初期値の2096増となる時間を寿命(時間
)とした。(Automatic Power Control
) method was used. Specifically, the life (hours) was defined as the time when the drive current increased by 2096 from the initial value with the output fixed at 5 mW.
上記表から明らかな如く端面(1a)(1a)保護膜と
してZn5e単結晶を用いると5i5N4τ、5102
、AI!203等を用いるより1桁〜2桁以上寿命が大
となることが判る。As is clear from the above table, when Zn5e single crystal is used as the end face (1a) (1a) protective film, 5i5N4τ, 5102
, AI! It can be seen that the lifespan is one to two orders of magnitude longer than using 203 or the like.
以上の説明から明らかな如く、本発明の半導体レーザで
は共振器端面をznse単結晶薄膜でコートシたことに
より長寿命化が達成できる・As is clear from the above explanation, in the semiconductor laser of the present invention, a long life can be achieved by coating the resonator end face with a ZNSE single crystal thin film.
図は本発明の一実施例を示し、第1図は第2図の1−1
′線断面図、第2図は第1図のn−m’線断面図である
。
(i a ) (1a )−・・共’tia端面、(7
)’(’I)−Z n Se単結晶薄膜。
第1図
■
1 、。
扛
第2図The figures show one embodiment of the present invention, and Fig. 1 is 1-1 in Fig. 2.
2 is a sectional view taken along line nm' in FIG. 1. (ia) (1a) -- both 'tia end face, (7
)'('I)-ZnSe single crystal thin film. Figure 1 ■ 1. Diagram 2
Claims (1)
器端面をZn5e単結晶薄膜でコートしたことを特徴と
する半導体レーザ。(lj A semiconductor laser characterized in that a resonator end face made of GaAs-CaAJAs-based abrasive material is coated with a Zn5e single crystal thin film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14866182A JPS5939082A (en) | 1982-08-26 | 1982-08-26 | Semiconductor laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14866182A JPS5939082A (en) | 1982-08-26 | 1982-08-26 | Semiconductor laser |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5939082A true JPS5939082A (en) | 1984-03-03 |
Family
ID=15457792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14866182A Pending JPS5939082A (en) | 1982-08-26 | 1982-08-26 | Semiconductor laser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5939082A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200576A (en) * | 1984-03-24 | 1985-10-11 | Mitsubishi Electric Corp | Gallium arsenide semiconductor device |
JPS61258490A (en) * | 1985-05-11 | 1986-11-15 | Sony Corp | Semiconductor laser |
JPS6292447A (en) * | 1985-10-18 | 1987-04-27 | Matsushita Electronics Corp | Forming method for protective film of semiconductor element |
EP0381521A2 (en) * | 1989-02-03 | 1990-08-08 | Sharp Kabushiki Kaisha | A semiconductor laser device and a method for the production of the same |
WO2000021168A1 (en) * | 1998-10-08 | 2000-04-13 | Adc Telecommunications, Inc. | Semiconductor lasers having single crystal mirror layers grown directly on facet |
DE102017112610A1 (en) * | 2017-06-08 | 2018-12-13 | Osram Opto Semiconductors Gmbh | Edge-emitting semiconductor laser and operating method for such a semiconductor laser |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55145345A (en) * | 1979-04-27 | 1980-11-12 | Nec Corp | Preparation of protecting film |
-
1982
- 1982-08-26 JP JP14866182A patent/JPS5939082A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55145345A (en) * | 1979-04-27 | 1980-11-12 | Nec Corp | Preparation of protecting film |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200576A (en) * | 1984-03-24 | 1985-10-11 | Mitsubishi Electric Corp | Gallium arsenide semiconductor device |
JPS61258490A (en) * | 1985-05-11 | 1986-11-15 | Sony Corp | Semiconductor laser |
JPS6292447A (en) * | 1985-10-18 | 1987-04-27 | Matsushita Electronics Corp | Forming method for protective film of semiconductor element |
EP0381521A2 (en) * | 1989-02-03 | 1990-08-08 | Sharp Kabushiki Kaisha | A semiconductor laser device and a method for the production of the same |
WO2000021168A1 (en) * | 1998-10-08 | 2000-04-13 | Adc Telecommunications, Inc. | Semiconductor lasers having single crystal mirror layers grown directly on facet |
US6590920B1 (en) | 1998-10-08 | 2003-07-08 | Adc Telecommunications, Inc. | Semiconductor lasers having single crystal mirror layers grown directly on facet |
DE102017112610A1 (en) * | 2017-06-08 | 2018-12-13 | Osram Opto Semiconductors Gmbh | Edge-emitting semiconductor laser and operating method for such a semiconductor laser |
US11043791B2 (en) | 2017-06-08 | 2021-06-22 | Osram Oled Gmbh | Edge emitting semiconductor laser and method of operating such a semiconductor laser |
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