JPS593861B2 - Rectifier with voltage regulator for automobiles - Google Patents

Rectifier with voltage regulator for automobiles

Info

Publication number
JPS593861B2
JPS593861B2 JP54094555A JP9455579A JPS593861B2 JP S593861 B2 JPS593861 B2 JP S593861B2 JP 54094555 A JP54094555 A JP 54094555A JP 9455579 A JP9455579 A JP 9455579A JP S593861 B2 JPS593861 B2 JP S593861B2
Authority
JP
Japan
Prior art keywords
heat dissipation
rectifier
voltage regulator
dissipation block
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54094555A
Other languages
Japanese (ja)
Other versions
JPS5619661A (en
Inventor
要 柴田
征夫 大豆生田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP54094555A priority Critical patent/JPS593861B2/en
Publication of JPS5619661A publication Critical patent/JPS5619661A/en
Publication of JPS593861B2 publication Critical patent/JPS593861B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Description

【発明の詳細な説明】 本発明は自動車又は二輪車等の車輛における発電機から
の交流電圧を直流に変換し、バッテリの充電、ヘッドラ
ンプ或はテールランプ等のランプ類への給電を安定させ
過電流による断線を防ぐために使用される電圧調整器付
整流器に関するものである。
[Detailed Description of the Invention] The present invention converts alternating current voltage from a generator in a vehicle such as an automobile or two-wheeled vehicle to direct current, stabilizing battery charging and power supply to lamps such as headlamps and tail lamps, and preventing overcurrent. This invention relates to a rectifier with a voltage regulator used to prevent wire breakage caused by.

従来使用されているこの種の電圧調整器付整流器は、整
流部と電圧調整部とが同一ケース内に納められた構成の
ものが知られている。
BACKGROUND ART Conventionally used rectifiers with voltage regulators of this type are known to have a configuration in which a rectifying section and a voltage regulating section are housed in the same case.

そしてケース内に納められた各部からケース外に取出さ
れる電気的接続手段は、比較的短い長さのリード線のみ
であり、該リード線を外部導入線に接続しなければなら
ない構成になつている。5 このような構成であると、
その使用に際して、ケース自体を所定の場所に固定しな
ければならず、平面的に所定の広さの取付スペースを必
要とし、使用装置の小型化が図れないこと、及び各リー
ド線に対して外部導入線をその都度個々にハンダ付10
等の手段で接続させなければならず、作業性が悪いばか
クでなく、接続における誤配線が生じ易く、誤配線によ
つて内部の部品が破壊される欠点がある。
The only electrical connection means that can be taken out of the case from each part housed in the case is a relatively short lead wire, and the lead wire must be connected to an external lead wire. There is. 5 With this configuration,
When using it, the case itself must be fixed in a specified location, requiring a certain amount of installation space on a plane, making it impossible to downsize the device used, and Solder the lead-in wires individually each time 10
The connection must be made by means such as the above, which is not only difficult to work with, but also has the drawback that incorrect wiring is likely to occur during connection, and internal components may be destroyed due to incorrect wiring.

本発明はこのような種々の欠点を除去するため15にな
されたものであつて、その目的は全体を小型コンパクト
化すると共に厄介な接続作業を省き、誤配線の生じない
自動車用電圧調整器付整流器を提供しようとするもので
ある。
The present invention was made in order to eliminate these various drawbacks, and its purpose is to reduce the overall size and compactness, eliminate troublesome connection work, and provide a voltage regulator for automobiles that does not cause miswiring. It is intended to provide a rectifier.

この目的を達成するためになされた本発明は、勿 複数
本の接続端子を備えた電圧調整器付整流器において、同
一放熱ブロック上に電圧調整部と整流部を構成するため
の半導体素子、ならびに受動素子と導電部を含むセラミ
ック基板を取付け、前記接続端子を平板状端子とし、該
平板状端子の先端25に狭幅の接続用片部を延長し且つ
略直角に折曲げて形成し、該接続用片部を直接セラミッ
ク基板上の導電部にハンダ付したことを特徴とする自動
車用電圧調整器付整流器であつて、整流部と電圧調整部
とが同一の放熱ブロックに取付けられると同30時に複
数の平板状端子がハンダ付けされて全体的に一つの装置
となク、小型コンパクト化が図れると共に、平板状端子
がそのままコネクタのプラグ側となるため厄介な接続や
誤配線が生じないものとなるのである。
The present invention, which has been made to achieve this object, has a rectifier with a voltage regulator equipped with a plurality of connection terminals, which includes a semiconductor element for configuring a voltage regulator part and a rectifier part on the same heat dissipation block, and a passive A ceramic substrate including an element and a conductive part is mounted, the connecting terminal is a flat terminal, and a narrow connecting piece is extended at the tip 25 of the flat terminal and bent at a substantially right angle to form the connection. This is a rectifier with a voltage regulator for an automobile, characterized in that a working piece is directly soldered to a conductive part on a ceramic substrate, and when the rectifying part and the voltage regulating part are attached to the same heat dissipation block, Multiple flat terminals are soldered together to form a single device, making it smaller and more compact, and since the flat terminals are directly attached to the plug side of the connector, there are no troublesome connections or incorrect wiring. It will become.

35次に本発明を図示の実施例により更に詳しく説明す
ると、1は放熱ブロックであり、該放熱ブロックは銅板
上に銀メッキ又は高融点ハンダメッキを施したものであ
る。
35 Next, the present invention will be explained in more detail with reference to the illustrated embodiments. 1 is a heat radiation block, and the heat radiation block is a copper plate plated with silver or high melting point solder.

この放熱プロツクの一部を端子状に突出形成して一つの
平板状端子2にすると共に、同放熱プロツク上に電圧調
整部及び整流部となる複数個の半導体素子3を取付けて
放熱板を共用させ、更にセラミツク基板4も同様に取付
けてある。セラミツク基板には複数個の導電部5及び印
刷抵抗部6とが設けられておシ、これら導電部と前記し
た半導体素子3との間に夫々対応させて複数のワイヤー
7をボンデイングしてある。
A part of this heat dissipation block is formed to protrude into a terminal shape to form a single flat terminal 2, and a plurality of semiconductor elements 3 serving as a voltage adjustment section and a rectification section are mounted on the heat dissipation block to share the heat dissipation plate. Furthermore, a ceramic substrate 4 is also attached in the same manner. A plurality of conductive parts 5 and printed resistor parts 6 are provided on the ceramic substrate, and a plurality of wires 7 are bonded between these conductive parts and the semiconductor element 3 in correspondence with each other.

このセラミツク基板4に対し、他の平板状端子8,9は
その先端部に延長して一体的に形成した接続用片部8a
,9aを介して、ハンダ10等により一体的に取付け、
結局3本の平板状端子が取出されるのである。前記接続
用片部8a,9aは、常に導電部5と面接触をなして取
付けられるよう考慮され、図示の如く端子8,9がその
表面を放熱プロツク1の表面に対して直交するように配
置される場合でも接続用片部8a,9aは端子8,9の
先端部に延長して且つ略直角に折曲形成されており1そ
の表面が導電部5の表面と平行状態になるようにしてあ
る。
For this ceramic substrate 4, the other flat terminals 8 and 9 are integrally formed with a connecting piece 8a extending from the tip thereof.
, 9a, integrally attached with solder 10, etc.
In the end, three flat terminals are taken out. The connecting pieces 8a, 9a are designed so that they are always attached in surface contact with the conductive part 5, and the terminals 8, 9 are arranged so that their surfaces are perpendicular to the surface of the heat sink 1, as shown in the figure. Even in the case where the connecting pieces 8a and 9a are extended to the tips of the terminals 8 and 9 and bent at a substantially right angle, 1 their surfaces are parallel to the surface of the conductive part 5. be.

加えて接続用片部8a,9aは、その表面幅を平板状端
子8,9の表面幅に比して狭く形成してあう、導電部相
互間の間隔が平板状端子8,9相互間の間隔より狭い場
合或いは導電部5の配設位置と平板状端子8,9の配設
位置とがずれる場合においても通電上支障をきたさない
ようにしてある。前記した各部品の放熱プロツクへの取
付けに当つては、まず放熱プロツク1をカーボン等の治
具上にセツトし、各部の取付けを要する部分に例えば鉛
/錫=95/5の高融点ハンダペレツトを載置し、その
上に半導体素子3(チツプ)、セラミツク基板4、平板
状端子8,9及びハンダ10を載せ、これらを電気炉(
ベルト式炉)に入れ、不活性ガス又は還元性ガス雰囲気
中にて加熱しハンダを溶解してハンダ付けし一体化する
In addition, the connecting pieces 8a and 9a have a surface width narrower than that of the flat terminals 8 and 9, and the distance between the conductive parts is the same as that between the flat terminals 8 and 9. Even if the spacing is narrower than the spacing, or if the location of the conductive portion 5 and the location of the flat terminals 8, 9 are misaligned, there will be no problem in current flow. When attaching each of the above-mentioned parts to the heat dissipation block, first set the heat dissipation block 1 on a jig made of carbon or the like, and apply high melting point solder pellets of lead/tin = 95/5 to the parts where each part needs to be attached. The semiconductor element 3 (chip), the ceramic substrate 4, the flat terminals 8 and 9, and the solder 10 are placed thereon, and these are placed in an electric furnace (
They are placed in a belt-type furnace and heated in an inert gas or reducing gas atmosphere to melt the solder and solder them into one piece.

このようなハンダ付工程のみで構成部品の各部が放熱プ
ロツク1に対し同時に取付けることができるのである。
そしてこの場合に各部はカーボン等の組付治具によう適
切な位置にセツトすることができるため部品相互の位置
関係は自動的に決定されるのである。次に、半導体素子
3と導電部5との間におけるワイヤー7のボンデイング
は、ワイヤー7をアルミワイヤーを利用し、アルミボン
ダにより超音波にてボンデイングすれば簡単に取付けら
れるのである。このように各部を放熱プロツク1に対し
一体的に取付けた後、第3図に示したように、収納部を
有するケース11内に放熱プロツク1を挿入し、各平板
状端子2,8,9が外部に突出した状態で立置させ、収
納部内に例えばエポキシ樹脂等のモールド材12をモー
ルドしてケース11内に密封固定し、一つの装置として
形成するのである。
Each part of the component can be attached to the heat dissipation block 1 at the same time only by such a soldering process.
In this case, each part can be set in an appropriate position using an assembly jig made of carbon or the like, so that the mutual positional relationship of the parts is automatically determined. Next, bonding of the wire 7 between the semiconductor element 3 and the conductive part 5 can be easily performed by using an aluminum wire as the wire 7 and performing ultrasonic bonding with an aluminum bonder. After each part is integrally attached to the heat dissipation block 1 in this way, the heat dissipation block 1 is inserted into the case 11 having a housing part, and each of the flat terminals 2, 8, 9 is attached as shown in FIG. A molding material 12 such as epoxy resin is molded in the storage part and sealed and fixed in the case 11 to form a single device.

肯、前記のハンダ付工程において、ハンダペレツトを使
用したが、予め半導体素子、セラミツク基板、平板状端
子の一部又は全部を予備的にハンダ付けし、これを治具
にセツトして一括・・ンダ付することもできるのである
。以上説明したように本発明に係る電圧調整器付整流器
は、電圧調整部と整流部とを同一放熱プロツク上に取付
けると共に、複数個の平板状端子をも放熱プロツク及び
セラミツク基板上に取付けた構成であるため、(イ)放
熱プロツクが共用となり全体を著しく小型化できる、(
ロ)平板状端子は放熱プロツクやセラミツク基板に直接
ハンダ付けされるため、ハーネス等で接続する場合に比
べて取付スペースが小さくてすみ、小型化できる、(ハ
)後工程でハンダ付けがないため、ハンダ付けによるフ
ラツクスの洗浄は必要ない、(ニ)セラミック基板、平
板状端子のハンダ付けは、半導体チツブの放熱プロツク
へのハンダ付けと同時に行うため、一回のハンダ付け工
程ですみ工数の低減になる、(ホ)放熱プロツクと平板
状端子および平板状端子相互間の寸法出しはカーボン治
具等にセツトする際に行われ、その状態でハンダ付けが
なされるので自動的に決めることができる、(へ)放熱
プロツクと平板状端子が一体化されているので、ケーシ
ングの際、ケースへの挿入が簡単であわ、しかもケース
にガイドを設け、放熱プロツクをガイドに沿つて挿入す
ることによりケースと平板状端子の位置決めができ組立
工数が簡略化される、(ト)平板状端子の先端部には、
導電部にハンダ付固定される幅狭の接続用片部が一体的
に折曲延長形成されているので、平板状端子が、その表
面方向を放熱プロツクの面方向に対して直交状態に配置
されていようとも叉導電部相互間の間隔が平板状端子相
互間の間隔より狭い場合でもさらには導電部の配設位置
と平板状端子の配置位置とがずれるような場合に}いて
も通電上支障をきたさないように確実な導電路を形成す
ることができる。
Yes, solder pellets were used in the soldering process described above, but some or all of the semiconductor elements, ceramic substrates, and flat terminals are pre-soldered in advance, and these are set in a jig and soldered all at once. It is also possible to attach As explained above, the rectifier with voltage regulator according to the present invention has a configuration in which the voltage regulator and the rectifier are mounted on the same heat dissipation block, and a plurality of flat terminals are also mounted on the heat dissipation block and the ceramic substrate. Therefore, (a) the heat dissipation block can be shared and the overall size can be significantly reduced;
(b) Flat terminals are soldered directly to the heat dissipation block or ceramic board, so they require less installation space and can be made more compact than when connecting with a harness, etc. (c) There is no soldering in the post-process. , There is no need to clean the flux after soldering. (d) Soldering of the ceramic board and flat terminal is done at the same time as soldering to the heat dissipation block of the semiconductor chip, reducing the number of man-hours by completing one soldering process. (e) Dimensions between the heat dissipation block, the flat terminals, and each other are done when setting them on a carbon jig, etc., and soldering is done in that state, so they can be determined automatically. (F) Since the heat dissipation block and the flat terminal are integrated, it is easy to insert the heat dissipation block into the case when installing the casing.Moreover, by providing a guide on the case and inserting the heat dissipation block along the guide, the heat dissipation block can be easily inserted into the case. (g) The tip of the flat terminal has a
Since the narrow connecting piece that is soldered and fixed to the conductive part is integrally bent and extended, the flat terminal can be arranged with its surface direction perpendicular to the surface direction of the heat dissipation block. However, even if the distance between the conductive parts is narrower than the distance between the flat terminals, or even if the positions of the conductive parts and the flat terminals are misaligned, there will be problems in conducting electricity. A reliable conductive path can be formed without causing damage.

(7)平板状端子が外部に突出し、この端子がコネクタ
のプラグ側となるため、これが嵌合するコネクタを準備
しておけば、単に挿着させるのみで電路が形成でき、外
部導入線との間においてハンダ付等の厄介な作業が省略
できると共に誤配線が全く生じないものとなる。
(7) The flat terminal protrudes outside and becomes the plug side of the connector, so if you prepare a connector to which this terminal will fit, you can form an electrical path by simply inserting it and connect it to the external lead-in wire. Troublesome work such as soldering can be omitted during the process, and erroneous wiring will not occur at all.

等の種々の優れた効果を奏するのである。It has various excellent effects such as.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る自動車用電圧調整器付整流器の要
部を分離して示した斜視図、第2図は同要部を組立てた
状態の平面図、第3図は同要部をケース内に収納して1
つの装置とした平板状端子突出側の側面図である。 1・・・・・・放熱プロツク、2,a,9・・・・・・
平板状端子、3・・・・・・電圧調整部と整流部の半導
体素子、4・・・・・・セラミツク基板、5・・・・・
・導電部、6・・・・・・印刷抵抗部、7・・・・・・
ワイヤー、8a,9a・・・・・・接続用片部、10・
・・・・・ハンダ、11・・・・・・ケース、12・・
・・・・モールド樹脂。
Fig. 1 is a perspective view showing the main parts of a rectifier with voltage regulator for an automobile according to the present invention separated, Fig. 2 is a plan view of the main parts assembled, and Fig. 3 shows the main parts. Store it in the case 1
FIG. 2 is a side view of a protruding side of a flat terminal as a single device. 1... Heat dissipation block, 2, a, 9...
Flat terminal, 3... Semiconductor element of voltage adjustment section and rectification section, 4... Ceramic substrate, 5...
・Conductive part, 6...Printed resistance part, 7...
Wire, 8a, 9a... Connection piece, 10.
...Solder, 11...Case, 12...
...Mold resin.

Claims (1)

【特許請求の範囲】[Claims] 1 複数本の接続端子を備えた電圧調整器付整流器にお
いて、同一放熱ブロック上に電圧調整部と整流部を構成
するための半導体素子、ならびに受動素子と導電部を含
むセラミック基板を取付け、前記接続端子を平板状端子
とし、該平板状端子の先端に狭幅の接続用片部を延長し
且つ略直角に折曲げて形成し、該接続用片部を直接セラ
ミック基板上の導電部にハンダ付したことを特徴とする
自動車用電圧調整器付整流器。
1. In a rectifier with a voltage regulator equipped with a plurality of connection terminals, a semiconductor element for configuring a voltage adjustment part and a rectification part, as well as a ceramic substrate including a passive element and a conductive part are mounted on the same heat dissipation block, and the said connection The terminal is a flat terminal, a narrow connecting piece is extended at the tip of the flat terminal, bent at a substantially right angle, and the connecting piece is directly soldered to the conductive part on the ceramic substrate. A rectifier with a voltage regulator for automobiles.
JP54094555A 1979-07-25 1979-07-25 Rectifier with voltage regulator for automobiles Expired JPS593861B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54094555A JPS593861B2 (en) 1979-07-25 1979-07-25 Rectifier with voltage regulator for automobiles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54094555A JPS593861B2 (en) 1979-07-25 1979-07-25 Rectifier with voltage regulator for automobiles

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5202583A Division JPS58175862A (en) 1983-03-28 1983-03-28 Hybrid intergrated circuit device

Publications (2)

Publication Number Publication Date
JPS5619661A JPS5619661A (en) 1981-02-24
JPS593861B2 true JPS593861B2 (en) 1984-01-26

Family

ID=14113555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54094555A Expired JPS593861B2 (en) 1979-07-25 1979-07-25 Rectifier with voltage regulator for automobiles

Country Status (1)

Country Link
JP (1) JPS593861B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137884U (en) * 1988-03-10 1989-09-20
JPH0381813U (en) * 1989-12-07 1991-08-21

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137884U (en) * 1988-03-10 1989-09-20
JPH0381813U (en) * 1989-12-07 1991-08-21

Also Published As

Publication number Publication date
JPS5619661A (en) 1981-02-24

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