JPS5938058Y2 - wiring film - Google Patents
wiring filmInfo
- Publication number
- JPS5938058Y2 JPS5938058Y2 JP1977030465U JP3046577U JPS5938058Y2 JP S5938058 Y2 JPS5938058 Y2 JP S5938058Y2 JP 1977030465 U JP1977030465 U JP 1977030465U JP 3046577 U JP3046577 U JP 3046577U JP S5938058 Y2 JPS5938058 Y2 JP S5938058Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring
- film
- wiring film
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【考案の詳細な説明】
本考案は、基板上に形成される導電パターン間の配線を
容易にした基板実装用配線フィルムの改良に係る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a wiring film for board mounting that facilitates wiring between conductive patterns formed on a board.
薄膜回路基板或は厚膜回路基板上に形成された導電パタ
ーン、例えばサーマルプリンタ等のヘッドに電流を供給
するための線路を電流を供給する回路に接続する場合、
従来フィルム上にその配線パターンに応じた導捧ヒ＜タ
ーンを、絶縁層を介して接続したり、或は金つイヤ、Ａ
１ワイヤ等の良導体の導線を各線路にボンディングする
等して接続するこうにしている。When connecting a conductive pattern formed on a thin film circuit board or a thick film circuit board, for example, a line for supplying current to a head of a thermal printer, to a circuit supplying current,
Conventionally, conductive leads corresponding to the wiring pattern are connected on the film via an insulating layer, or metal wires, A
A good conductor wire such as a single wire is connected to each line by bonding or the like.
しかしながら、こうした従来の方法では、配線が複雑と
なり多層配線を必要とする場合、基板上に交互に絶縁層
と配線パターンを形成するものは表面に凸凹が多くなり
、断線、短絡が生じ、ワイヤで接続するものは各ワイヤ
の接触等による短絡が生ずるという欠点を有している。However, with these conventional methods, when the wiring becomes complex and multilayer wiring is required, the surface of the circuit board that alternately forms insulating layers and wiring patterns becomes uneven, resulting in disconnections and short circuits. The disadvantage of the connection is that short circuits may occur due to contact between the wires.
本考案の目的は、こうした断線、短絡を生ぜしめない配
線フィルムを提供する事にある。The purpose of the present invention is to provide a wiring film that does not cause such disconnections and short circuits.
上記目的を達成するために本考案では、結線すべき位置
に導体を露出させ、且つ上下を絶縁フィルムにより挾ま
れる導体により配線させるようにしたものであり、以下
実施例につき詳述する。In order to achieve the above object, the present invention exposes a conductor at the position where the wires are to be connected, and wires the conductor with the upper and lower sides sandwiched by insulating films.Examples will be described in detail below.
第１図は、本考案実施例の配線フィルムの断面図、第２
図は、本考案の実施例の配線フィルムの説明図である。Figure 1 is a cross-sectional view of the wiring film according to the embodiment of the present invention;
The figure is an explanatory diagram of a wiring film according to an embodiment of the present invention.
図中、１は配線フィルム、ｉｏ、１ｉはポリイミド等の
絶縁フィルムである樹脂フィルム、２は導体パターン、
３は孔、４は導体露出部、５は基板、６は基板上の導体
パターンである。In the figure, 1 is a wiring film, io and 1i are resin films that are insulating films such as polyimide, 2 is a conductor pattern,
3 is a hole, 4 is a conductor exposed portion, 5 is a substrate, and 6 is a conductor pattern on the substrate.
第１図において、配線フィルム１は次の様にして作成さ
れる。In FIG. 1, a wiring film 1 is produced as follows.
先ず、マイラ或は、樹脂等のフィルム１０の配線パター
ンに応じた位置に孔３を形成する。First, holes 3 are formed in a film 10 made of mylar or resin at positions corresponding to the wiring pattern.
次に、金、銅等の導体２を形成する。Next, a conductor 2 of gold, copper, etc. is formed.
これは、箔或は線状の導体２を樹脂等、公知の固着剤で
固着するようにしてもよい。This may be done by fixing the foil or linear conductor 2 with a known fixing agent such as resin.
更に導体２上にフィルム１１を固着させて第１図の如く
該導体２が７キルム１０．１１により挾まれるようにし
た後、孔３を銅、金、クロム等の導体を用いてメッキし
孔埋めすることにより、導体２と電気的に接続された導
体露出部４を形成する。Furthermore, after fixing the film 11 on the conductor 2 so that the conductor 2 is sandwiched between the seven kilts 10 and 11 as shown in FIG. 1, the holes 3 are plated with a conductor such as copper, gold, or chromium. By filling the hole, a conductor exposed portion 4 electrically connected to the conductor 2 is formed.
こうして作成された配線フィルム１は、薄膜或は厚膜回
路基板５上の対応する導体パターン６の表面上に載置さ
れ、熱圧着、超音波、抵抗等公知の溶接技術で溶接され
る。The wiring film 1 thus produced is placed on the surface of the corresponding conductor pattern 6 on the thin film or thick film circuit board 5, and welded by known welding techniques such as thermocompression, ultrasonic, and resistance.
以上記載した様に、本考案によれば立体配線が可能とな
り、断線、短絡等を生せしめず、しかも、フィルムと基
板のパターンとの接続は面対応で行なわれるから、高密
度な配線ができる配線フィルムが実現される。As described above, according to the present invention, three-dimensional wiring is possible, and there is no disconnection or short circuit.Furthermore, the connection between the film and the pattern on the board is made surface-wise, so high-density wiring is possible. A wiring film is realized.
第１図、第２図は本考案の実施例の断面図及び説明用斜
視図である。
図中、１は配線フィルム、１０，１１は絶縁フィルム、
２は導体、３は孔、４は導体露出部、５は基板、６は導
体パターンである。1 and 2 are a sectional view and an explanatory perspective view of an embodiment of the present invention. In the figure, 1 is a wiring film, 10 and 11 are insulating films,
2 is a conductor, 3 is a hole, 4 is a conductor exposed portion, 5 is a substrate, and 6 is a conductor pattern.
Claims (1)
に接続せしめて配線を施すための基板実装用配線フィル
ムにおいて、箔或いは線材の導体が２枚の絶縁フィルム
間に挾まれて固着され、且つ前記基板と対向する一方の
前記絶縁フィルムの前記導体パターンに対向する位置に
は該一方の絶縁フィルムに開けられた孔を埋めるメッキ
導体からなる導体露出部が形成されて配線フィルムが構
成され、該導体露出部を前記導体パターン表面に接続し
て該導体パターンと前記絶縁フィルム間の前記導体との
配線接続が行なわれることを特徴とした配線フィルム。In a wiring film for board mounting for electrically connecting and wiring a plurality of conductor patterns formed on the surface of a board, a conductor made of foil or wire is sandwiched and fixed between two insulating films, and a conductor exposed portion made of a plated conductor that fills a hole opened in the one insulating film is formed at a position facing the conductor pattern of one of the insulating films facing the substrate, thereby forming a wiring film; A wiring film characterized in that the conductor exposed portion is connected to the surface of the conductor pattern to establish a wiring connection between the conductor pattern and the insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977030465U JPS5938058Y2 (en) | 1977-03-14 | 1977-03-14 | wiring film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977030465U JPS5938058Y2 (en) | 1977-03-14 | 1977-03-14 | wiring film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53125054U JPS53125054U (en) | 1978-10-04 |
| JPS5938058Y2 true JPS5938058Y2 (en) | 1984-10-22 |
Family
ID=28880173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977030465U Expired JPS5938058Y2 (en) | 1977-03-14 | 1977-03-14 | wiring film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938058Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4060804B1 (en) * | 2019-11-13 | 2024-08-21 | Nippon Telegraph And Telephone Corporation | High-frequency line structure, subassembly, line card, and manufacturing method for high-frequency line structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3362005A (en) * | 1967-06-26 | 1968-01-02 | Berg Electronics Inc | Hinge type connector for circuit boards |
| JPS5150279U (en) * | 1974-10-12 | 1976-04-16 |
-
1977
- 1977-03-14 JP JP1977030465U patent/JPS5938058Y2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3362005A (en) * | 1967-06-26 | 1968-01-02 | Berg Electronics Inc | Hinge type connector for circuit boards |
| JPS5150279U (en) * | 1974-10-12 | 1976-04-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53125054U (en) | 1978-10-04 |
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