JPS5938053Y2 - microwave circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the position of external connection terminals in a resin-coated microwave integrated circuit device.

For integrated circuit devices in which microwave amplifier circuits, oscillation circuits, etc. are constructed on a single substrate, so-called can-type packages, which are housed in metal containers, have traditionally been adopted as a protection measure. Ceramic packages and resin mold packages have also come to be used.

Unlike a metal package, a ceramic or resin mold package is an insulator, so one of its advantages is that it increases the degree of freedom regarding the location of external connection terminals.

In order to combine microwave integrated circuit devices to form a device with greater functionality, it is often the case that multiple pieces of these devices are used. A structure for an external connection terminal that minimizes parasitic effects has been invented and filed by the present applicant.

On the other hand, it has long been possible to protect devices from oxygen, moisture, and dust in the atmosphere by simply coating hybrid ICs and various circuit devices formed on printed boards with resin, without using metal packages or the like. Especially in low-frequency equipment, coating with relatively high hardness resin provides protection against external forces to a certain extent.
Efforts are being made to prevent damage caused by external forces during transportation and installation into equipment.

In the past, this kind of use was limited to low-frequency applications, probably because in high-frequency equipment, resin coating increases high-frequency loss and was judged to be impractical, but in recent years this type of use has The development of resins has progressed, and as a result of actual use by the inventors of this case, for example, by coating polyimide resin, it has been found that it has a certain degree of protection ability against external mechanical forces and also tolerates high frequency loss. A coverage within the range has been obtained.

The present invention proposes to provide external connection terminals as described above even in such resin-coated integrated circuit devices.

FIG. 1 shows the device of the present invention.

A sapphire chip 2 is pasted onto a base 1 made of copper or other material with good thermal conductivity, on which a microwave integrated circuit (not shown) is formed.

A polyimide resin 3 is applied to the circuit device section.

This resin coating is performed using a spin cord before dicing the sapphire, ie, when the sapphire is in the form of a wafer and an integrated circuit device is formed.

If the sapphire is then diced, the applied resin will also be divided at the same time.

In this state, since the resin is also applied onto the external connection terminals, the external connection terminals 4 will be exposed by removing the resin at this portion by photoprocessing.

FIG. 2 shows a state in which a plurality of integrated circuit devices formed in this manner are connected.

As is clear from the figure, the output terminal of one integrated circuit device will be adjacent to the input terminal of the next device, and the connection between the two will be such that the connecting metal, e.g. This can be done by a process such as fitting, bonding, or alloying.

This also applies to the bias terminal, and is an effect produced by providing the external connection terminal at such a position.

[Brief explanation of drawings]

1 and 2 are diagrams showing the present invention, in which 1 is a copper block, 2 is sapphire, 3 is polyimide resin, and 4 is an external connection terminal.

Claims (1)

[Scope of utility model registration request] It has a microwave circuit formed by arranging required elements on an insulating substrate, a microwave input/output terminal, and a bias terminal, and the input/output terminal and the bias terminal are connected to the microwave circuit. When a plurality of formed insulating substrates are butted and lined up, the respective terminals are provided in adjacent positions, and protective resin is applied except for the input/output terminals and bias terminals. Characteristic microwave circuit device.