JPS5937541B2 - electronic microscope - Google Patents

electronic microscope

Info

Publication number
JPS5937541B2
JPS5937541B2 JP52106407A JP10640777A JPS5937541B2 JP S5937541 B2 JPS5937541 B2 JP S5937541B2 JP 52106407 A JP52106407 A JP 52106407A JP 10640777 A JP10640777 A JP 10640777A JP S5937541 B2 JPS5937541 B2 JP S5937541B2
Authority
JP
Japan
Prior art keywords
electron beam
evaporation
filament
electron
evaporation material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52106407A
Other languages
Japanese (ja)
Other versions
JPS5439566A (en
Inventor
久雄 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeol Ltd
Original Assignee
Nihon Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Denshi KK filed Critical Nihon Denshi KK
Priority to JP52106407A priority Critical patent/JPS5937541B2/en
Publication of JPS5439566A publication Critical patent/JPS5439566A/en
Publication of JPS5937541B2 publication Critical patent/JPS5937541B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は電子顕微鏡において、試料室内で蒸発せしめた
蒸発粒子を試料メツシュ上に蒸着することにより蒸着過
程や結晶生長過程を観察するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention uses an electron microscope to observe the vapor deposition process and crystal growth process by depositing evaporated particles evaporated in a sample chamber onto a sample mesh.

斯種の従来装置としては第1図に示すような構造のもの
が実用に供せられてきた。
As a conventional device of this kind, one having a structure as shown in FIG. 1 has been put into practical use.

即ち、対物レンズ1の上方におかれた試料室2内の空間
3に真空蒸発源となる複数のフィラメント4 、4’を
設けたものである。
That is, a plurality of filaments 4 and 4' serving as a vacuum evaporation source are provided in a space 3 in a sample chamber 2 placed above an objective lens 1.

該フイラメン) 4 、4’は試料室2外に設けられた
フィラメント制御電源5,5′に接続されており、又該
フイラメン) 4 、4’の内部には蒸発試料6,6′
が挿入されている。
The filaments ) 4 and 4' are connected to filament control power supplies 5 and 5' provided outside the sample chamber 2, and evaporated samples 6 and 6' are installed inside the filaments ) 4 and 4'.
has been inserted.

前記対物レンズ1の中心には磁極片7が設けられており
、該磁極片の内側には電子顕微鏡像を観察する試料メツ
シュ(該メツシュ上にカーボン薄膜或いはマイクログリ
ッドが張られている)8が配置されている。
A magnetic pole piece 7 is provided at the center of the objective lens 1, and a sample mesh 8 (on which a carbon thin film or microgrid is stretched) 8 for observing electron microscope images is provided inside the magnetic pole piece. It is located.

しかしてフィラメント制御電源5よりフィラメント4に
電流を供給すれば、フィラメント4が加熱され、蒸発材
料6は蒸発をはじめ、蒸発粒子9が試料メツシュ8の上
に蒸着される。
When current is supplied to the filament 4 from the filament control power source 5, the filament 4 is heated, the evaporation material 6 begins to evaporate, and evaporation particles 9 are deposited on the sample mesh 8.

又同様にフィラメント制御電源5′からフィラメント4
′に電流を供給することにより蒸発材料6′の蒸発粒子
9′を試料メツシュ8上に蒸着することもできる。
Similarly, the filament 4 is connected from the filament control power source 5'.
It is also possible to deposit vaporized particles 9' of the vaporized material 6' onto the sample mesh 8 by supplying current to the sample mesh 8.

更にフイラメンl−4、4’を同時に加熱することによ
り蒸発材料6,6′を同時に試料メツシュ」二に蒸着す
ることもできる。
Furthermore, by simultaneously heating the filaments 1-4 and 4', the vaporized materials 6 and 6' can be simultaneously deposited on the sample mesh.

このとき照射電子線10を試料メツシュ8に照射すれば
、蒸着の過程、結晶成長過程を観察することができる。
At this time, by irradiating the sample mesh 8 with the electron beam 10, the vapor deposition process and crystal growth process can be observed.

しかし乍ら斯様な真空蒸着方式を用いた装置においては
、例えばタングステンの如き高融点金属の蒸着を行うに
は大電力を必要とする。
However, in an apparatus using such a vacuum deposition method, a large amount of electric power is required to deposit a high melting point metal such as tungsten.

又フィラメントに大電流が供給されると、電子線通路上
に非対称の漏洩磁場が生ずるため電子線が不正偏向され
、観察に不都合が生じる。
Furthermore, when a large current is supplied to the filament, an asymmetric leakage magnetic field is generated on the electron beam path, causing the electron beam to be improperly deflected, resulting in inconvenience in observation.

本発明は斯様な点に鑑みて、低加速電子線を蒸発材料に
衝撃して蒸発させる装置を提供するもので、以下第2図
に基づき詳説する。
In view of these points, the present invention provides an apparatus for bombarding an evaporation material with a low-acceleration electron beam to evaporate it, and will be described in detail below with reference to FIG. 2.

尚同図中第1図と同一番号は同一構成要素を示す。In this figure, the same numbers as in FIG. 1 indicate the same components.

第2図は本発明の一実施例を示す縦断面図で、11は試
料室2内の空間3におかれた環状の蒸着用電子線発生源
で、該電子線発生源は環状フィラメント12と該フィラ
メントを取り囲むようおかれた制御電極13とから構成
されている。
FIG. 2 is a longitudinal cross-sectional view showing an embodiment of the present invention. Reference numeral 11 denotes an annular evaporation electron beam source placed in the space 3 in the sample chamber 2, and the electron beam source includes an annular filament 12 and an annular filament 12. and a control electrode 13 placed so as to surround the filament.

前記環状フィラメント12の中心は電子ビーム光軸ト一
致するようにおかれており、又該フィラメントは試料室
2外に設けられた電源14に接続され、例えば数KVの
負の高電圧が印加されると共に加熱電流が供給される。
The center of the annular filament 12 is aligned with the optical axis of the electron beam, and the filament is connected to a power source 14 provided outside the sample chamber 2, to which a negative high voltage of, for example, several KV is applied. At the same time, a heating current is supplied.

尚前記制御電極13には電源14から負の高電圧が印加
されている。
Note that a negative high voltage is applied to the control electrode 13 from a power source 14 .

15a及び15bは前記電子線発生源11の上方におか
れ、かつ電子ビーム光軸を中心にして対称な位置におか
れた蒸発材料で、アース電位に保たれており、又該両蒸
発材料はラック16a、16bに夫々固定されている。
Reference numerals 15a and 15b are evaporation materials placed above the electron beam generation source 11 and at symmetrical positions with respect to the electron beam optical axis, and are kept at ground potential. They are fixed to racks 16a and 16b, respectively.

該ラック16aj 16bは集束レンズ17の底部に固
定された保持体18内に移動可能に保持されており、該
両ランクの移動方向は電子ビーム光軸と平行である。
The racks 16aj and 16b are movably held in a holder 18 fixed to the bottom of the focusing lens 17, and the moving direction of both ranks is parallel to the electron beam optical axis.

19a及び19bは前記ラック16a、16bを移動さ
せるためのピニオンで、該両ピニオンは軸を介して試料
室2外に設けたモーター20a 、20bに夫々連結さ
れている。
Pinions 19a and 19b are used to move the racks 16a and 16b, and both pinions are connected via shafts to motors 20a and 20b provided outside the sample chamber 2, respectively.

21は前記電子線発生源11と保持体18とを一体化せ
しめるための筒体である。
Reference numeral 21 denotes a cylindrical body for integrating the electron beam generation source 11 and the holding body 18.

22は前記保持体18の中央部に設けた照射電子線10
を通過せしめるための穴である。
Reference numeral 22 denotes an irradiation electron beam 10 provided at the center of the holder 18.
It is a hole for passing through.

しかして今、同図にその状態を示すように蒸発材料15
aのみを保持体18から取り出し、環状フィラメント1
2に近づけた状態において、電源14よりフィラメント
に負の高電圧及び加熱電流を供給せしめれば、環状フィ
ラメントから発生する電子Eは蒸発材料15aを衝撃す
る。
However, now, as shown in the figure, the evaporation material 15
Take out only the annular filament 1 from the holder 18.
2, if a negative high voltage and heating current are supplied to the filament from the power source 14, the electrons E generated from the annular filament will impact the evaporation material 15a.

該電子衝撃により蒸発材料15aは蒸発し、その蒸発粒
子Vは環状フィラメントの内側を通過して試料メツシュ
8上に蒸着される。
The evaporation material 15a is evaporated by the electron bombardment, and the evaporation particles V pass through the inside of the annular filament and are deposited on the sample mesh 8.

文通にピニオン19aにより蒸発材料15aを保持体1
8内に収納し、ピニオン19bにより他方の蒸発材料1
5bを環状フィラメント12に近づければ、この蒸発材
料15bが電子衝撃され、蒸発される。
The evaporative material 15a is transferred to the holder 1 by the pinion 19a.
8 and the other evaporation material 1 by the pinion 19b.
When 5b is brought close to the annular filament 12, this evaporation material 15b is bombarded with electrons and evaporated.

更に蒸発材料15a及び15bを同時に環状フィラメン
トに近づければ、環状フィラメントから発生する電子線
が両蒸発材料を同時に衝撃する。
Furthermore, if the evaporation materials 15a and 15b are brought close to the annular filament at the same time, the electron beam generated from the annular filament bombards both evaporation materials at the same time.

即ち環状フィラメントの内、電子ビーム光軸を中心にし
て左側部分から発生する電子線が蒸発材料15aを照射
し、又電子ビーム光軸を中心にして右側部分から発生す
る電子線が蒸発材料15bを照射する。
That is, the electron beam generated from the left side of the annular filament with the electron beam optical axis as the center irradiates the evaporation material 15a, and the electron beam generated from the right side of the annular filament with the electron beam optical axis as the center irradiates the evaporation material 15b. irradiate.

そのため試料メツシュ8上には蒸発材料15a。Therefore, the evaporation material 15a is placed on the sample mesh 8.

15bが同時に蒸着される。15b is deposited at the same time.

そこで蒸着を行なっているとき或いは蒸着完了後に照射
電子線10を試料メツシュ8上に照射せしめることによ
り蒸着の過程或いは結晶成長過程を観察することができ
る。
By irradiating the sample mesh 8 with the electron beam 10 during the vapor deposition or after the vapor deposition is completed, the vapor deposition process or crystal growth process can be observed.

以上の様に本発明においては蒸発材料を電子線衝撃によ
り蒸発せしめるため、高融点金属の蒸着を従来の真空蒸
着方式のように大電力を必要とすることなく行なうこと
ができる。
As described above, in the present invention, since the evaporation material is evaporated by electron beam bombardment, the high melting point metal can be evaporated without requiring a large amount of power unlike the conventional vacuum evaporation method.

又蒸着用電子銃は環状となすと共に電子ビーム光軸に対
して対称に配役せしめているため、蒸着用電子銃部分か
ら発生する漏洩磁場は軸対称となり、従って照射電子線
が不正偏向されることがなくなる等、実用性大なる効果
を有する。
Furthermore, since the evaporation electron gun is annular and arranged symmetrically with respect to the electron beam optical axis, the leakage magnetic field generated from the evaporation electron gun becomes axially symmetrical, which prevents the irradiated electron beam from being improperly deflected. It has a great practical effect, such as eliminating the problem.

尚前述の説明では蒸発材料は2つ設けた場合を示したが
、1つ又は3つ以上設げてもよい。
In the above description, the case where two evaporation materials are provided is shown, but one or three or more evaporation materials may be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来装置を説明するための縦断面図、第2図は
本発明の一実施例を示すための縦断面図である。 第2図において、1は対物レンズ、2は試料室、7は磁
極片、8は試料メツシュ、10は照射電子線、11は蒸
着用電子銃、12は環状フィラメント、13は制御電極
、14は電源、15a及び15bは蒸発材料、16a及
び16bはラック、17は集束レンズ、18は保持体、
19 a 、19 bはピニオン、20a及び20bは
モーターである。
FIG. 1 is a vertical cross-sectional view for explaining a conventional device, and FIG. 2 is a vertical cross-sectional view for showing an embodiment of the present invention. In FIG. 2, 1 is an objective lens, 2 is a sample chamber, 7 is a magnetic pole piece, 8 is a sample mesh, 10 is an irradiation electron beam, 11 is an electron gun for deposition, 12 is an annular filament, 13 is a control electrode, and 14 is a 15a and 15b are evaporation materials, 16a and 16b are racks, 17 is a focusing lens, 18 is a holder,
19a and 19b are pinions, and 20a and 20b are motors.

Claims (1)

【特許請求の範囲】[Claims] 1 試料室内に環状の真空蒸着用電子銃を設け、該電子
銃はその中心が電子ビーム光軸と一致しており、又該電
子銃の上方にこの電子銃に対して進退可能に保持された
少なくとも1つの蒸発材料を配設し、該蒸発材料に前記
電子銃からの電子線を衝撃せしめることにより該材料を
蒸発させる如く構成してなる電子顕微鏡。
1. An annular vacuum evaporation electron gun is installed in the sample chamber, and the center of the electron gun is aligned with the electron beam optical axis, and the electron gun is held above the electron gun so that it can move forward and backward with respect to the electron gun. An electron microscope comprising: at least one evaporation material; the evaporation material is evaporated by bombarding the evaporation material with an electron beam from the electron gun;
JP52106407A 1977-09-05 1977-09-05 electronic microscope Expired JPS5937541B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52106407A JPS5937541B2 (en) 1977-09-05 1977-09-05 electronic microscope

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52106407A JPS5937541B2 (en) 1977-09-05 1977-09-05 electronic microscope

Publications (2)

Publication Number Publication Date
JPS5439566A JPS5439566A (en) 1979-03-27
JPS5937541B2 true JPS5937541B2 (en) 1984-09-10

Family

ID=14432814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52106407A Expired JPS5937541B2 (en) 1977-09-05 1977-09-05 electronic microscope

Country Status (1)

Country Link
JP (1) JPS5937541B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115611A (en) * 1981-01-08 1982-07-19 Toshiba Corp Red flame type combustion apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52103406A (en) * 1976-02-27 1977-08-30 Tigers Polymer Apparatus for fixing refractory bricks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52103406A (en) * 1976-02-27 1977-08-30 Tigers Polymer Apparatus for fixing refractory bricks

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115611A (en) * 1981-01-08 1982-07-19 Toshiba Corp Red flame type combustion apparatus

Also Published As

Publication number Publication date
JPS5439566A (en) 1979-03-27

Similar Documents

Publication Publication Date Title
EP0141417B1 (en) Apparatus for forming film by ion beam
US5739528A (en) Fast atom beam source
US3219817A (en) Electron emission microscope with means to expose the specimen to ion and electron beams
US3900585A (en) Method for control of ionization electrostatic plating
GB2049739A (en) Vacuum evaporation using a modulated electron beam and x-ray opaque screen
US3534385A (en) Process and apparatus for micro-machining and treatment of materials
JPS5937541B2 (en) electronic microscope
JPH0456761A (en) Thin film forming device
DE4020158A1 (en) Appts. for thin film coating of metallic substrates - comprises vacuum chamber, rotating substrate carrier, plasma generator and electron beam vaporiser
JPS5915385Y2 (en) electronic microscope
JPS60100421A (en) Ion beam device
US4713833A (en) X-ray source apparatus
JPS5832197Y2 (en) electronic microscope
JPH0473847A (en) Electron radiation device
JPH08171882A (en) Focusing ion beam device and pretreatment method for sample
JPH09257670A (en) Specimen preparing apparatus for electron microscope
JPS616271A (en) Method and device for bias ion plating
Einstein et al. The design of an experimental electron beam machine
JPH0340353A (en) Electron microscope or the like
JP4073158B2 (en) Electron beam equipment
JPH0665015B2 (en) electronic microscope
JPH10269981A (en) Electron/ion beam irradiation device, scanning electron microscope equipped with the electron/ion beam irradiation device, and fib device equipped with the electron/ion beam irradiation device
RU2071138C1 (en) Field-effect ion source
JPH1154078A (en) Scanning electron microscope incorporating plasma ion shower function, and device similar thereto
JPS5927383B2 (en) Ion beam thin film production equipment