JPS5936951A - 電子機器装置の冷却構造 - Google Patents
電子機器装置の冷却構造Info
- Publication number
- JPS5936951A JPS5936951A JP57146841A JP14684182A JPS5936951A JP S5936951 A JPS5936951 A JP S5936951A JP 57146841 A JP57146841 A JP 57146841A JP 14684182 A JP14684182 A JP 14684182A JP S5936951 A JPS5936951 A JP S5936951A
- Authority
- JP
- Japan
- Prior art keywords
- package
- guide plate
- packages
- electronic circuit
- cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 238000009423 ventilation Methods 0.000 claims abstract description 22
- 230000020169 heat generation Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract 1
- 230000010365 information processing Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57146841A JPS5936951A (ja) | 1982-08-26 | 1982-08-26 | 電子機器装置の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57146841A JPS5936951A (ja) | 1982-08-26 | 1982-08-26 | 電子機器装置の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5936951A true JPS5936951A (ja) | 1984-02-29 |
| JPS638616B2 JPS638616B2 (enExample) | 1988-02-23 |
Family
ID=15416740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57146841A Granted JPS5936951A (ja) | 1982-08-26 | 1982-08-26 | 電子機器装置の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936951A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270645A (ja) * | 2007-04-24 | 2008-11-06 | Nec Corp | ラック装置 |
-
1982
- 1982-08-26 JP JP57146841A patent/JPS5936951A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270645A (ja) * | 2007-04-24 | 2008-11-06 | Nec Corp | ラック装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS638616B2 (enExample) | 1988-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7400505B2 (en) | Hybrid cooling system and method for a multi-component electronics system | |
| US8520387B2 (en) | Server cabinet | |
| JP2013509638A (ja) | ブレード・エンクロージャ用の熱バスバー | |
| JPS61267398A (ja) | 電子装置の冷却構造 | |
| CN101165629A (zh) | 计算机系统冷却系统 | |
| JPS5936951A (ja) | 電子機器装置の冷却構造 | |
| JP3570995B2 (ja) | 電子回路パッケージの冷却構造 | |
| JP2806373B2 (ja) | 電子機器の冷却構造 | |
| JPH04309294A (ja) | 電子部品の冷却構造 | |
| JPS6011840B2 (ja) | 電子回路パッケ−ジの冷却構造 | |
| JPS57118656A (en) | Mounting structure of large scale integrated circuit (lsi) | |
| US20250358985A1 (en) | Power supply device | |
| JPH02144998A (ja) | プリント板ユニットの冷却構造 | |
| JPH041520B2 (enExample) | ||
| JPS5911520Y2 (ja) | プリント板ガイドレ−ルの構造 | |
| JPH04266091A (ja) | 電子装置の冷却機構 | |
| JPS5936959Y2 (ja) | プリント板収納用筐体 | |
| JPS6012319Y2 (ja) | 電子装置の放熱構造 | |
| JPS61117894A (ja) | 発熱性電子機器収納の冷却筐体 | |
| JPS59144153A (ja) | 集積回路パツケ−ジ冷却構造 | |
| JP2001344961A (ja) | 磁気ディスク装置の冷却構造 | |
| CN120035086A (zh) | 一种利用电路板下方空间的散热模组 | |
| JPS59144200A (ja) | 発熱機器収納盤の冷却装置 | |
| JP2526970B2 (ja) | 集積回路パッケ―ジの冷却構造 | |
| JP2000261176A (ja) | キャビネットの冷却構造および方法 |