JPS593588Y2 - circuit board - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to a circuit board.

Some conventional circuit boards have a circuit pattern formed on the board by sputtering, vapor deposition, etc., and then electrolytic plating is performed to increase the thickness of the pattern.

Since it is necessary to perform this plating, all the circuit patterns are short-circuited in advance, and as a post-processing process, they are processed using a press machine.
The connection parts of each pattern are separated by punching out the connection parts.

However, this configuration requires a press machine and requires time and effort for processing operations.

An object of the present invention is to provide a circuit board on which lead patterns electrically connected in advance can be easily separated without using a press.

Embodiments of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, a substrate 1 is made of a non-conductive material such as synthetic resin such as polycarbonate and polysulfon.

A circuit pattern 2 is formed on the upper surface of the substrate 1, and the circuit patterns are electrically connected in advance.

That is, the patterns 2a and 2 arranged on the left side of the substrate 1
b, 2C, and 2d are electrically connected in advance by connection pattern 3, and patterns 2e, 2f, and 2g on the right side are connected by connection pattern 4.

The connection patterns 3 and 4 are connected by a connection pattern 5 along the edge of the substrate 1.

A bottomed hole 6 is bored in the back surface of the substrate 1, as shown in FIG.

The hole 6 is used to cut off the electrically connected circuit pattern 2.

For this purpose, the bottom of the hole 6 is formed as a thin part 7, and the thickness of this thin part is so thin that it can be easily broken with, for example, the tip of a screwdriver in the direction of the arrow.

To further explain the hole portion 6 based on the example shown in the first diagram, among the hole portions 6a, 6b, and 6C provided on the left side of the substrate 1, the hole portion 6a is located below the connection pattern 3 at the left end of the pattern 2b. By cutting off the electrical connection between connection pattern 3 and pattern 2b, adjacent pattern 2a
, 2 b.

The hole 6b is located at the bottom of the pattern 2C, and serves to cut off the connection pattern 3 and the adjacent pattern 2b.

Furthermore, the hole 6C is for cutting off the connection between the patterns 2d and 20, and is arranged below the connection pattern 3.

Also, a hole 6d is provided on the right side of the substrate 1. 6e and 6
f is provided at the bottom of the connection pattern 4 at the right end of each of the patterns 2e, 2f, and 2g, and serves to disconnect the patterns adjacent to each other.

Connection patterns 3.4 and 5 are then separated by holes 6C and 6f, respectively.

The position and number of thin parts on the circuit pattern 2 are not limited to the upper side.

In the circuit board configured in this way, if all the patterns 2a to 2g are required, by pushing up the tip of a tool such as a screwdriver from the back side of the board 1 toward the thin wall portion of each hole 6a to 6f. , the thin part and the pattern part on its upper surface are removed, and as a result, each hole becomes transparent as shown in Fig. 3.
dl, 6 el, and 6 fl, and the adjacent patterns are separated and electrically disconnected.

In addition, in the circuit board of the present invention, it is also possible to selectively leave some of the thin-walled portions according to the circuit configuration of the pattern without removing the thin-walled portions of all the holes 6a to 6f.

In addition, instead of the hole, a groove 8 is formed in the width direction at the end of the substrate 1, as shown in FIGS. 4 and 5, and the bottom of the groove is replaced by a thin wall 9.
You can also use it as

In this case, when using the circuit board, the end 1a of the board 1 can be easily cut with a fingertip from the groove 8 to form patterns 2e, 2f, 2g.
Perform the separation.

Patterns 2a to 2d are separated by holes 5 as shown in the figure.
a, 5c may be used, but grooves may also be used.

As described above, according to the present invention, circuit patterns that are electrically connected in advance can be easily separated without using a press machine, and the manufacturing cost of the circuit board can be reduced, making it practical. The above effect is significant.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a circuit board showing an embodiment of the present invention, Fig. 2 is a partially enlarged sectional view of a hole, Fig. 3 is a perspective view of the circuit board showing a separated pattern, and Fig. 4 The figure is a perspective view of another embodiment of the circuit board, and FIG. 5 is a partially enlarged sectional view of the groove. 1... Board, 2, 2a to 2g... Circuit pattern, 3, 4° 5... Connection pattern, 6.
...Hole part, 7...Thin wall part, 8...
・Groove portion, 9... Thin wall portion.

Claims (1)

[Scope of utility model registration request] 1. A circuit board characterized in that circuit patterns that are connected to each other are formed on the board in advance, and that the board is provided with a thin part for disconnecting adjacent patterns.