JPS5934997Y2 - High speed prober test equipment - Google Patents

Description

[Detailed description of the invention] This invention is a high-speed method for rapidly performing various functional tests on products with circuits generated on semiconductor chips in the wafer state during the production process of semiconductor integrated circuits (hereinafter referred to as IC devices). This invention relates to a blower test device.

Functional testing of IC devices produced on semiconductor chips involves a large number of measurement items, such as DC tests and AC tests.In recent years, as the degree of integration of ICs has increased, the number of terminals has increased, and the number of test patterns has become enormous. It's becoming.

In testing such an IC device, the IC to be tested is mounted on a test stage, and a probe card equipped with several stylus electrodes (referred to as probe needles) from above is used.

In order to automate the test and shorten the measurement time, the prober circuit is switched and the device function is checked under the control of the central processing unit (CPU).

FIG. 1 is a diagram illustrating a schematic configuration of such a conventional high speed (HF type) blower test device.

In the figure, 1 is an IC to be tested, and 2 is a test stage that holds the ICI by means such as vacuum suction, and is equipped with an automatic coordinate feeding mechanism that can selectively position any IC on the semiconductor chip surface.

Reference numeral 3 denotes a probe card (see Fig. 2), which is made of an insulating plate, and probe needles 4 protrude radially below the card to connect the IC.
In order to perform the stylus electrode function of I, a large number of spring-loaded contact pins 5 are embedded in the upper part of the disk around the periphery, and these pins 5 are connected to the stylus electrode 4 in one-to-one correspondence. .

Further, the tip of the pin 5 is plated with gold or the like to form a highly conductive contact surface to complete the contact function with the socket board 8.

Reference numeral 6 denotes a test head, which houses the driver/I'c which operates according to the commands of the CPU, a pulse distribution circuit unit, a comparator for changing the function of the IC (under test), etc., and these various signal lines (output). wires, incoming wires) are led out to the socket board 8 via the insert ring l.

Figure 2 shows the probe needle 4 at which the glove card shown in Figure 1 (3) selects the position of the test terminal C1.
FIG.

The dot-dash line in FIG. 1 shows a device configuration in which the test head section 6 and the probe card 3 side of this test device are divided into two parts. This is a configuration means for making it easier.

The probe test device having such a configuration is tested 1-I.
The connection space between the C mounting stage 2 and the test head 6 is extremely small, which is natural in order to achieve high-speed testing, but it is also difficult to perform functional analysis of the IC being tested (by observing waveforms with an oscilloscope, etc.). Moreover, in response to a request to draw out a measurement lead wire for arbitrarily extracting the main terminals of an IC device, the connection work is nearly impossible, and the analysis is hindered.

The present invention has been devised to improve this problem, and proposes a new device that increases the versatility of the device without reducing its high-speed capabilities.

The feature of the present invention is that in the blobbing test equipment for semiconductor integrated circuits in the sea urchin state,
- has a probe card provided with a contact electrode that contacts -, the glove card is provided with a connection pin that is electrically connected to the contact electrode, and the connection pin is electrically connected to the test device, and the probe card has the connection Connecting electrodes in pairs corresponding to the pins are arranged on the circumference, one of the connecting electrodes is electrically connected to the corresponding connecting pin, and the other is not electrically conductive to one of the connecting electrodes and is connected to the measurement lead wire. is connected to the probe card and is in close contact with the probe card, and is provided with a card board in which electrodes are arranged on the circumference for bridging between the connecting electrodes that control the pair, and by rotating the card board, the pair is controlled. The present invention provides a high-speed blower test device characterized by switching between conductive and non-conductive between electrodes.

The structure and functions of the present invention are explained below in Figures 3 to 6.
This will be explained according to the diagram.

FIG. 3 shows the front and side views of the probe card 3 according to the present invention.

4 and 5 in the front view are probers and spring-loaded contact pins similar to those shown in FIG. 2, and 9 and 10 are a pair of connection electrodes mounted on the upper surface of the substrate 3.

However, the electrode 9 (corresponding to connection type @A) has a spring-loaded contact pin 5.
The electrode 10 (corresponding to the connection electrode B) is insulated from the electrode 9 at the external measurement conductor connection part.

13 is the contact pin 50 circle angle pinch (usually 5 to 6 degrees)
It is.

FIG. 4 is a front and side view of a card board 11 made of an insulating plastic substrate, which constitutes the essential part of the present invention.

On the lower surface of this plate 11 (see side view), electrodes 12 (corresponding to connection electrodes C) are arranged and mounted on the entire circumferential position where the electrodes 9 and 10 of the probe card 3 are short-circuited or bridged.

The mounting pitch of the electrodes 12 matches the circular angle pitch 13 of the contact pins 50.

This is a board that functions as a so-called switch.

On the back side of the front view, a large gear 14 is fixed (see FIG. 5) or integrated, and the card board 110, which functions as a switch, is rotated and driven.

If this card board 11 is brought into close contact with the probe card 3, the measurement electrodes 10 provided on the probe card 3 can be made to function as a switch.

The small gear 15 meshing with the large gear 14 is shown in FIG. 6 of the device configuration according to the present invention.

FIG. 6 is a side view of the device similar to FIG. 1, and an embodiment of the assembly of the main parts of the device will be explained based on this.

In the figure, reference numeral 11 denotes a card board on which the large gear 14 is integrated, and this card board is installed by expanding the central window of the conventional socket board 8, and inserting the surface of the card board 11 into the socket board. Align it with the surface number 8 and fix it.

For fixing, a new hollow column 18 is provided and fixed in the circular window 16 (FIG. 5) and equipped with a rotary sliding bearing part 11, as shown in the figure.

Further, 15 is a small wheel, which is directly connected to a flexible power transmission cable 19 and connected to an external power source.

Inside the hollow columnar body 18 is a cable (
It is used as a space 20 for introducing (connecting conductor).

A thin ribbon cable or the like is suitable for this cable.

By the way, if a pulse motor rotating at a fixed angle is used as the external power source, and the motor is aligned with the electrode mounting pinch 13, highly accurate switching position control becomes possible and convenient.

The assembled test head 6 and probe card (third
(Fig.) are brought into close contact with each other, and lead out through connection electrodes 9, 10, and 12, for example, to a newly installed measurement wiring terminal on the insert ring T, and select necessary electrode terminals from these terminals and insert them into a measuring instrument such as an oscilloscope.

The shapes of the connection electrodes 9, 10, and 12 are not limited to the diagonal shape shown in the figure, but contact pieces with circular spherical surfaces may also be used for sliding contact.

As described above, in the present invention, the contact electrode 4 that contacts the IC 1 is connected to the spring-loaded contact pin 5, which contacts the socket board 8, as already described in FIG. Although not shown, they are led out to various signal lines (outgoing lines, incoming lines) of the test head 6 via an insert ring γ.

Due to this connection relationship, the IC 1 can perform normal tests similar to the conventional ones.

In the present invention, the probe card 3 is further provided with an electrode 9 that is electrically conductive to the pin 5, and an electrode 10 that is not electrically conductive with the electrode 9 and from which a measurement lead wire (not shown) is drawn. ing.

Then, only when it is desired to connect a predetermined terminal of the IC 1 to an oscilloscope or the like for functional analysis of the IC 1 under test, rotate the card 11, short-circuit the electrodes 9 and 10 at the electrode 12, and perform measurements (not shown). The measurement lead wire is electrically connected to the terminal of IC1, and analysis can be performed using an oscilloscope or the like using the measurement lead wire.

When performing a normal test without performing the functional analysis of the ICI, rotate the card 11, disconnect the electrodes 9 and 10 of the probe card, and remove the measurement lead wire from the IC1 to the test handle. I am trying to separate it from the signal line system to.

This is because if such measurement lead wires remain attached, the presence of their impedance, inductance, etc. will prevent normal IC test evaluation.

In this way, with this invention, the measurement lead wires are attached to all or necessary terminals from the beginning, instead of the conventional method of attaching the measurement lead wires only when necessary. Since the card 11 is rotated to bring the card 11 into contact with the IC 1 at any time, the work efficiency is greatly improved.

During a normal test, the card 11 is rotated to disconnect the measurement lead wire from the ICI, so the operation is simple.

In principle, the switch poles 12 shown in FIG. 4 are connected to all the probe needles 4 over the entire circumference, but if necessary, the measurement circuit may be limited to 172 or 1/4 of the circumference. Of course, there are various possible arrangements.

According to this high-speed printer, a new performance analysis means has been added to the conventional equipment. For example, various subchapters can be analyzed for latent defects in the manufacturing process or incompletely completed IC devices. In addition to information, it is also possible to check the internal operation of the driver test device.

As described above, the test device of the present invention has a great practical effect by increasing the versatility of the device.

[Brief explanation of drawings]

Figure 1 is a schematic diagram of a conventional high-speed blower test device.
Figure 2 is a plan view of the probe card 3 shown in Figure 1;
The figures show the front and side views of the probe card of the present invention, Figure 4 shows the front and side views of the card board of the present invention, and Figure 5 shows the large gear integrated on the back of the card board 11 of Figure 4. show. FIG. 6 is an assembly diagram of the main parts of the blower test device according to the present invention. In the figure, 1 is the tested IC13 is the probe card, 4
is a probe needle, 5 is a spring-loaded contact pin, 6 is a test head, 8 is a socket board, 9 and 10 are a pair of connecting electrodes A and A, 11 is a card board, and 12 is an electrode that bridges electrodes A and B. C114 is a large gear, 15 is a small gear, and 19 is a flexible power transmission cable.

Claims (1)

[Claims for Utility Model Registration] A broaching test device for a semiconductor integrated circuit in a state of urchin, comprising a probe guard provided with a contact electrode that comes into contact with the urchin, and a contact electrode that contacts the urchin. Connecting pins are provided to conduct electricity to the electrodes, and the connecting pins are connected to the test device, and connecting electrodes forming pairs corresponding to the connecting pins are arranged on the circumference of the probe card, and one of the connecting electrodes is arranged in pairs on the probe card. The force is electrically connected to the corresponding connection pin, and the other force is connected to the measurement lead wire in a non-conductive manner to the connection electrode of the force, which is in close contact with the probe card and bridges the pair of connection electrodes. A high-speed blower characterized in that a card board is provided with electrodes arranged on a circumference, and by rotating the card board, conduction or non-conduction can be switched between the electrodes. Pathest equipment.