JPS5934654B2 - Manufacturing method of transparent conductive film - Google Patents

Manufacturing method of transparent conductive film

Info

Publication number
JPS5934654B2
JPS5934654B2 JP19210881A JP19210881A JPS5934654B2 JP S5934654 B2 JPS5934654 B2 JP S5934654B2 JP 19210881 A JP19210881 A JP 19210881A JP 19210881 A JP19210881 A JP 19210881A JP S5934654 B2 JPS5934654 B2 JP S5934654B2
Authority
JP
Japan
Prior art keywords
transparent conductive
conductive film
silicon oxide
molybdenum
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19210881A
Other languages
Japanese (ja)
Other versions
JPS57123828A (en
Inventor
孝二 黒田
敏雄 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP19210881A priority Critical patent/JPS5934654B2/en
Publication of JPS57123828A publication Critical patent/JPS57123828A/en
Publication of JPS5934654B2 publication Critical patent/JPS5934654B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides

Description

【発明の詳細な説明】 本発明は透明導電性膜の製造法に関するものである。[Detailed description of the invention] The present invention relates to a method for manufacturing a transparent conductive film.

現在、ガラス、プラスチック等の透明基板に透明導電性
膜を形成したものは電気光学素子、発熱素子等の電子工
学分野のみならず、防滴あるいは防曇ガラス等として各
方面で多数利用されつつある。
Currently, transparent conductive films formed on transparent substrates such as glass and plastic are being used in many fields, not only in electronic engineering fields such as electro-optical elements and heating elements, but also as drip-proof or anti-fog glass. .

従来、上述のような透明導電性膜を得る方法として様々
のものが提案されている。
Conventionally, various methods have been proposed as methods for obtaining the above-mentioned transparent conductive film.

すなわち、ハロゲン化錫水溶液を熱ガラス板等に噴霧す
る方法、酸化錫を蒸着することにより薄膜を形成する方
法、チタンを蒸着して後強制酸化して適当な抵抗値の酸
化チタン膜を得る方法、金を蒸着して金蒸着薄膜を得る
方法、あるいは酸化インジウムを蒸着して薄膜を得る方
法等があげられる。
Specifically, a method of spraying an aqueous solution of tin halide onto a heated glass plate, a method of forming a thin film by vapor depositing tin oxide, a method of vapor depositing titanium and then performing forced oxidation to obtain a titanium oxide film with an appropriate resistance value. Examples include a method of vapor depositing gold to obtain a gold vapor-deposited thin film, and a method of vapor depositing indium oxide to obtain a thin film.

しかしながら、噴霧等の方法では均一な導電膜を得るこ
とが困難であり、真空蒸着においても材料が高価であつ
たり、蒸気圧が低く蒸着条件の不安定さ、工程の煩雑さ
等の点から蒸着を透明度導電性共に均一に再現性良く行
うことは困難であつた。
However, it is difficult to obtain a uniform conductive film using methods such as spraying, and even in vacuum deposition, the materials are expensive, the vapor pressure is low, the deposition conditions are unstable, and the process is complicated. It has been difficult to achieve uniformity in both transparency and conductivity with good reproducibility.

また、導電性の良い金導電性膜では反射率が高すぎるた
め、さらに反射防止処理を施さねば透明導電膜として不
十分である。また、酸化チタン等のように強制酸化され
たものは、導電率がやや不安定になり易い等の種々の実
用上の難点を有していた。本発明者らは、これらの難点
に留意し、鋭意研究の結果、蒸着の過程で、酸化硅素の
還元作用によりΞ酸化モリブデンを導電性を有する五二
酸化モリブデンに還元させて、導電性モリブデン−酸I
化硅素系の透明導電性膜を形成することにより、透明
度が高く、且つ安定した導電性を有する透明導電性膜を
容易に製造することができ、しかも三酸化モリブデンと
酸化硅素の量の比を変えることにより容易に任意の導電
率の透明導電性膜を得るク ことができることを見い出
し、かかる知見にもとづいて本発明を完成したものであ
る。
Further, since the reflectance of a gold conductive film having good conductivity is too high, it is insufficient as a transparent conductive film unless antireflection treatment is further applied. In addition, materials that have been forcibly oxidized, such as titanium oxide, have various practical drawbacks, such as a tendency for conductivity to become somewhat unstable. The present inventors kept these difficulties in mind and, as a result of intensive research, reduced Ξ molybdenum oxide to conductive molybdenum pentoxide by the reducing action of silicon oxide during the vapor deposition process, thereby forming conductive molybdenum-acid. I
By forming a silicon oxide-based transparent conductive film, a transparent conductive film with high transparency and stable conductivity can be easily produced, and the ratio of molybdenum trioxide to silicon oxide can be reduced. It was discovered that a transparent conductive film having an arbitrary conductivity can be easily obtained by changing the conductivity, and the present invention was completed based on this knowledge.

即ち、本発明の要旨は基体上に三酸化モリブデンと酸化
硅素を同時に蒸着し、蒸着と同時に酸化硅素の還元作用
により三酸化モリブデンを五二酸化o モリブデンに還
元させ、導電性酸化モリブデン−酸化硅素系の透明導電
性膜を形成することを特徴とする透明導電性膜の製造法
である。
That is, the gist of the present invention is to simultaneously deposit molybdenum trioxide and silicon oxide on a substrate, and simultaneously reduce the molybdenum trioxide to molybdenum pentoxide by the reducing action of silicon oxide, thereby forming a conductive molybdenum oxide-silicon oxide system. A method for producing a transparent conductive film characterized by forming a transparent conductive film.

以下、本発明につき、詳細に説明する。Hereinafter, the present invention will be explained in detail.

三酸化モリブデンと酸化硅素を混合して同一の■5 蒸
着源から、またはそれぞれを別個の蒸着源から同時に蒸
着して基体土に蒸着膜を形成して、蒸着ウーと同時に酸
化硅素の還元作用により三酸化モリブデンを五二酸化モ
リブデンに還元させ、導電性酸化モリブデン一酸化硅素
系の透明導電性膜を形成する。
Molybdenum trioxide and silicon oxide are mixed and deposited from the same vapor deposition source (5), or each is vaporized simultaneously from separate vapor deposition sources to form a vapor deposited film on the substrate soil, and simultaneously with the vapor deposition, the reducing action of silicon oxide is applied. Molybdenum trioxide is reduced to molybdenum pentoxide to form a transparent conductive film based on conductive molybdenum oxide and silicon monoxide.

而して、本発明の製造法において、基体にはガラス、プ
ラスチツク、セラミツ久布、紙など種々のものが適用で
きる。
In the manufacturing method of the present invention, various materials such as glass, plastic, ceramic cloth, and paper can be used as the substrate.

次に本発明の製造法において、酸化硅素は、硅素と酸素
の化合物であり、硅未と酸素との比はO〜2まで取りう
る。
Next, in the production method of the present invention, silicon oxide is a compound of silicon and oxygen, and the ratio of silicon to oxygen can be up to 0 to 2.

本発明においては透明導電性膜を形成する前の段階にお
いて、酸化硅素が全体として還元性を有していれば良い
ため、硅素と酸素との比が種々のものの混合物であつて
も差しつかえないが、硅素と酸素との比が一定である方
が導電率の調整などの点において好ましいと言える。次
に本発明の製造法において蒸着の方法としては抵抗加熱
、電子線加熱、誘導加熱または熱放射加熱などの真空加
熱蒸着あるいはスバツタリングなどが適用できる。本発
明の製造法による場合、三酸化モリブデンが酸化硅素に
より還元されて五二酸化モリブデンに変化するが、一部
にはモリブデンの5価および6価酸化物の中間化合物な
どが含まれているものと考えられる。
In the present invention, it is sufficient that the silicon oxide as a whole has reducibility before forming the transparent conductive film, so a mixture of various silicon and oxygen ratios may be used. However, it can be said that it is preferable for the ratio of silicon to oxygen to be constant from the viewpoint of adjusting the electrical conductivity. Next, in the production method of the present invention, as a vapor deposition method, resistance heating, electron beam heating, induction heating, thermal radiation heating, vacuum heating vapor deposition, sputtering, etc. can be applied. According to the production method of the present invention, molybdenum trioxide is reduced by silicon oxide and converted to molybdenum pentoxide, but some of the molybdenum trioxide may contain intermediate compounds of pentavalent and hexavalent oxides of molybdenum. Conceivable.

本発明の製造法による場合、蒸着源が同一、別個にかか
わらず、三酸化モリブデンの方が酸化硅素よりも蒸気圧
が高いため、先に蒸着され基体に近い方に大量に存在し
、表面付近はほとんど酸化硅素のみの状態となる。
In the case of the production method of the present invention, regardless of whether the vapor deposition sources are the same or different, molybdenum trioxide has a higher vapor pressure than silicon oxide, so molybdenum trioxide is vapor-deposited first and exists in large quantities near the substrate, and near the surface. is almost exclusively silicon oxide.

このため、酸化払素の量を多くすることにより表面層を
絶縁化することも導電性を付与するのと同一工程中で行
ないうる。この方法によれば、上記のように蒸着層にお
いて、基体近傍に酸化モリブデンが存在し、表面はほと
んど酸化硅素のみであることから酸化硅素が保護膜とし
て働き安定性も良好である。本発明の製造法によれば、
蒸着する三酸化モリブデンの量と酸化硅素の量との比を
変化させることにより蒸着層の導電率を調整することが
できる。
For this reason, it is possible to insulate the surface layer by increasing the amount of oxidation oxide and to impart conductivity to the surface layer in the same process. According to this method, as described above, in the vapor deposition layer, molybdenum oxide is present in the vicinity of the substrate, and since the surface is almost only silicon oxide, the silicon oxide acts as a protective film and has good stability. According to the production method of the present invention,
By varying the ratio between the amount of molybdenum trioxide and the amount of silicon oxide deposited, the conductivity of the deposited layer can be adjusted.

また、膜厚は500〜5000八程度力何能である。本
発明の製造法により得られる透明導電性膜は透明度が高
く、安定な導電性を示し、反射光が少ない。
Further, the film thickness is about 500 to 5000 mm. The transparent conductive film obtained by the production method of the present invention has high transparency, exhibits stable conductivity, and has little reflected light.

また、製造の段階において、表面を酸化硅素で被覆する
こともでき、この場合、酸化硅素が保護層として働くの
で導電性が非常に安定し強度の大きな透明導電性膜が得
られる。本発明の製造法に従つて透明導電性膜を製造す
るのに用いる材料である酸化硅素および三酸化モリブデ
ンはいずれも高価でなく、入手容易である上、酸化硅素
はもとより三酸化モリブデンは蒸着温度が低く、蒸着が
容易で均一な層が得られる。
Further, the surface can be coated with silicon oxide at the manufacturing stage. In this case, silicon oxide acts as a protective layer, so that a transparent conductive film with very stable conductivity and high strength can be obtained. Silicon oxide and molybdenum trioxide, which are the materials used to manufacture the transparent conductive film according to the manufacturing method of the present invention, are both inexpensive and easily available. It is easy to deposit, and a uniform layer can be obtained.

また、本発明の製造法によれば基体を常温状態にして蒸
着することができるので、高温に耐えないような基体、
たとえば、プラスチツクのようなものにも透明導電性膜
を形成し得るものである。このような数々の優れた特徴
を有する本発明の製造法により得られる透明導電性膜は
、電気光学素子、発熱素子などまた防滴、防曇ガラスな
ど幅広く各分野に適用されるものである。以上、詳記し
た通り、本発明の製造法によれば透明度が高く、安定し
た導電性を示し、反射光が少ない、均一な層厚の透明導
電性膜を、入手容易な材料を用いて、容易に形成するこ
とができるのみならず任意の導電率の透明導電性膜を得
ることができる。
In addition, according to the production method of the present invention, vapor deposition can be carried out while the substrate is at room temperature.
For example, transparent conductive films can be formed on materials such as plastics. The transparent conductive film obtained by the production method of the present invention, which has many excellent features as described above, can be applied to a wide range of fields such as electro-optical elements, heating elements, and drip-proof and anti-fog glass. As detailed above, according to the manufacturing method of the present invention, a transparent conductive film with high transparency, stable conductivity, little reflected light, and uniform layer thickness can be produced using easily available materials. Not only can it be easily formed, but also a transparent conductive film of arbitrary conductivity can be obtained.

又、本発明の製造法によれば基体を常温状態にして蒸着
することができるので、高温に耐えないような基体上に
も透明導電性膜を形成し得る。次に、実施例を示して、
さらに本発明について具体的に説明する。
Further, according to the manufacturing method of the present invention, since the substrate can be deposited at room temperature, a transparent conductive film can be formed even on a substrate that cannot withstand high temperatures. Next, an example is shown,
Further, the present invention will be specifically explained.

実施例 1 ルツボ型熱放射加熱蒸着装置(2×10−3T0rr1
200′C)三酸化モリブデンと酸化硅素を1:10の
重量比で混合してルツボに入れ、ガラス板に蒸着したと
ころ膜厚100Aでは700Ω口、さらに蒸着を続けて
1000λでは1MΩ口と表面抵抗値が基板付近で低い
酸化モリブデン一酸化硅素系透明導電性膜を得た。
Example 1 Crucible type thermal radiation heating evaporation device (2×10-3T0rr1
200'C) Molybdenum trioxide and silicon oxide were mixed at a weight ratio of 1:10, placed in a crucible, and deposited on a glass plate, resulting in a surface resistance of 700Ω at a film thickness of 100A, and 1MΩ at a film thickness of 1000λ after continued evaporation. A molybdenum oxide silicon monoxide-based transparent conductive film with a low value near the substrate was obtained.

実施例 2 ボート型抵抗加熱蒸着(2×10−3T0rr)におい
て、二個のボートにそれぞれ三酸化モリブデンのみ、と
SiOのみを1:100の重量比にしてそれぞれ入れて
蒸着したところ、50への蒸着で1KΩ口、1000人
の蒸着で200MΩ口の表面抵抗値を示した。
Example 2 In boat-type resistance heating evaporation (2×10-3T0rr), molybdenum trioxide alone and SiO alone were placed in two boats at a weight ratio of 1:100, respectively, and evaporated. It showed a surface resistance value of 1KΩ after deposition and 200MΩ after deposition by 1000 people.

透明度はいずれも優秀で反射も少なかつた。Transparency was excellent and there was little reflection.

Claims (1)

【特許請求の範囲】[Claims] 1 基体上に三酸化モリブデンと酸化硅素を同時に蒸着
し、蒸着と同時に酸化硅素の還元作用により三酸化モリ
ブデンを五二酸化モリブデンに還元させ、導電性酸化モ
リブデン−酸化硅素系の透明導電性膜を形成することを
特徴とする透明導電性の製造法。
1. Molybdenum trioxide and silicon oxide are simultaneously vapor-deposited on a substrate, and at the same time as the vapor deposition, molybdenum trioxide is reduced to molybdenum pentoxide by the reduction action of silicon oxide, forming a conductive molybdenum oxide-silicon oxide based transparent conductive film. A transparent conductive manufacturing method characterized by:
JP19210881A 1981-11-30 1981-11-30 Manufacturing method of transparent conductive film Expired JPS5934654B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19210881A JPS5934654B2 (en) 1981-11-30 1981-11-30 Manufacturing method of transparent conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19210881A JPS5934654B2 (en) 1981-11-30 1981-11-30 Manufacturing method of transparent conductive film

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP624176A Division JPS5290096A (en) 1976-01-22 1976-01-22 Transparent conductive film and method of manufacture thereof

Publications (2)

Publication Number Publication Date
JPS57123828A JPS57123828A (en) 1982-08-02
JPS5934654B2 true JPS5934654B2 (en) 1984-08-23

Family

ID=16285787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19210881A Expired JPS5934654B2 (en) 1981-11-30 1981-11-30 Manufacturing method of transparent conductive film

Country Status (1)

Country Link
JP (1) JPS5934654B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101750U (en) * 1982-12-22 1984-07-09 池田物産株式会社 Reclining device cover structure
JPS59101749U (en) * 1982-12-22 1984-07-09 池田物産株式会社 Reclining device cover structure
JPS60175140U (en) * 1984-04-28 1985-11-20 池田物産株式会社 reclining device
JPS6145845U (en) * 1984-08-27 1986-03-27 株式会社タチエス Reclining device mounting cover

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101750U (en) * 1982-12-22 1984-07-09 池田物産株式会社 Reclining device cover structure
JPS59101749U (en) * 1982-12-22 1984-07-09 池田物産株式会社 Reclining device cover structure
JPS60175140U (en) * 1984-04-28 1985-11-20 池田物産株式会社 reclining device
JPS6145845U (en) * 1984-08-27 1986-03-27 株式会社タチエス Reclining device mounting cover

Also Published As

Publication number Publication date
JPS57123828A (en) 1982-08-02

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