JPS59319B2 - Brazing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a brazing method for joining metals and the like.

Generally speaking, when a structure made of metal, glass, metal oxide, carbon, etc. that has been joined and assembled by soldering is to be further joined to another structure by brazing, it is necessary to It is necessary to prevent the brazed parts from melting.

If partial heating is not allowed and furnace brazing is used,
The subsequent brazing step is carried out by using a low melting point solder. If a structure assembled by brazing in this way is to be used at a certain high temperature, the melting point of the solder must be clearly higher than that, and some parts of the structure may If a higher temperature cannot be tolerated, the brazing temperature must be lower than that, so the permissible temperature range is narrow.

Therefore, in conventional brazing methods, it is necessary to create a solder to be used in this temperature range, or to create and prepare several types of solder with slightly different melting points for multi-stage brazing in this temperature range. There was a problem in that complicated work was required. The present invention was made in view of the above circumstances, and uses a solder that combines a first solder component and a second solder component having a higher melting point than the first solder component. After brazing the brazing object at a temperature below the melting point of the alloy of the first and second brazing components, the solder is used to braze the other brazing object at a temperature below the brazing temperature. To provide a brazing method that has a simple configuration and can perform multi-stage brazing using one type of solder. Hereinafter, its configuration and the like will be explained in detail with reference to embodiments shown in the drawings. FIG. 1 shows an embodiment of the solder used in the brazing method according to the present invention, in which one solder metal contains:
A cross section of the solder in which a solder component with a higher melting point or metal is dispersed is shown, 1 is the main body of the solder, 2 is the first solder component with a lower melting point, 3
indicates a solder component having a higher melting point than the first solder component or a second solder component made of metal.

The figures after FIG. 2 show other embodiments of this invention.
Figure 2 is a schematic diagram showing the cross section of solder made by sintering together fine particles of solder components and metals with different melting points. It may be used in solid form. Figure 3 shows the solder in the form of a composite wire, and Figure 4 is a partially cutaway sketch of the solder made by overlapping two or more plates of solder components or metals. , Fig. 5 is a partially cutaway sketch of solder made of three plate-like materials, and Fig. 6 is a partially cutaway sketch of solder made of a combination of plate-like materials and fine particle-like materials. Also, parts equivalent to each element in FIG. 1 are designated with the same reference numerals. Then, the brazing object is brazed to the object to be brazed using the solder which is a combination of the first and second solder components 2 and 3 in this manner.

To explain this using an example of using a brazing furnace, when brazing in a furnace, the temperature must exceed the operating temperature of electrical parts, etc. that are incorporated into the structure to be brazed, and the parts may be damaged. It is necessary to set the temperature of the brazing furnace to a temperature within Therefore, the first solder component 2 is selected to have a melting point higher than the usage temperature, and its component ratio is such that the melting point of the alloy combined with the second solder component 3 is within a temperature that does not damage the component. It has been selected as follows. First of all,
A relatively high temperature within the above temperature range, that is, above the melting point of the first brazing component 2 and below the melting point of the alloy containing the first and second brazing components 3, is selected, and the brazing material is heated. Braze the object to be brazed. This is because when the object to be brazed, the object to be brazed, and the solder are heated to the above temperature in a furnace, the first solder component 2 with a low melting point in the solder melts and wets the object to be brazed. As time passes, components with high melting points diffuse into the molten solder component, gradually increasing the melting point of the molten metal and causing it to solidify. After the first step of brazing is completed, a second step is performed to braze another object to the object to be brazed.
When brazing the stage, the solder is used at a relatively low temperature within the temperature range and below the brazing temperature of the first stage.

This can be done by heating in a furnace in the same way as the first stage brazing. The joining mechanism is exactly the same as the first stage, and the part joined in the first stage has a higher melting point than this, so it does not melt. Incidentally, the solder components and metals involved in such bonding generally do not interfere with bonding even if there is a certain degree of excess or deficiency in the composition, or even if a small amount of other elements are present. In addition, this solder may coexist with flux, paste, etc. in various forms. Table 1 shows the compositional relationships of the solders used in one embodiment of the present invention.

That is, the composition of the solder having the form shown in FIGS. 1 to 6 is aluminum solder (Sn9O%, ZnlO%).
4) Approximately 91.3g, Sn65.5%, Cul4.9 (
f), P2.3%, All7.2O! ) alloy 8 about 8.
7g, the heating temperature is set to the melting point of solder (4) 2
When the temperature is higher than 15°C and the melting point of solder (0) is selected to be lower than 300°C, the solder is bonded by the reaction described above.

That is, the solder (4) first melts and wets the object to be brazed, and as time passes, the additive metal (B) diffuses into it, gradually approaching the composition of solder 0, and the melting point increases. Solidification and bonding are performed. In this case, even if the amount of added metal (V) is excessive to some extent, there is no problem with joining even if there is a slight deviation in the alloy composition.Table 2 shows an example of copper solder, and Table 3 shows an example of copper solder. , is an example of solder made of two types of substantially pure metals.

As explained above, according to the present invention, the first
After brazing the object to be brazed to the object to be brazed at a relatively high temperature using a solder consisting of the second solder component, the object to be brazed is soldered at a temperature lower than the above temperature when brazing another object to be brazed. Since the composition ratio of the solder alloy is adjusted by the temperature, other parts can be brazed without melting the soldered joint part that was performed in the previous step. Therefore, there is an advantage that multi-stage brazing can be performed using one type of solder without having to manufacture and maintain mirrors with various melting points.

[Brief explanation of drawings]

Each of the figures shows the solder used in the present invention. Figure 1 shows a situation in which a high melting point solder component or metal is dispersed in a low melting point solder metal, and Figure 2 shows a low melting point and a solder metal. A diagram showing an example of a state in which high-melting-point solder components or fine metal particles are solidified by sintering, etc., Figure 3 is a diagram showing a cross section of a composite wire, and Figure 4 is a case where the solder or metal is made into a plate shape. Fig. 5 is a partially cut-out diagram showing an example of three layers, and Fig. 6 is a partially cut-out sketch of .
The figure is a partially cutaway sketch showing a composite solder made of plate metal and fine particulate metal. In the figure, 1 indicates the main body of the solder used in the present invention, 2 indicates the first solder component or metal having a low melting point, and 3 indicates fine particles of the second solder component or metal having a high melting point.

Claims (1)

[Claims] 1 Using a combination of a first solder component and a second solder component consisting of a different type of solder component having a higher melting point than the first solder component or a second solder component consisting of at least the same type of pure metal or alloy, After brazing the brazing object to the object to be brazed at a temperature above the melting point of the brazing component and below the melting point of the alloy containing the first and second brazing components,
A brazing method characterized in that when brazing the object to be brazed, the solder is used at a temperature lower than the brazing temperature.