JPS59319B2 - Brazing method - Google Patents
Brazing methodInfo
- Publication number
- JPS59319B2 JPS59319B2 JP10754977A JP10754977A JPS59319B2 JP S59319 B2 JPS59319 B2 JP S59319B2 JP 10754977 A JP10754977 A JP 10754977A JP 10754977 A JP10754977 A JP 10754977A JP S59319 B2 JPS59319 B2 JP S59319B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- brazing
- melting point
- temperature
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
本発明は金属などを接合する鑞付方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a brazing method for joining metals and the like.
一般に鑞によつて接合され、組立てられている金属、ガ
ラス、金属酸化物、炭素などの構造物を鑞付により更に
他の構造物に接合しようとするときには、次段の鑞付に
よつて前に行なわれている鑞付部分が融けないようにす
る必要がある。Generally speaking, when a structure made of metal, glass, metal oxide, carbon, etc. that has been joined and assembled by soldering is to be further joined to another structure by brazing, it is necessary to It is necessary to prevent the brazed parts from melting.
若し、部分加熱が許されず、炉内鑞付による場合には、
後に行なわれる鑞付程、低融点の鑞を使用することによ
つて実施される。このように鑞付によつて組立てられる
構造物が、或る程度高い温度で使用されるものであれば
、鑞の融点はそれより明らかに高くなければならず、ま
たその構造物の一部がそれ以上あまり高い温度に耐えら
れない場合には、鑞付温度はそれより低 、くなければ
ならないので、その許容温度範囲は狭いものとなる。If partial heating is not allowed and furnace brazing is used,
The subsequent brazing step is carried out by using a low melting point solder. If a structure assembled by brazing in this way is to be used at a certain high temperature, the melting point of the solder must be clearly higher than that, and some parts of the structure may If a higher temperature cannot be tolerated, the brazing temperature must be lower than that, so the permissible temperature range is narrow.
したがつて、従来の鑞付方法においては、この温度範囲
で使用する鑞を作成したり、あるいはこの温度範囲での
多段鑞付用の融点の微妙に異なる幾種類かの鑞を作成し
用意するという煩雑な作業が要求されるという不具合が
あつた。本発明はこのような事情に鑑みなされたもので
、第1の鑞成分とこれよりも高融点の第2の鑞成分とを
組合せた鑞を用い、第1の鑞成分の融点以上であつて第
1および第2の鑞成分の合金の融点以下の温度で鑞付物
を鑞付した後、他の鑞付物を鑞付するにあたり前記鑞を
用い前記鑞付温度以下で鑞付するというきわめて簡単な
構成により、多段鑞付が一種類の鑞で行える鑞付方法を
提供するものである。以下、その構成等を図に示す実施
例により詳細に説明する。第1図は本発明に係る鑞付方
法に用いる鑞の一実施例を示し、1つの鑞地金の中に、
融点のより高い鑞成分又は金属を分散させた鑞の断面を
示し、1は鑞の本体、2は融点の低い第1の鑞成分、3
は第1鑞成分よりも融点の高い鑞成分又は金属からなる
第2の鑞成分を示している。Therefore, in conventional brazing methods, it is necessary to create a solder to be used in this temperature range, or to create and prepare several types of solder with slightly different melting points for multi-stage brazing in this temperature range. There was a problem in that complicated work was required. The present invention was made in view of the above circumstances, and uses a solder that combines a first solder component and a second solder component having a higher melting point than the first solder component. After brazing the brazing object at a temperature below the melting point of the alloy of the first and second brazing components, the solder is used to braze the other brazing object at a temperature below the brazing temperature. To provide a brazing method that has a simple configuration and can perform multi-stage brazing using one type of solder. Hereinafter, its configuration and the like will be explained in detail with reference to embodiments shown in the drawings. FIG. 1 shows an embodiment of the solder used in the brazing method according to the present invention, in which one solder metal contains:
A cross section of the solder in which a solder component with a higher melting point or metal is dispersed is shown, 1 is the main body of the solder, 2 is the first solder component with a lower melting point, 3
indicates a solder component having a higher melting point than the first solder component or a second solder component made of metal.
第2図以降の図はこの発明の他の実施例を示すもので、
第2図は融点の異なる鑞成分、金属などの微粒子を互に
焼結してなる鑞の断面を示す模型的な図であるが、この
形態で焼結させずフラックスなどで練つたままの半固形
状で用いてもよい。第3図は複合線の形態とした場合の
鑞を示し、第4図は2種以上の鑞成分又は金属をそれぞ
れ板状とし、2枚を重ね合せてなる鑞の一部切欠の見取
図であり、第5図は同じく3枚の板状材で構成した鑞の
一部切欠見取図、第6図は板状のものと微粒子状のもの
とを組み合せて構成した鑞の一部切欠見取図で、いずれ
も、第1図の各要素と同等の部分には同一の符号を付し
て示している。そしてこのように第1および第2の鑞成
分2,3を組合せた鑞を用いて鑞付物を被鑞付物に鑞付
する。The figures after FIG. 2 show other embodiments of this invention.
Figure 2 is a schematic diagram showing the cross section of solder made by sintering together fine particles of solder components and metals with different melting points. It may be used in solid form. Figure 3 shows the solder in the form of a composite wire, and Figure 4 is a partially cutaway sketch of the solder made by overlapping two or more plates of solder components or metals. , Fig. 5 is a partially cutaway sketch of solder made of three plate-like materials, and Fig. 6 is a partially cutaway sketch of solder made of a combination of plate-like materials and fine particle-like materials. Also, parts equivalent to each element in FIG. 1 are designated with the same reference numerals. Then, the brazing object is brazed to the object to be brazed using the solder which is a combination of the first and second solder components 2 and 3 in this manner.
これを鑞付炉を使用した例について説明すると、炉内鑞
付を行なうに当つては、鑞付しようとする構造物に組込
まれる電気部品などの使用温度以上の温度に、またこの
部品を傷めない温度以内の温度に、鑞付炉の温度を設定
する必要がある。したがつて前記第1の鑞成分2は融点
が前記使用温度より高いものが選定され、その成分割合
は第2の鑞成分3と合わせた合金の融点が、前記部品を
傷めない温度以内となるように選定されている。先ず、
前記の温度範囲、すなわち第1の鑞成分2の融点以上で
あつて第1および第2の鑞成分3を合わせた合金の融点
以下の温度範囲の中でも比較的高い温度を選び、鑞付物
を被鑞付物に鑞付する。これはこれらの鑞付物と被鑞付
物と鑞とを、炉内で前記の温度に加熱すると、鑞の中の
融点の低い第1の鑞成分2が溶融し、被鑞付物を濡らし
、時間の経過と共に溶融した鑞成分の中に高融点の成分
が拡散してゆき、次第に溶融金属の融点を高め、凝固状
態になることにより伝える。そしてこの第1段の鑞付が
終了した後、この被鑞付物に他の鑞付物を鑞付する第2
段の鑞付にあたり、前記鑞を用い前記温度範囲の中であ
つて、前記第1段の鑞付温度以下の比較的低い温度で鑞
付する。To explain this using an example of using a brazing furnace, when brazing in a furnace, the temperature must exceed the operating temperature of electrical parts, etc. that are incorporated into the structure to be brazed, and the parts may be damaged. It is necessary to set the temperature of the brazing furnace to a temperature within Therefore, the first solder component 2 is selected to have a melting point higher than the usage temperature, and its component ratio is such that the melting point of the alloy combined with the second solder component 3 is within a temperature that does not damage the component. It has been selected as follows. First of all,
A relatively high temperature within the above temperature range, that is, above the melting point of the first brazing component 2 and below the melting point of the alloy containing the first and second brazing components 3, is selected, and the brazing material is heated. Braze the object to be brazed. This is because when the object to be brazed, the object to be brazed, and the solder are heated to the above temperature in a furnace, the first solder component 2 with a low melting point in the solder melts and wets the object to be brazed. As time passes, components with high melting points diffuse into the molten solder component, gradually increasing the melting point of the molten metal and causing it to solidify. After the first step of brazing is completed, a second step is performed to braze another object to the object to be brazed.
When brazing the stage, the solder is used at a relatively low temperature within the temperature range and below the brazing temperature of the first stage.
これは前記第1段の鑞付と同様に炉内で加熱することに
より行える。接合の機構は第1段と全く同様であり、第
1段で接合された部分は、これより融点が高いので溶融
することはない。尚、このような接合に関与する鑞成分
、金属は、一般には或る程度、組成に過不足があつても
、或は少量の他の元素が存在していても接合に支障はな
い。また、この鑞には種々の形でフラツクス、ペースト
などと共存させることがある。第1表は、この発明の一
実施例に使用した鑞について、組成的関連を示すもので
ある。This can be done by heating in a furnace in the same way as the first stage brazing. The joining mechanism is exactly the same as the first stage, and the part joined in the first stage has a higher melting point than this, so it does not melt. Incidentally, the solder components and metals involved in such bonding generally do not interfere with bonding even if there is a certain degree of excess or deficiency in the composition, or even if a small amount of other elements are present. In addition, this solder may coexist with flux, paste, etc. in various forms. Table 1 shows the compositional relationships of the solders used in one embodiment of the present invention.
即ち、第1図ないし第6図に示されるような形態をした
鑞の組成が、Sn9O%、ZnlO%のアルミはんだ(
4)約91.3gと、Sn65,5%、Cul4.9(
f)、P2.3%、All7.2O!)の合金8約8.
7gとからなるとき、加熱温度をはんだ(4)の融点2
15℃より高く、最終到達組成であるはんだ(0の融点
300℃よりも低く選ぶときは、前記のとおりの反応に
より接合される。That is, the composition of the solder having the form shown in FIGS. 1 to 6 is aluminum solder (Sn9O%, ZnlO%).
4) Approximately 91.3g, Sn65.5%, Cul4.9 (
f), P2.3%, All7.2O! ) alloy 8 about 8.
7g, the heating temperature is set to the melting point of solder (4) 2
When the temperature is higher than 15°C and the melting point of solder (0) is selected to be lower than 300°C, the solder is bonded by the reaction described above.
即ちはんだ(4)が先づ溶融し、被鑞付物を濡らし、時
間の経過に伴つて添加金属(B)が、その中に拡散して
ゆき、次第にはんだ0の組成に近づき、融点が高まり凝
固し、接合が行なわれる。この場合、添加金属(Vの量
が或る程度過剰であつても、合金組成に多少のずれがあ
つても接合に支障はない。第2表は銅鑞の例であり、第
3表は、2種類の略純粋な金属を構成成分とした鑞の例
である。That is, the solder (4) first melts and wets the object to be brazed, and as time passes, the additive metal (B) diffuses into it, gradually approaching the composition of solder 0, and the melting point increases. Solidification and bonding are performed. In this case, even if the amount of added metal (V) is excessive to some extent, there is no problem with joining even if there is a slight deviation in the alloy composition.Table 2 shows an example of copper solder, and Table 3 shows an example of copper solder. , is an example of solder made of two types of substantially pure metals.
以上説明したように本発明によれば、融点の異なる第1
および第2の鑞成分からなる鑞を用い、鑞付物を被鑞付
物に比較的高い温度で鑞付した後、他の鑞付物を鑞付す
るにあたり、前記温度よりも低い温度で鑞付するように
したから、前記鑞の合金の組成割合を温度によつて調整
し、前段階で行つた鑞付接合部を溶融させることなく他
の部分の鑞付を行うことができる。したがつて、種々の
融点の鏡を、それぞれ製作し、保有することなく、一種
類の鑞を使用して多段鑞付が行えるという効果がある。As explained above, according to the present invention, the first
After brazing the object to be brazed to the object to be brazed at a relatively high temperature using a solder consisting of the second solder component, the object to be brazed is soldered at a temperature lower than the above temperature when brazing another object to be brazed. Since the composition ratio of the solder alloy is adjusted by the temperature, other parts can be brazed without melting the soldered joint part that was performed in the previous step. Therefore, there is an advantage that multi-stage brazing can be performed using one type of solder without having to manufacture and maintain mirrors with various melting points.
図はいずれもこの発明に使用した鑞を示し、第1図は低
融点の鑞地金の中に高融点の鑞成分又は金属が分散して
いる状況を示す図、第2図は低融点および高融点の鑞成
分または金属の微粒子を焼結などによつて固めた状態の
例を示す図、第3図は複合線の断面を示す図、第4図は
鑞または金属を板状にした場合の一部欠截の見取図、第
5図は同じく3層からなる例を示す一部欠截の図、第6
図は板状の金属と微粒子状金属からなる複合的鑞を示す
一部欠截見取図である。
図中、1はこの発明に使用した鑞の本体、2は低融点の
第1の鑞成分又は金属、3は高融点の第2の鑞成分又は
金属の微粒子を示している。Each of the figures shows the solder used in the present invention. Figure 1 shows a situation in which a high melting point solder component or metal is dispersed in a low melting point solder metal, and Figure 2 shows a low melting point and a solder metal. A diagram showing an example of a state in which high-melting-point solder components or fine metal particles are solidified by sintering, etc., Figure 3 is a diagram showing a cross section of a composite wire, and Figure 4 is a case where the solder or metal is made into a plate shape. Fig. 5 is a partially cut-out diagram showing an example of three layers, and Fig. 6 is a partially cut-out sketch of .
The figure is a partially cutaway sketch showing a composite solder made of plate metal and fine particulate metal. In the figure, 1 indicates the main body of the solder used in the present invention, 2 indicates the first solder component or metal having a low melting point, and 3 indicates fine particles of the second solder component or metal having a high melting point.
Claims (1)
異種の鑞成分又は純金属又は合金の少なく共一種からな
る第2の鑞成分とを組合せた鑞を用い、第1の鑞成分の
融点以上であつて第1および第2の鑞成分を合わせた合
金の融点以下の温度で鑞付物を被鑞付物に鑞付した後、
この被鑞付物に他の鑞付するにあたり、前記鑞を用い前
記鑞付温度以下の温度で鑞付することを特徴とする鑞付
方法。1 Using a combination of a first solder component and a second solder component consisting of a different type of solder component having a higher melting point than the first solder component or a second solder component consisting of at least the same type of pure metal or alloy, After brazing the brazing object to the object to be brazed at a temperature above the melting point of the brazing component and below the melting point of the alloy containing the first and second brazing components,
A brazing method characterized in that when brazing the object to be brazed, the solder is used at a temperature lower than the brazing temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10754977A JPS59319B2 (en) | 1977-09-07 | 1977-09-07 | Brazing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10754977A JPS59319B2 (en) | 1977-09-07 | 1977-09-07 | Brazing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5441251A JPS5441251A (en) | 1979-04-02 |
JPS59319B2 true JPS59319B2 (en) | 1984-01-06 |
Family
ID=14461990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10754977A Expired JPS59319B2 (en) | 1977-09-07 | 1977-09-07 | Brazing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59319B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57112972A (en) * | 1980-12-31 | 1982-07-14 | Ibm | Brazing method |
US4418857A (en) * | 1980-12-31 | 1983-12-06 | International Business Machines Corp. | High melting point process for Au:Sn:80:20 brazing alloy for chip carriers |
JPS61269997A (en) * | 1985-05-25 | 1986-11-29 | Nippon Gakki Seizo Kk | Brazing material for titanium material |
US4767471A (en) * | 1986-10-03 | 1988-08-30 | Texas Instruments Incorporated | Delayed reflow alloy mix solder paste |
US9056443B2 (en) * | 2013-02-04 | 2015-06-16 | General Electric Company | Brazing process, braze arrangement, and brazed article |
CN105973500B (en) * | 2016-06-24 | 2018-07-03 | 哈尔滨万洲焊接技术有限公司 | A kind of method of nugget area temperature during solder subsidiary agitating friction weldering |
WO2020039497A1 (en) | 2018-08-21 | 2020-02-27 | ハリマ化成株式会社 | Brazing material, brazing member, heat exchanger, and manufacturing method of brazing member |
CN113084390A (en) * | 2021-04-12 | 2021-07-09 | 郑州机械研究所有限公司 | Multilayer flux-cored silver solder and preparation method thereof |
-
1977
- 1977-09-07 JP JP10754977A patent/JPS59319B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5441251A (en) | 1979-04-02 |
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