JPS5928627B2 - Temperature measurement method for vapor phase plating base material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for accurately determining the temperature of a plating base material for vapor phase plating.

The vapor phase plating method is a method of heating a plating base material and performing plating by a thermochemical reaction accompanying contact with plating paper guided around the plating base material. The heating temperature of the plating base material in this vapor phase plating is an important factor that determines the plating film quality and plating speed, and its precision control is an important issue in vapor phase plating, and the quality of the vapor phase plated product depends on it. It can be said that this depends on the temperature control of the plating base material. On the other hand, when measuring the temperature of the base material in conventional vapor phase plating, contact thermocouples are often used in vapor phase plating methods that use external heating means such as electric furnaces.
In addition, in high-frequency heating, electrical heating, and other internal heating vapor phase plating methods, temperature is measured from outside the reaction chamber using a non-contact optical thermometer. In the external heating type vapor phase plating method, by placing the reaction chamber itself in the scorching hot part of the furnace, it is possible to maintain a uniform temperature including the area around the reaction chamber, so it is possible to measure the temperature in that area with a thermocouple. However, in the case of internal heating type high-rise J-wave heating, current heating, light beam heating, heating with a heating element placed inside, etc., it is difficult to use a thermocouple to directly measure the surface temperature of the plated base material. , there are the following problems. (1) When locally measuring the temperature of a heat-plated base material, the thermocouple is brought into contact with the surface of the item through its protective tube, so the thermocouple is removed from the measurement surface by the thickness of the protective tube wall. away, the measured value will be lower than the actual temperature (70-1
00℃).

(2) In order to improve temperature measurement accuracy, it is possible to make a small hole in the plated base material and insert the thermocouple into this, but this is not practical because it would damage the plated product. Appropriate.

(3) When measuring by bringing a thermocouple into contact with a plated product, uneven plating occurs at the contact area.

(4) It is difficult to measure the temperature of minute parts. In such cases, it may be convenient to use a non-contact optical thermometer to measure the temperature of the item by tracing the sealed glass wall surface, but when performing vapor phase plating, the following There are drawbacks such as:

(1) Conventional non-contact optical thermometers have errors because they measure through the atmosphere of plating reaction products. (2) Accurate measurement is difficult because the glass wall surface is contaminated by reaction products generated as plating progresses.

Therefore, at present, vapor phase plating is performed by measuring the initial temperature before pouring the plating paper, and the subsequent temperature is estimated and adjusted, which has led to many dissatisfaction with the plating products.

On the other hand, in recent years, non-contact photothermometers have been developed to capture infrared rays from the surface of the heated plating base material, and monochromatic or two-color types have been developed. It has become possible to measure with considerable precision.

However, as described above, it is not possible to measure the temperature of the plating base material through the glass surface which is clouded by reaction products as the plating progresses. The present invention uses such a non-contact temperature measuring device to accurately measure the temperature of the plating base material during plating in the plating reaction chamber isolated from the outside. When performing vapor phase plating on the heated plating base material by introducing a plating vapor into the plating reactor, the outer end of the cylinder that penetrates a part of the plating reaction vessel and reaches the vicinity of the plating base material is sealed with an optical glass plate. By feeding a carrier gas into the plating reaction vessel through the inside of the cylinder, plating is carried out using a non-contact temperature measuring device through the optical glass plate and the cylinder, while preventing the measurement glass plate from becoming contaminated. It is characterized by measuring the temperature of the base material. The present invention will be described in detail with reference to the drawings. In FIG. 1, a vapor phase plating apparatus 1 is constructed by sealing one end of a plating reaction vessel 2 made of a quartz tube or the like with a rubber sealing material 3. A plating reaction chamber 4 is formed, a plating vapor inlet 5 is provided at one end, and a plating vapor outlet 6 is provided at the other end.
A high frequency coil 7 for holding and heating the
are placed around the Metzki reaction vessel 2.

This vapor phase plating device 1 follows the known vapor phase plating method.
The plating base material A is heated by the high frequency coil 7, and the inlet 5
The plating vapor flown from the plating reaction chamber 4 is sent to the vicinity of the plating base material A, and plating is performed by a thermochemical reaction.
Exhaust gas is discharged from the outlet 6, and an appropriate internal heating type or external heating type heating means can be employed to heat the plating base material A. A non-contact temperature measuring device 8 attached to this gas phase plating device 1 is a cylinder that penetrates a part of the plating reaction container such as the rubber sealing material 3 and reaches the vicinity of the plating base material A in the plating reaction chamber 4. It has a body of 9.

This cylindrical body 9 is for guiding heat radiation for measurement to the outside, and is formed of glass or stainless steel into a conical or cylindrical shape, and its outer end 10 is sealed with an optical glass plate 11. An inlet pipe 13 is attached near the outer end 10 of the cylinder for feeding carrier gas from the inner end opening 12 to the plating reaction chamber 4 through the cylindrical body. The carrier gas supplied from the inlet pipe 13 to the plating reaction chamber 4 is to suppress the plating vapor from flowing into the cylinder 9 from the plating reaction chamber 4, and therefore, at least the minimum amount necessary for the plating vapor is supplied from the inlet pipe. It is only necessary to supply a limited amount of carrier gas. The optical glass plate 11 may be coated with Si, for example, on its inner surface as necessary.
It is possible to improve measurement accuracy by coating with a transparency enhancing substance such as O2 or TiO2 to reduce the necessary reflection of infrared rays and block light of wavelengths other than infrared rays. The temperature measuring device main body 14 configured as an optical thermometer is
The temperature of the object to be measured is detected by thermal radiation from the object, and an objective lens 15 is fixed to the outer end of the cylindrical body 9 via an optical glass plate 11, and the optical axis of the objective lens 15 is aligned with the cylindrical body. It is made to substantially coincide with the central axis of No. 9. Further, this temperature measuring device main body 14 is operated by a pit adjustment knob 16. It has a built-in pit adjustment mechanism and is attached with an eyepiece lens 17 that allows the visual field of the objective lens to be viewed. In the figure, 18 indicates a hood that blocks light from the outside, and 19 indicates a rubber packing. The temperature measuring device main body 14 includes:
A temperature indicator is connected to display the measured temperature via a converter.

If necessary, a recorder can be connected to this temperature indicator to record the measured temperature, and if temperature control is to be performed based on the temperature measurement results, a signal of the measured temperature in the temperature indicator can be sent. Is the high frequency heating machine controlled by the control device based on this? However, the high frequency coil 7 can also perform the necessary heating. FIG. 2 shows another example of the apparatus, in which an end plate 41 is connected to one end of the plating reaction vessel 22 constituting the plating reaction chamber 24 via a flexible tongue 40 made of a rustless metal.
The plating reaction chamber 24 is sealed by fixing the plating reaction chamber 24, and the inner end of the cylinder 29 is inserted through the end plate 41 to the vicinity of the plating base material A in the plating reaction chamber 24. Also,
The support member 42 that supports the cylindrical body 29 is rotated by the fine rotation device 4.
3, and the cylindrical body 29 is configured to be able to be slightly rotated around the rotation center point O by this fine rotation rotation device 43. Therefore, the central axis of the cylindrical body 29, that is, the optical axis of the objective lens 35 of the temperature measuring device main body 34, can be directed to any point on the plating base material A. Note that the other configurations are the same as those shown in FIG. 1, so their explanation will be omitted.

In a temperature measuring device having such a configuration, the temperature of the base material A during plating can be accurately measured using thermal radiation that reaches the temperature measuring device main body 14 or 34 through the cylinder 9 or 29 during gas phase plating. In this case, since the carrier gas is fed from near the outer end of the cylinder through the cylinder toward its tip opening, the plating vapor does not flow into the cylinder, and therefore the plating base material A and the temperature measuring device There is no surface on which reaction products adhere between the device and the main body, making it possible to perform extremely accurate measurements.

In addition, especially when the configuration shown in FIG. It is also possible to measure the temperature distribution on the surface of A, and therefore it is effective for temperature measurement when local heating is performed with a light beam.

Although FIG. 2 shows a case in which the cylindrical body 29 is slightly rotated together with the temperature measuring device main body 34, the plating base material may be moved in a plane by an appropriate driving device.

As detailed above, according to the temperature measurement method of the present invention, since there is no surface on which reaction products adhere between the non-contact temperature measuring device body and the plating base material, the temperature of the plating base material can be measured. Accurate measurement is possible even during plating.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the main parts of an apparatus for implementing the present invention, and FIG. 2 is a cross-sectional view of the main parts of another example of the apparatus. A... Plating base material, 1... Gas phase plating device, 2, 22... Plating reaction vessel, 9, 29
... cylinder body, 11 ... optical glass plate,
12... Inner end opening, 13... Inlet pipe,
14, 34...Temperature measuring device body.

Claims (1)

[Claims] 1. When plating paper is introduced into the plating reaction vessel and vapor phase plating is performed on the heated plating base material, the outer end of the cylindrical body that penetrates a part of the plating reaction vessel and reaches the vicinity of the plating base material is optically The temperature of the plating base material is measured through the optical glass plate and the cylinder with a non-contact temperature measuring device while supplying carrier gas into the plating reaction vessel through the inside of the cylinder. A method for measuring the temperature of a vapor phase plating base material.