JPS5925771Y2 - Parts transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a parts transfer device used for assembling a plurality of parts in a predetermined order.

Conventionally, there are methods to join parts together, such as using a soldering compound or a hermetic seal, but in this method, the parts to be joined, the soldering compound, glass, etc. are bonded to a heat-resistant carbon plate. In this method, parts are stored in order in the parts storage holes, and then placed in a high-temperature furnace and bonded.

For example, as shown in Figure 1a, snow tire spikes are made by sequentially fitting a copper solder 3 and a carbide tip 4 into a recess 2 of a shank 1 and melting and soldering them together at high heat. As shown in the same figure, copper solder 6 and silver 7 are placed on a brass pedestal 5 and melted and soldered together at high heat. A glass 9 is fitted to the glass 9, and a terminal 10 is inserted into the glass 9 and welded by heating.

Note that 11 is a semiconductor and 12 is a cover.

If the parts to be joined are small, only a few millimeters in size, and a large number of them are to be joined at the same time, the carbon plate will have many parts storage holes arranged vertically and horizontally. I have to store the glass,
Conventionally, this has been done manually, which is extremely inefficient and has drawbacks such as the wrong order of assembly and the wrong direction of joining.

The present invention was devised to eliminate such drawbacks.While the parts storage plate, which has multiple parts storage holes, moves along the inclined guide path, vibrations are applied to the parts, causing the parts to fit into the parts storage holes. It was designed to be transferred.

An embodiment of the present invention will be described with reference to the drawings.

Reference numeral 13 denotes a parts storage plate feeding device, and this feeding device 1
3, a magazine 17 for loading component storage plates 16 is provided on a horizontal substrate 15 having a guide elongated hole 14 in the vertical direction with gaps 18 and 19 at the front and back of the lower surface, and a substrate protruding from the guide elongated hole 14. Push-out plate 20 that advances and retreats above 15
is connected to a plunger 22 of a cylinder 21 at its lower end.

At the tip of the substrate 15, a guide path 23 is inclined such that the tip thereof becomes higher in sequence, and communicates with each other with a natural gap.
Furthermore, it communicates with a horizontal pedestal 24.

Specifically, the guide path 23 is divided into three parts depending on the length thereof, and is divided into a first guide path 25 , a third guide path 25 .
26 is provided so as to be able to vibrate, and the second guide path 27 is provided in a fixed manner.

That is, the bottom plate 28 of the first guide path 25 is provided with a vibrating device 29 a that provides vibration in the vertical direction, and the both side plates 30 and 30 are provided with horizontal vibrating devices 29 b.

This vibration device 29b has both ends of its upper surface connected by a support frame 31.31, and vibration shafts 32.32 are attached to both ends of this support frame 31.31.
is supported so as to be able to vibrate in the horizontal direction, and a vibration shaft 33 is supported approximately at the center of the side plate 3o, and this vibration shaft 33 is connected to a vibration link 34 with a pin 35, and the vibration link 34 is connected to an eccentric cam. It is configured to be connected to the motor 38 via 36 and 37.

Regarding the third guideway, similarly to the first guideway 25, the bottom plate 2
8 is provided with an upper and lower vibration device 29a, and
A horizontal vibration device (not shown) is provided on both side plates 30.30.

A component discharge port 39 is opened in the side plate 30 of the first guide path 25, and a component receiving box 4 is provided below the component discharge port 39.
0 is set.

Further, a component supply device 41 such as a hopper is provided on the upper surface of the first guide path 25, and supplies a predetermined amount onto the guide path 23 continuously or at regular intervals.

Next, an explanation will be given of the operation when the components of a contact point, that is, the silver 7, the copper solder 6, and the pedestal 5, as shown in FIG.

First, when storing silver 7, as shown in FIG.

When the plunger 22 is moved back and forth by the cylinder 21, the integral push-out plate 20 enters the lower surface gap 18 of the magazine 17 while being guided on the board 15, and the lowermost component storage plate 16C is pushed out through the gap 19.

Thereafter, the component storage plates 16C are successively pushed out in the same manner with their end surfaces in contact with each other.

When the first component storage plate 16C is sent out to the guide path 23 and reaches the lower part of the component supply device 41, the silver component 7 falls from the component supply device 41, and the vertical vibration device 29a
and the horizontal vibration device 29b is activated.

These vibration devices 29a and 29b cause the parts storage plate 16 to
When C vibrates vertically and horizontally, the silver parts 7 are stored one by one in the parts storage hole 42, and the excess silver parts 7 slide down due to the vibration and fall into the parts receiving box 40 through the parts discharge port 39.

Then, the silver 7 is stored in the parts storage plate 16C that is sent out sequentially, and the silver 7 is stored in the first, second, and third guide paths 23 (25, 27
, 26) and then to the cradle 24, a worker checks them and stacks them on a pedestal (not shown) or the like.

Next, when storing the copper solder 6 as a part, the fourth
When a component storage plate 16b as shown in the figure is used and the copper solder 6 is stored in the hole 43 in the same manner as described above and sent to the pedestal 24, the work tool is placed on the component storage plate 16b with the copper solder 6 stored therein. 6
Cover with a cover 45 having a drop hole 44, and stack on a stand or the like.

Next, when storing the pedestal 5 as a component, a component storage plate 16a having a hole 46 having substantially the same shape as the pedestal 5 is used, as shown in FIG. 4a.

In this case, the pedestal 5 has a direction in which it is housed with the small diameter part facing down, but since the hole 46 has a small diameter on the lower side, even if the pedestal 5 is inserted upside down, the vibration device 29a will not be damaged.

The chisel which escapes from the hole 46 due to the vibration of 29b and enters a normal state does not escape, so that it is normally accommodated in all the holes 46.

When the component storage board 16a containing the pedestal 5 is sent to the pedestal 24, the worker covers it with a cover 48 having a drop hole 47 as described above and stacks it on the pedestal or the like.

Next, as shown in FIG. 5, a hole 50 is made in a heat-resistant carbon plate 49 that does not melt even in a heating furnace, and this carbon plate 49 is placed on top of the component storage plate 16C containing the silver 7. are stacked so that the holes 50 and 42 are aligned with each other, and as shown in FIG.

Next, as shown in FIG. Go inside and overlap with Silver 7.

Next, as shown in FIG. 5C, the pedestal 5 is also housed in the hole 50 of the carbon plate 49.

When this carbon plate 49 is heated at a predetermined temperature in a heating furnace, the copper solder 6 melts and the pedestal 5 and silver 7 are welded together, forming a contact point as shown in FIG. 5d.

Not only contacts but also spikes as shown in FIG. 1A, semiconductors as shown in FIG. 1C, etc. can be formed in a similar manner.

Furthermore, the same applies to parts not illustrated.

Next, FIG. 6 shows another embodiment, in which a predetermined distance between the first guide path 25 and the second guide path 27 or between the second guide path 27 and the third guide path 26 is shown. A step d is provided.

With this configuration, in the same guide path 23, the lower guide path 25 accommodates the pedestal 5, and the upper guide path 2
6, the copper solder 6 can be stored.

In this case, the hole 51 of the parts storage plate 16 is formed in advance to a depth that allows the two parts 5 and 6 to enter, and after first storing the pedestal 5 in the hole 51 in the guide path 25, the step At a certain point, the end face of the lower component storage plate 16 pushes up the component storage plate 16 together with the excess upper component 6, and the component 6 is stored in the next guide path 26.

At this time, the upper part 6 does not slide down to the lower guide path 25 due to the difference in level.

Since the present invention is configured as described above, vibration is applied to the parts storage plate 16 while it is moving in the guide path 23, and the parts are reliably stored in the holes, making it extremely efficient.

By the way, compared to the conventional manual method, at least 10
The work efficiency was more than doubled.

Moreover, there is no mistake in the order or direction of combination.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing the order of assembly of parts and an example of a finished product, Fig. 2 is a longitudinal sectional front view showing an embodiment of the parts transfer device according to the present invention, and Fig. 3 is a plan view of the horizontal vibration device. 4 is a cross-sectional view of the parts in a stored state, FIG. 5 is an explanatory diagram of the operation of transferring the parts to a carbon plate, and FIG. 6 is a front view of a part of another embodiment. 13... Parts storage board feeding device, 23 (2
5,26゜27)...Guideway, 29 (29a,
29 b)... Vibration device, 41...
Parts supply device, d... level difference.

Claims (1)

[Claims for Utility Model Registration] 1. A feeding device 13 that sequentially feeds out component storage plates having a large number of component storage holes on the upper surface one by one, and a component storage plate connected to the feeding device 13 and provided in a sequentially inclined manner. A parts transfer device comprising a guide path 23, a vibration device 29 for applying vibration to the guide path 23, and a parts supply device 41 provided facing the upper part of the guide path 23. 2. The component according to claim 1 of the utility model registration claim, in which the guide path 23 is tilted forward so that the height of the components is gradually increased, and the component storage plates move continuously on the guide path 23 with their end surfaces in contact with each other. Transfer device. 3 The vibration device 29 is for horizontal vibration 29b and vertical vibration 2
9. A parts transfer device as set forth in claim 1 of the utility model registration claim, which is provided with item (a). 4. Utility model registration claim 1, in which two or more parts supply devices 41 are provided at a certain interval on the upper part of the guide path 23, and a step d is provided in the middle of the guide path 23 between these parts feed devices 41. Parts transfer device.