JPS5924949A - Sphere polishing device - Google Patents

Abstract

PURPOSE:To make it possible to efficiently carry out the polish working of spheres, by rotating both upper and lower discs in their respectively given directions with a several number of the spheres being disposed in a spiral groove formed in a rubber member on the lower surface of the upper disc so that the spheres are polished between both rubber members while they revolves. CONSTITUTION:When an upper disc 13 having a lower surface applied thereon with a rubber member 14 which is formed therein with a spiral groove 15 and a lower disc 21 are rotated in opposite directions with respect to each other, a several number of spheres 26 disposed between both rubber members 14, 22 moves outward while they revolves in the spiral groove 15, are polished between rubber members, and thereafter, discharged into a recovery hopper. By this discharge, spheres 26 in a hopper 2, 4 are introduced through a sphere charge port 16 into the spiral groove 15 formed in the rubber member 14 of the upper disc 13, and then, are polished. Further, abrasive material and liquid are fed in accordance with the material of the spheres 26.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a ball polishing IF') 1A apparatus for polishing various balls such as 1 m fiber-reinforced resin balls and metal balls.

What is desired in a ball polishing device is that the entire surface of a single ball can be polished cleanly, that the device is compact, and that the polishing work can be done efficiently. Conventionally, ball polishing devices that satisfy all of these desired points are desirable. There was no device @ The present invention proposes a ball polishing device that can satisfy all of the above desired points, and its characteristics are as follows.

An upper disk with a rubber body attached to its lower surface and a lower disk with a rubber body attached to its upper surface are arranged with the rubber bodies facing each other, and a rubber body with an open bottom surface is attached to the upper rubber body. A winding groove is formed, and a ball insertion hole is formed in the center of this thin winding groove,
There is a ball grinding device 1r in which both of the disks are configured to be rotatable individually around solid vertical axes.

According to this configuration, by rotating both disks in a predetermined direction with a large number of balls positioned in the thinly wound groove, all the balls can be polished automatically by both rubber bodies. Polishing can be done neatly over the entire surface. Furthermore, since it is of a two-rotating disk format, the entire device can be constructed compactly. Furthermore, since a large number of balls are polished at once, the polishing work can be carried out efficiently.

An embodiment of the present invention will be described below based on the drawings. In FIG. 1, (3) is a first polishing device having a hopper (2) above, and (3) is a second polishing device having a hopper (4) above, which are arranged vertically.

(5) is a first recovery hopper surrounding the first polishing device (1), and its discharge port is located above the hopper (4). (6) is a second collection hopper surrounding the second polishing device (3). (7) is a first liquid tank that supplies the first liquid (9) into the hopper (2) via a valve (8).

QQ is a second liquid tank, which supplies the second liquid (b) into the hopper (4) via pump Qυ. The polishing devices (1) and (3) are shown in FIGS. 2 and 8. That is, 03 is an upper disk, and a rubber body aΦ is attached to the lower surface of the upper disk. Jin's rubber body o4 has a thin winding groove QI with an open bottom surface.
9 is formed, and a ball insertion hole o11 is further formed in the thin center of the thinly wound groove (c). This ball insertion hole o1
also passes through the upper disk OJ, and its upper end communicates with the cylinder axis αη fixed to the upper surface of the upper disk.
The upper end of η faces the lower end outlet of the hopper +21 (4). The cylindrical shaft (17) is supported by the machine frame a9 via a bearing, so that the upper disk 03 can rotate forward and backward relative to the rigidity of the upper vertical shaft 64. SiV is the inferior disc;
A flat rubber body (c) is attached to the top surface.

The lower disk 91J) is vertically disposed from the lower surface of the lower disk 91J to the shaft, and this shaft is supported by the machine frame 01 via a bearing (c), so that the lower disk 91) is centered on the lower vertical axis. ) can be rotated around. (E) is a ball.

The polishing work will be explained below. Here, it is assumed that a fiber-reinforced resin ball (E) is polished. Therefore, the first liquid (
9) Examples include chloroform and acetone.

A strong alkali or the like is used, and water, silicone emulsion, etc. are used as the second liquid (6). And the first polishing device! The abrasive used in (1) is a hard material such as alumina, tantalum, or silica, and the abrasive used in the second polishing device (3) is.

It is a soft material such as nylon, PE, or wood. When performing polishing work, first align the upper disk opening with the arrow in Figure 8 (
2) Rotate in the direction. As a result, the ball (2) polished in the previous step and located on the rubber body a11 moves in the spiral outward direction,
Therefore, it is taken out from the polishing device I (1) (3) and falls into the collection hopper (6) (6). At the same time, from inside the hopper (2) (4), the ball (2) in the sleeve (b)
) is incorporated into the thinly wound groove ). Thin winding groove 01
With the inner sphere (support) replaced, move the upper disk opening to the arrow mark)
At the same time, the lower disc is rotated in the direction of arrow (4). At this time, the upper disc. The rotational speed of the field is faster, so it is possible to prevent the ball from falling out of the thinly wound groove. As a result, the rubber body Q-1
)■ allows the ball to be polished while rotating. At this time, the above-mentioned liquid and abrasive material are supplied, so that the surface deteriorates in the first polishing device (υ) and is polished in the second polishing device (3).

After carrying out the polishing work as described above for a certain period of time, the upper disk opening is rotated in the direction of the arrow as described above, and the lower disk aU is stopped to replace the 9 balls (2).

In addition, if the ball (to) is made of resin, the same procedure can be done.
If it is made of gold R, electrolysis is applied.

According to the ball polishing apparatus of the present invention described above.

By rotating both discs in a predetermined direction with a large number of balls i positioned in the thinly wound groove, all the balls can be polished by both rubber bodies while rotating, and the polishing can be carried out over the entire surface. It can be done neatly. Furthermore, since it is of a two-rotating disk format, the entire device can be constructed compactly.

Furthermore, since a large number of balls are polished at once, the polishing work can be carried out efficiently.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention; FIG. 1 is a partially cutaway front view, FIG. 2 is a longitudinal sectional front view of the main part, and FIG. 8 is a bottom view of the upper rubber body. (1) °゛°first polishing device, (2)... hopper, (
3)...Second polishing device, (4)...Hopper, (9
)...@1 Liquid, Us...Second limb, 斡°゛°upper disc, a◆...Rubber body, 06...Thinly wound groove, Oto°, ball insertion hole, aη.・・Cylinder axis, 匈...” 3rd position vertical axis center. @υ...Lower disc, W-...Rubber body, (E)...Lower vertical axis center, rest t...Ball agent Yoshihiro Morimoto 1st Dark Diagram Z

Claims (1)

[Claims] 1. An upper disk with a rubber body attached to the lower surface and a lower disk with a rubber body attached to the upper surface are arranged with both rubber bodies facing each other, and the upper rubber body is wrapped with a rice-wrap with an open bottom surface. A ball polishing device characterized in that a groove is formed, a ball insertion hole is formed in the center of the spiral groove, and both disks are configured to be rotatable individually around a vertical axis.