JPS5924849A - Cleaning method of photomask - Google Patents

Cleaning method of photomask

Info

Publication number
JPS5924849A
JPS5924849A JP57133714A JP13371482A JPS5924849A JP S5924849 A JPS5924849 A JP S5924849A JP 57133714 A JP57133714 A JP 57133714A JP 13371482 A JP13371482 A JP 13371482A JP S5924849 A JPS5924849 A JP S5924849A
Authority
JP
Japan
Prior art keywords
photomask
acid
film
cleaning
sulfuric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57133714A
Other languages
Japanese (ja)
Inventor
Kiyotake Naraoka
楢岡 清威
Yoshikazu Tanabe
義和 田辺
Takaaki Mori
森 孝晃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57133714A priority Critical patent/JPS5924849A/en
Publication of JPS5924849A publication Critical patent/JPS5924849A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To clean a photomask to be used as an original plate in photolithography without damaging the metallic film for light shielding, by dipping the photomask in a bath of a sulfuric acid or the like while applying a voltage between the photomask and the counter electrode thereof. CONSTITUTION:A photomask 8 formed with a figured patternlike chromium film 12 on a glass substrate 10 provided with a light transmittable conductive film 11 is subjected to a cleaning treatment. More specifically, the above-mentioned photomask 8 (a symbol 9 is a clip) and a platinum plate 14 are dipped perpendicularly in the sulfuric acid 2 in a cleaning tank 1. The acid 2 is heated to about 90-120 deg.C with a heater 3 and foam 15 of ozone-contg. air is ejected through a blow pipe 5 and a blow-out port 6 into the acid 2 to generate a Caro's acid. On the other hand, about 1.5-2.5V DC voltage is applied between the plate 14 (cathode) and a chromium film 12 (anode) by a power source 13. Therefore, the film 12 is immobilized by the oxide film formed on the surface thereof and since it is insoluble, only the foreign matter such as photoresist sticking on the mask 8 is dissolved away in the Caro's acid.

Description

【発明の詳細な説明】 本発明はフォトリングラフ・fでの原版として用いるフ
ォトマスクの洗浄方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for cleaning a photomask used as an original in Photoringraph f.

一般にこの独のフォトマスク&コ、耐久性と+1]!8
111μ梢反を同上きせるため、クロム6一連光J模と
したマスクを用いる。セしてCのクロムマスクはガラス
板上にigo、tμm程度のクロムMを付着し、このり
Oj−膜にリングラフィで図形を形成したものでるる。
In general, this German photomask & co is durable and +1]! 8
In order to create a 111μ treetop film as above, a mask imitating a chrome 6 series light J was used. The chromium mask shown in C is made by depositing chromium M with a thickness of approximately 1.0 μm on a glass plate, and forming a pattern on the Oj film using phosphorography.

7/ロムは耐腐食性が強いので、クロム酸と硫酸の混合
液を90°〜130 ℃に熱した液を洗浄液とし1、こ
n、に浸してマスクに付着している異′II/Iを除く
ことができる。
7/ROM has strong corrosion resistance, so use a mixture of chromic acid and sulfuric acid heated to 90° to 130°C as a cleaning solution. can be excluded.

し、かじ、クロム酸に廃液処理を誤まnは、項境破壊が
著るり、 <、その使用は不可能になってきた。
However, if chromic acid is not properly treated as a waste liquid, it will cause serious damage and its use has become impossible.

セしてζ−のクロム酸−(IIit酸洗浄酸洗化法マス
ク洗浄法に、力(’J−厳(1hSOs )  による
?A:浄法がるる。ソ月】−酸ti硫酸と過酸化水素の
混合、あるいけ硫酸中にオゾンを泡立たせることで1!
!!造できる。
Set and ζ-chromic acid-(IIit acid cleaning pickling method mask cleaning method, force ('J-strict (1hSOs)? 1! By bubbling ozone into sulfuric acid!
! ! Can be built.

そしてこの酸を90〜120℃に熱してマスク全浸せば
、マスクに付着してbる有機物めるいtよ金属を酸化し
て除去することができる。
If this acid is heated to 90 to 120° C. and the entire mask is immersed, organic matter and metals adhering to the mask can be oxidized and removed.

クロムは、力ロー酸等の酸化性の敞に浸しても、表面に
酸化層が形成場n、不*b態化することにより不溶でる
る。しかしこの酸化クロムの緻密性が劣nば、Ut r
tvにゆっくりとm rIpt−rる。
Even when chromium is immersed in an oxidizing agent such as oxidizing acid, an oxidized layer forms on the surface and becomes insoluble. However, if the density of this chromium oxide is poor, Utr
tv slowly m rIpt-r.

°また還元剤の存在に工9、クロムの不動態が破壊ざn
ることがあり、これによってクロムは急速に溶解する。
° Also, the presence of a reducing agent destroys the passivity of chromium.
This can cause chromium to dissolve rapidly.

そしてクロムが溶解して湧くなnば、数%〜士数%の透
過率で光が透過するので、マスクとし、て役に立たなく
なる。
If chromium does not dissolve and spring up, light will pass through it with a transmittance of a few percent to a few percent, making it useless as a mask.

したがって、本発明の目的は、フォトマスク上のクロム
膜の如き連光用金属膜の溶m會防止しながら、フォトマ
スク上、に付着したフォトレジストlたは他の有機物、
金属片等の異物を溶解除去することのできるフォトマス
クの洗浄方法を提供することにある。
Therefore, it is an object of the present invention to prevent the photoresist or other organic substances attached to the photomask from dissolving while preventing the metal film for continuous light such as the chromium film on the photomask from dissolving.
It is an object of the present invention to provide a photomask cleaning method capable of dissolving and removing foreign substances such as metal pieces.

以下、本発明を図面に示す一実施例にしたがっで詳卸1
に説明する。
Hereinafter, the present invention will be explained in detail according to an embodiment shown in the drawings.
Explain.

第1図は本発明によるフォトマスクの洗浄方法を実施す
るための装置の一実施例を示す断面図である。
FIG. 1 is a sectional view showing an embodiment of an apparatus for carrying out the photomask cleaning method according to the present invention.

この実施例において、洗浄(11〜1は耐酸、11υj
熱性の容器1りなり、その中には洗浄用の酸として硫酸
(礎僅酸)2が収容ざn′Cいる。また、洗浄槽1内に
は、耐熱ガラスgあるいは石英管内に到じ込まnたヒー
タ3お工びヒータコイル4が設けらr、た硫酸2を加熱
するよう構hV、されている。
In this example, cleaning (11-1 is acid resistant, 11υj
A thermal container 1 contains sulfuric acid (basic acid) 2 as a cleaning acid. Further, in the cleaning tank 1, a heater 3 and a heater coil 4, which are inserted into the heat-resistant glass g or quartz tube, are provided to heat the sulfuric acid 2.

芒らに、洗浄槽1の中にe」1、オゾンを信C酸2内で
泡立たせるためのオゾン吹込管5が設幻らnlその先端
部は洗浄槽1内のバ: 1ift近くのヒータコイル4
の上側に水平方向に延び、オゾン吹出穴(iが多数形成
芒nている。このオゾン吹込管5の先婦(II+の水平
部の上(111には、丁のζ、7が設置芒71でいる1
゜ r11J6己丁のこ7の」・方には、破洗浄物であるフ
ォトマスク8が土瑞をチタニウムまたは白金等のクリッ
プ9で挾むことにより直立状態で硫酸2中に浸漬はtl
ている。このフォトマスク81diJ2tZltこ示す
工うに、ガラス基板10上に透明等の元透過性専屯膜1
1を付涜させ、その上に趣光膜としてのクロム膜12を
形成してクロム図形パターンとしたものである。
In addition, an ozone blowing pipe 5 is installed in the cleaning tank 1, and an ozone blowing pipe 5 for bubbling ozone in the acid 2 is installed. coil 4
A large number of ozone blow-off holes (i) are formed in the horizontal direction on the upper side (111). Deil 1
゜゜r11J6's own cutting saw 7'' - The photomask 8, which is a broken cleaning object, is immersed in sulfuric acid 2 in an upright position by holding the soil with clips 9 made of titanium or platinum.
ing. This photomask 81diJ2tZlt is shown in FIG.
1, and a chromium film 12 as a decorative film is formed thereon to form a chrome graphic pattern.

丁なわち、フォトマスク8のクロム膜12の図形は孤立
しており、全体として導電性がないので、該クロム膜1
2を陽極として用いるため該クロム膜12の下側に元透
過性導1区腺11全設けることにエリ該りロム膜12全
体金導i比性にしている。
In other words, the chromium film 12 of the photomask 8 is isolated and has no conductivity as a whole.
In order to use the chromium film 12 as an anode, it is advantageous to provide the entire permeable conductive gland 11 under the chromium film 12, thereby making the entire ROM film 12 gold conductive.

この元透過性導屯膜11はガラス基板10上に酸化錫お
・」゛び酸化インジウムのWl膜をスパッタリング等の
方法で付着芒せたものよりなる。
The original transparent conductive film 11 is formed by depositing a Wl film of tin oxide and indium oxide on the glass substrate 10 by sputtering or the like.

この、↓うに[7°Cクロム膜12全体に導電性を与え
た)Aトマスク8は電源13の陽極11111に結線8
n、該クロム膜12の図形全体は陽極として保たt’L
る。
This A mask 8 is connected to the anode 11111 of the power source 13.
n, the entire shape of the chromium film 12 is kept as an anode t'L
Ru.

一方、この陽極の対極として、白金板14が硫酸2中に
浸6tさn、逍源13の陰極側に結紛芒71゜でいる。
On the other hand, as a counter electrode to this anode, a platinum plate 14 is immersed in sulfuric acid 2 for 6 tons and placed on the cathode side of the source 13 at an angle of 71°.

仄に、本実施例によるフ第1・マスク洗浄作用について
説明する。
The first mask cleaning action according to this embodiment will be briefly explained.

第1図に示す如く、フォトマスク8のクロムj模12全
陽極、白金板14(il−陰柿に13L持した状態で硫
tf3/ (疾硫fill! ) 2 VC浸漬してお
き、ヒータ3とヒータコイル4で硫酸2をたとえば1)
0℃〜120℃に加熱し、オゾン吹込’tM 5のオゾ
ン吹出穴6からオゾンを冨む空気を偵℃酸2中に4(出
させることに工り、硫酸2中にオゾンを含む空気の泡1
5會作り出丁。−F:t″LにIす、洗浄槽1内では、
硫酸2から力ロー酸(H2SO5)が牛hy芒nる。こ
の力ロー酸は極めて強力な酸化作用を持つ。
As shown in FIG. 1, all the anodes of the photomask 8 were immersed in sulfur tf3/(Sulfur fill!) 2 VC with 13L of platinum plate 14 (il-containing persimmon), and the heater 3 and heater coil 4 with sulfuric acid 2, for example 1)
The air containing ozone is heated to 0°C to 120°C, and the ozone-rich air is discharged from the ozone blowing hole 6 of the ozone blower into the sulfuric acid 2. bubble 1
5. Created a meeting. -F: In the cleaning tank 1 at t″L,
Hydrolic acid (H2SO5) is extracted from sulfuric acid 2. This rhoacid has an extremely strong oxidizing effect.

−方、MiJ H’r2フォトマスク8と白金板14と
の間には、前者ケ陽イ枦、イ&渚′に陰極として、屯υ
913ニx vrcト、tJ: 1.5〜25 Cv 
〕のin (At、 Tli IIE k印加する。−
1:′nによって、[W極に床付8nたクロム膜12は
表面に酸化膜が形J漢でれ、不動態化し、還元剤の付着
等に起因するクロム膜12の浴1j・「2生じることが
なく、該クロム膜12μ不浴でおる。
On the other hand, between the MiJ H'r2 photomask 8 and the platinum plate 14, there is a tun υ as a cathode in the former case,
913 nits x vrct, tJ: 1.5-25 Cv
] in (At, Tli IIE k is applied. -
1:'n, the chromium film 12 with the floor 8n on the W pole has an oxide film on the surface, becomes passivated, and the chromium film 12 is exposed to the bath 1j. This did not occur, and the 12μ chromium film remained unbathed.

このようにして、フォトマスク8をたとえば、10〜3
0分間カロー酸中に浸しておけば、該フォトマスク8に
イ寸眉したフォトレジスト、らるいはその他のイT磯物
、金属片等の!J4物(i−溶解して除去することがで
きる。
In this way, the photomask 8 is, for example, 10 to 3
If immersed in Karo's acid for 0 minutes, the photomask 8 will be free of any smeared photoresist, rubbish, or other materials, metal pieces, etc. J4 (i- Can be removed by dissolving.

したかつて、本実施例のマスク洗浄装置と用いて、クロ
ムマスクの付着異物の洗浄、あるいはマスク製造時のエ
ツチング後に不憫になったレジストの剥離に用いnば、
クロムIIQ Q)溶精々しに、レジスト、その他の4
1機物、あるいは金属倣片を溶′P14除去できる。
In the past, the mask cleaning apparatus of this embodiment was used to clean foreign matter from a chrome mask, or to peel off resist that had become unsightly after etching during mask manufacturing.
Chromium IIQ Q) Welding, resist, and other 4
One machine object or a metal replica piece can be removed by melting.

なお、前記実施例では、フ211・マスク上のクロム膜
を陽極として防食する方トノ、イ乙述ぺ六4が、クロム
膜を陰極として防食する方法があり、本発明はこの場合
も含む。この陰極防食法では、前記のう゛L透過性導m
膜が還元さtlて硫酸に溶解することかあるので、還元
状態でも溶解しにくい元透過性轡m膜を使用しなけt′
Lはならない。
In the above-mentioned embodiment, there is a method in which the chromium film on the mask 211 is used as an anode to prevent corrosion, and in the above-described method, the chromium film is used as a cathode to prevent corrosion, and the present invention also includes this method. In this cathodic protection method, the above-mentioned
Since the membrane may be reduced and dissolved in sulfuric acid, a permeable membrane that is difficult to dissolve even under reduced conditions must be used.
L cannot be.

′また、本発明は遮光膜のりC」ムをタンタル、タング
ステン、−チタニウム等の不動態化しや丁い他の金属膜
に代えたフォトマスクの洗浄にも適用できる。
The present invention can also be applied to cleaning photomasks in which the light-shielding film C' is replaced with a passivated film such as tantalum, tungsten, titanium, or other metal film.

なお、洗浄用の酸としては、硫酸葦たはカロー酸の他、
硫酸と硝酸の混合液、硫酸と過酸化水素の混合液等を用
いることができる。
In addition, as a cleaning acid, in addition to sulfuric acid reed or Karo acid,
A mixed solution of sulfuric acid and nitric acid, a mixed solution of sulfuric acid and hydrogen peroxide, etc. can be used.

以上説明したように、本発明に111は、フォトマスク
の遮光用金1jiBIH:溶解することなく、フォトマ
スク上にNNしlζフオトレジス)−Eたは他のM澱物
、金属片等を溶剪除去できる。
As explained above, the present invention has the following features: 111 for photomask light-shielding gold 1jiBIH: Melting and shearing NN1ζ photoresist)-E or other M precipitates, metal pieces, etc. on the photomask without melting. Can be removed.

【図面の簡単な説明】[Brief explanation of the drawing]

第11gは本発明によるフ第1・マスクの洗浄方法を実
施するための装置の一実施例の断面図、第2図は本発明
に用いら7するフォトマスクの一実施例の断面図でおる
。 1・・・洗浄イ・11.2・・・硫酸、3・・・ヒータ
、4・・・ヒータコイル、5・・・オゾン吹込TC18
・・・フォトマスク、10・・・ガラス基板、11・・
・iY:;ル過性導゛亀膜、12・・・クロム膜、13
・・1虜、14・・・白金板。 代用1人 弁理士 薄 1)利 幸  I9′、゛・、
′: コ一、ノV
Fig. 11g is a cross-sectional view of an embodiment of an apparatus for carrying out the first mask cleaning method according to the present invention, and Fig. 2 is a cross-sectional view of an embodiment of a photomask used in the present invention. . 1...Cleaning 11.2...Sulfuric acid, 3...Heater, 4...Heater coil, 5...Ozone blowing TC18
...Photomask, 10...Glass substrate, 11...
・iY:; permeability conductive film, 12... chromium film, 13
...1 prisoner, 14...platinum plate. 1 substitute Patent attorney Usui 1) Toshiyuki I9', ゛・,
′: Koichi, NoV

Claims (1)

【特許請求の範囲】 1、 フォトリングラフィでの原版として用いるフォト
マスクの洗浄方法において、フォトマスクの表面に元?
h遍性導i[膜紫弁(2て遮光用金属膜を設け、このフ
ォトマスクを洗浄槽内の洗浄用の酸の中に浸漬し、フォ
トマスクを対極に対して陽極または陰極に保ちながら両
極に紙圧を印加[7て洗浄することをl時機とする)第
1・マスクの洗浄方法。 2、前記洗浄用の酸として、硫tt’ii*はカロー酸
、硫酸と硝酸の混合液、硫酸とノ1M (按化水素の混
合液を用いることを%徴とする11右t゛1″M求の範
囲第1項Hd載のフォトマスクの洗浄力lt: 、。
[Claims] 1. In a method for cleaning a photomask used as an original plate in photolithography, the surface of the photomask is cleaned of original material.
2. Provide a light-shielding metal film, and immerse this photomask in a cleaning acid in a cleaning tank, keeping the photomask at the anode or cathode with respect to the counter electrode. Applying paper pressure to both poles [7 times cleaning is the best time] 1st method for cleaning the mask. 2. As the cleaning acid, sulfur tt'ii* is Caro's acid, a mixture of sulfuric acid and nitric acid, 1M sulfuric acid and 1M (a mixture of hydrogen ablation is used). Range of M requirements 1st term Cleaning power of the Hd-mounted photomask lt: .
JP57133714A 1982-08-02 1982-08-02 Cleaning method of photomask Pending JPS5924849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57133714A JPS5924849A (en) 1982-08-02 1982-08-02 Cleaning method of photomask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133714A JPS5924849A (en) 1982-08-02 1982-08-02 Cleaning method of photomask

Publications (1)

Publication Number Publication Date
JPS5924849A true JPS5924849A (en) 1984-02-08

Family

ID=15111177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57133714A Pending JPS5924849A (en) 1982-08-02 1982-08-02 Cleaning method of photomask

Country Status (1)

Country Link
JP (1) JPS5924849A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088946A (en) * 1983-10-21 1985-05-18 Hoya Corp Chromium mask washing method
JPS61183528U (en) * 1985-05-09 1986-11-15
JPH01135024A (en) * 1987-11-20 1989-05-26 Mitsui Petrochem Ind Ltd Washing
JPH02102529A (en) * 1988-10-12 1990-04-16 Matsushita Electron Corp Mask cleaning process
KR100456760B1 (en) * 2001-04-18 2004-11-10 미쓰비시덴키 가부시키가이샤 Cleaning Process for Photomasks
JP2009251243A (en) * 2008-04-04 2009-10-29 Shin Etsu Chem Co Ltd Method of removing pellicle adhesive residue
US8388762B2 (en) 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088946A (en) * 1983-10-21 1985-05-18 Hoya Corp Chromium mask washing method
JPS61183528U (en) * 1985-05-09 1986-11-15
JPH0238439Y2 (en) * 1985-05-09 1990-10-17
JPH01135024A (en) * 1987-11-20 1989-05-26 Mitsui Petrochem Ind Ltd Washing
JPH02102529A (en) * 1988-10-12 1990-04-16 Matsushita Electron Corp Mask cleaning process
KR100456760B1 (en) * 2001-04-18 2004-11-10 미쓰비시덴키 가부시키가이샤 Cleaning Process for Photomasks
US7001470B2 (en) 2001-04-18 2006-02-21 Renesas Technology Corp. Cleaning process for photomasks
US8388762B2 (en) 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
JP2009251243A (en) * 2008-04-04 2009-10-29 Shin Etsu Chem Co Ltd Method of removing pellicle adhesive residue

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