JPS5924760U - sputtering equipment - Google Patents

sputtering equipment

Info

Publication number
JPS5924760U
JPS5924760U JP12121582U JP12121582U JPS5924760U JP S5924760 U JPS5924760 U JP S5924760U JP 12121582 U JP12121582 U JP 12121582U JP 12121582 U JP12121582 U JP 12121582U JP S5924760 U JPS5924760 U JP S5924760U
Authority
JP
Japan
Prior art keywords
vacuum chamber
sputtering
exhaust pump
evacuates
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12121582U
Other languages
Japanese (ja)
Inventor
潮田　友四郎
Original Assignee
株式会社徳田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社徳田製作所 filed Critical 株式会社徳田製作所
Priority to JP12121582U priority Critical patent/JPS5924760U/en
Publication of JPS5924760U publication Critical patent/JPS5924760U/en
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Thin Magnetic Films (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は二の考案の一実施例に係るスパッタリング装置
の模式的構成図、第２図は同装置の動作を説明するため
の図である。 １・・・真空容器、６・・・排気系、１５・・・クライ
オ式排気ポンプ、２７・・・制御装置。 ノＸフレフ−１４。 １ −「−一一一一１− コニ一一一二ニFIG. 1 is a schematic block diagram of a sputtering apparatus according to an embodiment of the second invention, and FIG. 2 is a diagram for explaining the operation of the apparatus. DESCRIPTION OF SYMBOLS 1... Vacuum container, 6... Exhaust system, 15... Cryo-type exhaust pump, 27... Control device. NOX FULEFU-14. 1 - "-1111- Koni 1112ni

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空容器内において、フィルム状基体の表面に機能薄膜
としてのスパッタ薄膜を連続的に付着させるようにした
スパッタリング装置において、主としてスパッタリング
時に前記真空容器内を排気する機械式排気ポンプと、ス
パッタリング開始前に上記真空容器内を高真空に排気す
るクライオ式排気ポンプとを設け、これら排気ポンプを
切換使用するようにしてなることを特徴とするスパッタ
リング装置。A sputtering device that continuously deposits a sputtered thin film as a functional thin film on the surface of a film-like substrate in a vacuum chamber includes a mechanical exhaust pump that mainly evacuates the inside of the vacuum chamber during sputtering, and a mechanical exhaust pump that evacuates the inside of the vacuum chamber during sputtering. A sputtering apparatus characterized in that a cryo-type exhaust pump is provided for evacuating the inside of the vacuum container to a high vacuum, and these exhaust pumps are used selectively.
JP12121582U 1982-08-10 1982-08-10 sputtering equipment Pending JPS5924760U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12121582U JPS5924760U (en) 1982-08-10 1982-08-10 sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12121582U JPS5924760U (en) 1982-08-10 1982-08-10 sputtering equipment

Publications (1)

Publication Number Publication Date
JPS5924760U true JPS5924760U (en) 1984-02-16

Family

ID=30277518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12121582U Pending JPS5924760U (en) 1982-08-10 1982-08-10 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS5924760U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115755U (en) * 1990-03-08 1991-11-29

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115755U (en) * 1990-03-08 1991-11-29

Similar Documents

Publication Publication Date Title
TW359849B (en) Sputtering apparatus having an on board service module
JPS5924760U (en) sputtering equipment
JPS606222U (en) Vacuum processing equipment
JPS60168255U (en) Vacuum exhaust control device
JPS60140764U (en) plasma processing equipment
JPS59121833U (en) semiconductor manufacturing equipment
JPS6052621U (en) Resist coating equipment
JPS59117671U (en) Ion sputtering equipment
JPS60122360U (en) sputtering equipment
JPS5924759U (en) sputtering equipment
JPS6087383U (en) pump equipment
JPS5952085U (en) vacuum equipment
JPS58168563U (en) Continuous vacuum processing equipment
JPS60132455U (en) Exhaust equipment for vacuum evaporation
JPS59131151U (en) Parallel plate type dry etching equipment
JPS5940360U (en) sputtering equipment
JPS5939927U (en) Substrate heating device for thin film production equipment
JPS60163663U (en) Vacuum exhaust equipment for electron microscopes, etc.
JPS6035536U (en) Reduced pressure vapor phase growth equipment
JPS5866669U (en) Substrate removal equipment
JPS5833137U (en) Board loading positioning device
JPS5897163U (en) sputtering device
JPS5967590U (en) High vacuum exhaust equipment
JPS60164684U (en) vacuum equipment
JPS6093757U (en) sputtering equipment