JPS5940360U - sputtering equipment - Google Patents

sputtering equipment

Info

Publication number
JPS5940360U
JPS5940360U JP13564982U JP13564982U JPS5940360U JP S5940360 U JPS5940360 U JP S5940360U JP 13564982 U JP13564982 U JP 13564982U JP 13564982 U JP13564982 U JP 13564982U JP S5940360 U JPS5940360 U JP S5940360U
Authority
JP
Japan
Prior art keywords
sputtering equipment
sputtering device
target
recorded
receiving plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13564982U
Other languages
Japanese (ja)
Inventor
渋谷 正夫
横山 佳興
Original Assignee
株式会社島津製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社島津製作所 filed Critical 株式会社島津製作所
Priority to JP13564982U priority Critical patent/JPS5940360U/en
Publication of JPS5940360U publication Critical patent/JPS5940360U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のスパッタリング装置の構造を略示する図
、第2図は本考案に係るスパッタリング装置の一実施例
の断面を略示する図、第3図は第2図に示したスパッタ
リング装置の受は板の斜視図である。 1・・・ターゲット、3・・・真空チャンバ、4・・・
成膜室、5・・・冷却槽、6・・・冷却水、7・・・受
は板、71・・・細溝、72・・・排気孔、73.75
・・・0リング、74・・・ネジ穴。
FIG. 1 is a diagram schematically showing the structure of a conventional sputtering device, FIG. 2 is a diagram schematically showing a cross section of an embodiment of the sputtering device according to the present invention, and FIG. 3 is a diagram schematically showing the sputtering device shown in FIG. 2. The receiver is a perspective view of the plate. 1...Target, 3...Vacuum chamber, 4...
Film forming chamber, 5... Cooling tank, 6... Cooling water, 7... Receiving plate, 71... Thin groove, 72... Exhaust hole, 73.75
...0 ring, 74...screw hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ターゲットを真空吸着する手段を受は板が具備している
ことを特徴とするスパッタリング装置。
A sputtering device characterized in that the receiving plate is equipped with means for vacuum suctioning a target.
JP13564982U 1982-09-06 1982-09-06 sputtering equipment Pending JPS5940360U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13564982U JPS5940360U (en) 1982-09-06 1982-09-06 sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13564982U JPS5940360U (en) 1982-09-06 1982-09-06 sputtering equipment

Publications (1)

Publication Number Publication Date
JPS5940360U true JPS5940360U (en) 1984-03-15

Family

ID=30305256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13564982U Pending JPS5940360U (en) 1982-09-06 1982-09-06 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS5940360U (en)

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