JPS59103757U - sputtering equipment - Google Patents

sputtering equipment

Info

Publication number
JPS59103757U
JPS59103757U JP19563582U JP19563582U JPS59103757U JP S59103757 U JPS59103757 U JP S59103757U JP 19563582 U JP19563582 U JP 19563582U JP 19563582 U JP19563582 U JP 19563582U JP S59103757 U JPS59103757 U JP S59103757U
Authority
JP
Japan
Prior art keywords
support plate
sputtering equipment
target support
target
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19563582U
Other languages
Japanese (ja)
Inventor
嘉規 伊藤
Original Assignee
株式会社徳田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社徳田製作所 filed Critical 株式会社徳田製作所
Priority to JP19563582U priority Critical patent/JPS59103757U/en
Publication of JPS59103757U publication Critical patent/JPS59103757U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２図は同正
面図、第３図はマグネットの移動手段の一例を示す説明
図、第４図は配置構成図、第５図は他の配置構成図であ
る。 １・・・真空槽、３・・・ターゲット支持板、５・・・
ターゲット、６・・・試料、７・・・マグネット。Fig. 1 is a sectional view showing one embodiment of the present invention, Fig. 2 is a front view thereof, Fig. 3 is an explanatory drawing showing an example of a means for moving the magnet, Fig. 4 is an arrangement diagram, and Fig. 5 is a It is another arrangement|positioning block diagram. 1... Vacuum chamber, 3... Target support plate, 5...
Target, 6...sample, 7...magnet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空槽を構成する少くとも一側壁としてターゲット支持
板を設け、このターゲット支持板の前記真空槽内方にタ
ーゲットを固定し、前記ターゲット支持板の外側に配設
されるマグネットを前記ターゲラ１の範囲にわたり移動
自在に形成してなるスパッタリング装置。A target support plate is provided as at least one side wall constituting a vacuum chamber, a target is fixed to the inside of the vacuum chamber on this target support plate, and a magnet disposed outside the target support plate is placed within the range of the targeter 1. A sputtering device that is movably formed.
JP19563582U 1982-12-27 1982-12-27 sputtering equipment Pending JPS59103757U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19563582U JPS59103757U (en) 1982-12-27 1982-12-27 sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19563582U JPS59103757U (en) 1982-12-27 1982-12-27 sputtering equipment

Publications (1)

Publication Number Publication Date
JPS59103757U true JPS59103757U (en) 1984-07-12

Family

ID=30420063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19563582U Pending JPS59103757U (en) 1982-12-27 1982-12-27 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS59103757U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239640A (en) * 1991-08-02 1993-09-17 Anelva Corp Sputtering device
JP2017510714A (en) * 2014-02-20 2017-04-13 インテヴァック インコーポレイテッド Sputtering system and sputtering method using counterweight

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537586A (en) * 1976-02-19 1978-01-24 Sloan Technology Corp Cathodic spattering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537586A (en) * 1976-02-19 1978-01-24 Sloan Technology Corp Cathodic spattering apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239640A (en) * 1991-08-02 1993-09-17 Anelva Corp Sputtering device
JP2017510714A (en) * 2014-02-20 2017-04-13 インテヴァック インコーポレイテッド Sputtering system and sputtering method using counterweight

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