JPS5924539B2 - Electronic component transport mechanism - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for separating electronic components mounted on a long tape at a constant pitch from the tape, and automatically transporting and positioning the electronic components to a predetermined position on a mounting body.

For example, LSIs are mounted on a continuous long tape at regular intervals, and such tape is supplied to the assembly process of an electronic desktop calculator, and the LSIs are separated from the tape against the wiring boards that are sequentially conveyed. A method for automatically assembling an electronic device by moving the extracted LSI to a bonding position on a wiring board has been developed and put into practical use.

When the above-mentioned electronic components such as LSI are mounted on the tape, the electronic components are positioned during transportation with reference to the peripheral through-holes formed in the tape. However, once the electronic components are separated from the tape, there are no specific standards for positioning them.
After it has been moved to the specified position on the mounting body, a skilled worker performs the second half soldering work, which is visually confirmed. As a possible solution, a pattern matching device using a combination of a light amount sensor and a computer, such as the one used in semiconductor 4C lead bonders, can be considered, but it has the drawback of being extremely expensive.

The present invention eliminates the drawbacks of the conventional devices described above, and provides an electronic component transport mechanism that can reliably and easily position the electronic component and the mounting body by adding a simple configuration. The present invention will be explained in detail using the following.

In FIG. 1, reference numeral 1 denotes a base that supports the entire transport mechanism, and a device for separating electronic components from the tape, a device for positioning the separated electronic components on the wiring board Vc, etc. are provided on the base 1. .

That is, as shown in FIG. 2, 2 is an LSI support stand that supports a tape 4 on which LSIs 3 as electronic components are mounted at one-foot pitches. The tape 4 is fed in the vertical direction. The L
As shown in the enlarged view of FIG. 13, the SI support stand 2 is provided with a cutting punch 6 facing the support stand 2 side so as to be slidable up and down by an air cylinder 5, and the punch 6 is lowered.・ Tape 4 set on support stand 2 by
Cut the upper LSI 3 from the tape and separate only the LSI 3. A vacuum suction device 7 is connected to the center of the punch 6 to vacuum the separated LSI 3, and lift it from the LSI support base 2 by raising the air cylinder 5. The cutting punch 6 is integrally provided with first and second positioning columns 8 and 9.

The pillars 8 and 9 are each at a distance from the cutting punch 6.
They are installed at separate locations and operate integrally when the punch 6 moves vertically and horizontally. On the base 1 side, the above-mentioned support 8
and 9, first and second column receivers 10 and 11 are fixed at positions spaced apart by a distance ' from the LSI support 2, and are connected to the base 1 via both columns 8 and 9. The position with the cutting punch 6 is determined. A wiring board support 12 is also fixed on the base 1 at a distance of 2' from the LSI support 2 by narrowing the first support holder 10.
Furthermore, a third
A support post holder 13 is fixed. Wiring boards are fed one by one to the wiring board support stand 12 from a separately provided wiring board feeding device in synchronization with the assembly operation, and set at a predetermined position. The cutting punch 6, on which the positioning posts 8 and 9 are integrally provided, is guided by a guide 13 and is slidable in the horizontal direction of the base 1 by an air cylinder 14, and a vacuum suction is applied to the tip of the punch 6. Sawata LS
I3 leaves the LSI support stand 2, moves horizontally on the base 1, and is sent to a predetermined position on the wiring board support stand 12, as shown by the two-dot chain line in the figure.

In moving the LSI 3, the punch 6 and the wiring board support stand 12 are positioned so that the first support 8, which has been horizontally moved integrally with the punch 6, is placed in the third support holder 13, and the second support 9 is placed in the third support holder 13. Positioning is automatically performed by making one pillar receiver 10 correspond to the husband and husband. The positional relationship of each pillar, the pillar holder, the wiring board support stand, etc. is designed in advance to a predetermined dimension accurately, so by matching the pillars to the pillar holders, the LSI can be automatically and precisely placed on the wiring board. It can be set in a predetermined position. In order to reduce the moment of inertia of movement, it is desirable that the direction, cutting punch, and each sliding mechanism be designed to be lightweight by using a light alloy.

As described above, according to the present invention, when an electronic component mounted on a long tape is separated from the tape and set at a predetermined position on the mounting body, it is possible to automatically and accurately position the electronic component and the mounting body. This eliminates the need for confirmation by an operator as in the conventional method, and further improves the efficiency of parts assembly work.

Further, by minimizing the number of components for positioning, the weight of the device can be reduced, and a highly accurate device can be obtained.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 is a view showing a long tape on which electronic components are mounted, and FIG. 3 is an enlarged view of the main part of the present invention. 1: Base, 2: LSI support stand, 3: LSI15: Air cylinder, 6: Cutting punch, 7: Vacuum suction device,
8, 9: Support column, 10, 11, 13: Support receiver, 12:
Wiring board support stand, 14: Air cylinder.

Claims (1)

[Claims] 1. In a mechanism that takes out an electronic component from a long tape on which electronic components are mounted and transports it to a predetermined position on a mounting body flowing parallel to the long tape, a cutting section that cuts and separates one electronic component from the tape; , a positioning tool provided integrally with the cutting tool at a predetermined distance 1 from the cutting portion; and a mounting body support portion provided at a location separated from the cutting portion by a predetermined distance 2 l;
A sliding device that moves the electronic component separated by the cutting part to the position of the mounting body support part, and a positioning receiving part that positions the slid electronic component on the mounting body support part via the positioning tool. Electronic component transport mechanism.