JPS592394B2 - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS592394B2
JPS592394B2 JP8743178A JP8743178A JPS592394B2 JP S592394 B2 JPS592394 B2 JP S592394B2 JP 8743178 A JP8743178 A JP 8743178A JP 8743178 A JP8743178 A JP 8743178A JP S592394 B2 JPS592394 B2 JP S592394B2
Authority
JP
Japan
Prior art keywords
wiring board
conductor layer
printed wiring
resistor
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8743178A
Other languages
Japanese (ja)
Other versions
JPS5513975A (en
Inventor
瑛一 綱島
文雄 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8743178A priority Critical patent/JPS592394B2/en
Publication of JPS5513975A publication Critical patent/JPS5513975A/en
Publication of JPS592394B2 publication Critical patent/JPS592394B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Description

【発明の詳細な説明】 本発明は支持ベース板にフレキシブル配線板を接着して
剛体化した印刷配線板に関し、とくに上記フレキシブル
配線板に安価なフィルムベースを使用して、これに形成
される抵抗体、導体の歩留り不良による損失を軽減する
ことを目的とするものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board made rigid by bonding a flexible wiring board to a supporting base plate, and particularly relates to a printed wiring board made of a rigid body by bonding a flexible wiring board to a support base plate, and particularly to a printed wiring board that uses an inexpensive film base for the flexible wiring board and resistors formed thereon. The purpose is to reduce losses due to poor yields of materials and conductors.

一般に抵抗体、導体などを印刷配線板に形成する場合、
第1図に示すように印刷配線板1の片面にはんだ付け可
能な導体層2を形成し、上記印刷配線板1の他面に抵抗
体4及び導体層5を印刷し、上記印刷配線板1に設けた
透孔6にスルホールめつきによつて接続導体層7を形成
して上記抵抗体4を上記導体層2に接続していた。
Generally, when forming resistors, conductors, etc. on printed wiring boards,
As shown in FIG. 1, a solderable conductive layer 2 is formed on one side of the printed wiring board 1, and a resistor 4 and a conductive layer 5 are printed on the other side of the printed wiring board 1. The resistor 4 was connected to the conductor layer 2 by forming a connecting conductor layer 7 in the through hole 6 provided in the through hole plating.

しかしながらスルホールめつき法においてはめつき浴に
より印刷配線板の内層部にめつき液が侵透して印刷配線
板自体が変質し易く、かつ印刷配線板の厚さ方向の伸縮
に追従しないために孔壁部において熱衝撃による断線を
生じていた。そのため、印刷配線板としてはんだ耐熱性
の高いガラス布基材エポキシ樹脂積層板やポリイミド樹
脂板、ガラス布基材ポリイミド樹脂積層板などの高価な
材料を用いる必要があつた。価格的にはポリエステルフ
ィルムが有利であるが、剛体として重量部品を支えるこ
とができず、またはんだ浴によつて簡単に収縮してしま
うという欠点があつた。また、通常の片面印刷配線板の
裏面に印刷した抵抗体、導体等の素子の加工歩留りによ
つては、すでにできあがつた片面印刷配線板を不良にし
てしまうことがしばしばであり、コストアップの要因と
なつていた。また銀ペイントのスルーホール接続への適
用に当つては、銀ペイントの付着したピンを用いて孔壁
にすりつけると同時に片面印刷配線板の両面にランドを
も形成される方法が知られがいるが、ランド部分での形
成状態が一定せず、配線面の隣接導体に接触したり、孔
壁と配線面との間に連続的に形成されない欠点があつた
。本発明はこのような従来の欠点を解消するものであり
、以下、本発明について実施例の図面と共に説明する。
However, in the through-hole plating method, the plating solution permeates into the inner layer of the printed wiring board due to the plating bath, and the printed wiring board itself is likely to change in quality. A disconnection occurred in the wall due to thermal shock. Therefore, it has been necessary to use expensive materials such as glass cloth-based epoxy resin laminates, polyimide resin plates, and glass cloth-based polyimide resin laminates that have high soldering heat resistance as printed wiring boards. Although polyester film is advantageous in terms of cost, it has the disadvantage that it cannot support heavy components as a rigid body and is easily shrunk by solder baths. Furthermore, depending on the processing yield of elements such as resistors and conductors printed on the back side of ordinary single-sided printed wiring boards, the already completed single-sided printed wiring boards often become defective, increasing costs. This was a contributing factor. In addition, when applying silver paint to through-hole connections, there is a known method in which a pin coated with silver paint is used to attach it to the hole wall, and at the same time, lands are also formed on both sides of a single-sided printed circuit board. However, the formation state at the land portion is not constant, and there are disadvantages that the land portion may come into contact with an adjacent conductor on the wiring surface, or it may not be formed continuously between the hole wall and the wiring surface. The present invention eliminates such conventional drawbacks, and the present invention will be described below with reference to drawings of embodiments.

第2図は本発明の印刷配線板の一構成例を示し、図中、
11は支持ベース板であつて、ガラス布基材エポキシ樹
脂積層板、ガラスマットエポキシ樹脂積層板、ガラスマ
ツトポリエステル樹脂積層板、紙基材フエノール樹脂積
層板などが使用される。
FIG. 2 shows an example of the configuration of the printed wiring board of the present invention, and in the figure,
Reference numeral 11 denotes a supporting base plate, which may be a glass cloth-based epoxy resin laminate, a glass matte epoxy resin laminate, a glass matte polyester resin laminate, a paper-based phenolic resin laminate, or the like.

この支持ベース板11の片面にはエツチング法、ダイス
タンピング法などの周知の手法にてはんだ付け可能な導
体層12が形成されており、予じめリード用の透孔13
が形成されている。14は上記支持ベース板11に接着
されて剛体化されたフレキシブル配線板であつて、その
支持ベースとしてポリエステルフイルムが使用される。
A solderable conductor layer 12 is formed on one side of the support base plate 11 by a well-known method such as etching or die stamping, and through holes 13 for leads are formed in advance.
is formed. Reference numeral 14 denotes a flexible wiring board which is made rigid by being bonded to the support base plate 11, and a polyester film is used as the support base.

そして、このポリエステルフイルムには抵抗体15及び
導体層16がめつき法、スクリーン印刷法、スパツタリ
ング法などの周知の手法によつて形成される。ここに上
記フレキシブル配線板14はそれに形成した抵抗体15
及び導体層16が内装化されるように上記支持ベース板
11の導体層12の非形成面に透孔12の一方の開口部
を塞ぐように接着されている。17は上記支持ベース板
11の透孔12に設けられて上記フレキシブル配線板1
4に設けた抵抗体15を上記支持ベース板11の導体層
12に接合するための接続用導体層であつて、スクリー
ン印刷法、オフセツト印刷法などの周知の手法にて形成
される。
Then, a resistor 15 and a conductor layer 16 are formed on this polyester film by a known method such as a plating method, a screen printing method, or a sputtering method. Here, the flexible wiring board 14 has a resistor 15 formed thereon.
The conductor layer 16 is bonded to the surface of the support base plate 11 on which the conductor layer 12 is not formed so as to close one opening of the through hole 12 so that the conductor layer 16 is installed internally. Reference numeral 17 is provided in the through hole 12 of the support base plate 11 and is connected to the flexible wiring board 1.
4 is a connecting conductor layer for joining the resistor 15 provided in the support base plate 11 to the conductor layer 12 of the support base plate 11, and is formed by a well-known method such as a screen printing method or an offset printing method.

実施例 硬質基材として片面に銅箔を被着した紙基材フエノール
樹脂積層板を使用し、公知のエツチング法にて片面に導
体層を形成し、かつ打抜き法によつて透孔を形成した片
面印刷配線板を用意する。
Example A paper-based phenolic resin laminate with copper foil coated on one side was used as a hard substrate, a conductive layer was formed on one side by a known etching method, and through holes were formed by a punching method. Prepare a single-sided printed wiring board.

一方、支持ベースとしてポリエステルフイルムを使用し
、その片面に抵抗体として米国ESL社のRSl5O−
゛13,RS150−14の炭素一樹脂系抵抗ペイント
を公知のスクリーン印刷法によつて印刷し、かつ電極お
よび一般配線として米国デユポン社の5504Aの導電
性ペイントを公知のスクリーン印刷法によつて印刷し、
15『C6O分の条件で硬化せしめたフレキシブル配線
板を用意する。この際使用するスクリーンには抵抗体用
として160メユシユのシルク、導体用として220メ
ツシユのテトロンとした。また、抵抗体印刷面にエポキ
シ樹脂系の保護塗料としてビスフエノール系エポキシ樹
脂100部に硬化剤として無水ハイメテイツク酸20部
を調合したものを160メユシユのシルクスクリーンで
印刷する。つぎに前述の片面印刷配線板の背面にフレキ
シブル配線板の抵抗体印刷面を対向させて5k9/CT
lの圧力下で150体C30分の条件で加熱し、接着剤
を硬化させて透孔の一方の開口部を塞ぐように接着を完
了する。この部分の接着強さは2600Cにおいて0.
3k9/鑞以上であつた。最後に、片面印刷配線板の導
体面から透孔の孔壁と抵抗体、導体などの印刷素子また
はその電極で形成される孔底部とにまたがつて導電性ペ
イントをメタルマスクを用いて印刷し、15『C3O分
の条件で硬化し固着させる。このようにすると、片面印
刷配線板として裏面の絶縁常態が維持され、内部に第2
導体層または抵抗体素子を含み、印刷式の有底スルホー
ル接続で、前記片面印刷配線板の片面に接続された抵抗
回路板を得ることができる。はんだ浴の結果、2600
C20秒のはんだ槽に5回浸漬しても接着層間の剥離も
またポリエステルフイルムの収縮も発生しなかつた。尚
、上記実施例以外にもポリエステルフイルムを支持ベー
スとするフレキシブル配線板は抵抗体の毎に個別に形成
して片面印刷配線板に接着してもよく、また、フレキシ
ブル配線板は3層、4層の多層板としてもよいものであ
る。
On the other hand, a polyester film was used as a support base, and a resistor was used on one side of the polyester film as a resistor.
゛13, RS150-14 carbon-resin resistance paint was printed by a known screen printing method, and as electrodes and general wiring, 5504A conductive paint from DuPont, USA was printed by a known screen printing method. death,
15 Prepare a flexible wiring board that has been cured under C6O conditions. The screens used at this time were 160 mesh silk for resistors and 220 mesh Tetron screens for conductors. Further, on the printed surface of the resistor, an epoxy resin-based protective coating prepared by mixing 100 parts of bisphenol-based epoxy resin and 20 parts of hymetic acid anhydride as a hardening agent is printed using a 160 mesh silk screen. Next, the resistor-printed side of the flexible wiring board was made to face the back side of the single-sided printed wiring board mentioned above, and a 5k9/CT
The 150 pieces were heated for 30 minutes under a pressure of 150 C to cure the adhesive and complete the adhesion so as to close one opening of the through hole. The adhesive strength of this part was 0.0 at 2600C.
It was over 3k9/Zui. Finally, conductive paint is printed using a metal mask from the conductor side of the single-sided printed wiring board to the hole wall of the through hole and the hole bottom formed by the printed element such as a resistor or conductor or its electrode. , 15 'Cure and fix under conditions of C3O content. In this way, normal insulation on the back side is maintained as a single-sided printed wiring board, and a second
A resistive circuit board can be obtained that includes a conductive layer or a resistive element and is connected to one side of the single-sided printed wiring board by a printed bottomed through-hole connection. Result of solder bath: 2600
Even after being immersed in a solder bath for 5 seconds at C20 seconds, neither peeling between the adhesive layers nor shrinkage of the polyester film occurred. In addition to the above embodiments, a flexible wiring board using a polyester film as a support base may be formed individually for each resistor and bonded to a single-sided printed wiring board. It may also be a multi-layer board.

以上のように本発明によれば、フイルムに260℃20
秒のはんだ耐熱性を与え、安価なフイルムベースに抵抗
体を印刷して支持ベースに接着する関係で抵抗体の不良
の場合にはフイルムベースを代えることで補修すること
ができ、その歩留り不良による損失を軽減することがで
き、また抵抗体、導体層が内装化されて外気、はんだ付
用フラツクスに直接さらされないために抵抗体の値が安
定化するなどの利点を有するものである。
As described above, according to the present invention, the film is heated at 260°C and 20°C.
The resistor is printed on an inexpensive film base and bonded to the support base, giving it a soldering heat resistance of seconds, so if the resistor is defective, it can be repaired by replacing the film base. It has the advantage that loss can be reduced, and the value of the resistor is stabilized because the resistor and conductor layer are internalized and are not directly exposed to the outside air or soldering flux.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の印刷配線板の断面図、第2図は本発明の
印刷配線板の一構成例を示す断面図である。 11・・・・・・支持ベース板、12・・・・・・導体
層、13・・・・・・透孔、14・・・・・・フレキシ
ブル配線板、15・・・・・・抵抗体、16・・・・・
一導体層、17・・・・・・接続用導体層。
FIG. 1 is a sectional view of a conventional printed wiring board, and FIG. 2 is a sectional view showing an example of the structure of the printed wiring board of the present invention. 11...Support base plate, 12...Conductor layer, 13...Through hole, 14...Flexible wiring board, 15...Resistance Body, 16...
1 conductor layer, 17... conductor layer for connection.

Claims (1)

【特許請求の範囲】[Claims] 1 支持ベースとしてのポリエステルフィルム上に抵抗
体又は導体層を形成したフレキシブル配線板と、片面に
はんだ付け可能な導体層を有し所要箇所に透孔を設けた
支持ベース板を備え、上記フレキシブル配線板を上記支
持ベース板の導体層の非形成面に上記透孔の一方の開口
部を塞ぐように接着し、上記透孔に設けた印刷式の有底
スルホール接続用導体層でもつて上記フレキシブル配線
板の抵抗体又は導体層と上記支持ベース板の導体層とを
電気的に接続したことを特徴とする印刷配線板。
1. The above-mentioned flexible wiring is equipped with a flexible wiring board in which a resistor or a conductor layer is formed on a polyester film as a support base, and a support base plate with a solderable conductor layer on one side and through holes in required places. A plate is adhered to the surface of the supporting base plate on which the conductive layer is not formed so as to close one opening of the through hole, and the printed through hole connection conductor layer provided in the through hole is used to connect the flexible wiring. A printed wiring board characterized in that a resistor or a conductor layer of the board and a conductor layer of the support base plate are electrically connected.
JP8743178A 1978-07-17 1978-07-17 printed wiring board Expired JPS592394B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8743178A JPS592394B2 (en) 1978-07-17 1978-07-17 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8743178A JPS592394B2 (en) 1978-07-17 1978-07-17 printed wiring board

Publications (2)

Publication Number Publication Date
JPS5513975A JPS5513975A (en) 1980-01-31
JPS592394B2 true JPS592394B2 (en) 1984-01-18

Family

ID=13914668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8743178A Expired JPS592394B2 (en) 1978-07-17 1978-07-17 printed wiring board

Country Status (1)

Country Link
JP (1) JPS592394B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119790A (en) * 1986-11-10 1988-05-24 イワヤ株式会社 Performance toy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119790A (en) * 1986-11-10 1988-05-24 イワヤ株式会社 Performance toy

Also Published As

Publication number Publication date
JPS5513975A (en) 1980-01-31

Similar Documents

Publication Publication Date Title
US5865934A (en) Method of manufacturing printed wiring boards
US5822850A (en) Circuit devices and fabrication Method of the same
KR880000673Y1 (en) Multilayer assign plate
US3953924A (en) Process for making a multilayer interconnect system
US20070169960A1 (en) Multilayer stacked wiring board
US8541687B2 (en) Coreless layer buildup structure
JPS6227558B2 (en)
JPS63310581A (en) Film body for electric connection
US20120031649A1 (en) Coreless layer buildup structure with lga and joining layer
JPH08330736A (en) Multilayer board and manufacture thereof
JP2833642B2 (en) Multilayer wiring board and method of manufacturing the same
JP3339422B2 (en) Wiring board and manufacturing method thereof
JP2542794B2 (en) Wiring board manufacturing method
JPH0774466A (en) Manufacture of printed wiring board
JPS592394B2 (en) printed wiring board
JPH1070363A (en) Method for manufacturing printed wiring board
JPS60216573A (en) Manufacture of flexible printed circuit board
JP2547650B2 (en) Multilayer substrate with resistor inside
JPH0446479B2 (en)
GB2164294A (en) Electrical distribution boards
JPS6362920B2 (en)
JPH0546296Y2 (en)
JP2002158446A (en) Flexible board element and multilayer flexible wiring board
JPS5917997B2 (en) printed wiring board
JPS6317589A (en) Double-layer printed circuit board