JPS592334A - フエ−スダウンボンデイング方法 - Google Patents

フエ−スダウンボンデイング方法

Info

Publication number
JPS592334A
JPS592334A JP11138582A JP11138582A JPS592334A JP S592334 A JPS592334 A JP S592334A JP 11138582 A JP11138582 A JP 11138582A JP 11138582 A JP11138582 A JP 11138582A JP S592334 A JPS592334 A JP S592334A
Authority
JP
Japan
Prior art keywords
chip
board
camera
coordinates
points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11138582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0139216B2 (enrdf_load_stackoverflow
Inventor
Akio Nakamura
昭夫 中村
Yasuhiro Katagiri
片桐　康博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sokuhan Co Ltd
Original Assignee
Tokyo Sokuhan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sokuhan Co Ltd filed Critical Tokyo Sokuhan Co Ltd
Priority to JP11138582A priority Critical patent/JPS592334A/ja
Publication of JPS592334A publication Critical patent/JPS592334A/ja
Publication of JPH0139216B2 publication Critical patent/JPH0139216B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP11138582A 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法 Granted JPS592334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11138582A JPS592334A (ja) 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11138582A JPS592334A (ja) 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法

Publications (2)

Publication Number Publication Date
JPS592334A true JPS592334A (ja) 1984-01-07
JPH0139216B2 JPH0139216B2 (enrdf_load_stackoverflow) 1989-08-18

Family

ID=14559833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11138582A Granted JPS592334A (ja) 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法

Country Status (1)

Country Link
JP (1) JPS592334A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019009095A1 (ja) * 2017-07-06 2019-01-10 メイショウ株式会社 部品実装装置及び部品実装用プログラム
JP2019016774A (ja) * 2017-07-06 2019-01-31 メイショウ株式会社 部品実装装置及び部品実装用プログラム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019009095A1 (ja) * 2017-07-06 2019-01-10 メイショウ株式会社 部品実装装置及び部品実装用プログラム
JP2019016774A (ja) * 2017-07-06 2019-01-31 メイショウ株式会社 部品実装装置及び部品実装用プログラム

Also Published As

Publication number Publication date
JPH0139216B2 (enrdf_load_stackoverflow) 1989-08-18

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