JPS59232847A - Laminated board for electric wiring board and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a laminate for electrical wiring boards and a method for manufacturing the same.

[Background technology]

This type of laminate for electrical wiring boards can be obtained, for example, by impregnating glass cloth with epoxy resin and drying it to form a hanging register, and then layering a copper foil on the epoxy resin and heating and pressurizing it. is common. However, this Eboshi Shikarasu cloth copper clad board has poor high frequency characteristics, so polysulfone copper clad board with copper foil pasted has been introduced as a material that improves the high frequency characteristics. However, although this policer-bonded copper clad board can improve high frequency characteristics, it has problems such as poor heat resistance and solvent resistance. Therefore, a copper clad board made of tetrafluorinated ethylene gas cloth was introduced, which is made by impregnating a glass cloth or other material with tetrafluoroethylene to form a substrate and then covering it with copper foil. It is attracting attention because of its excellent solvent resistance. However, although tetrafluoroethylene glass cloth copper clad sheets are excellent in these properties, they are manufactured by impregnating glass cloth with a large amount of expensive tetrafluoroethylene, resulting in an extremely high cost. .

[Purpose of the invention]

The present invention has been made in view of the above points, and provides a laminate for electrical wiring boards that has excellent high frequency characteristics, solvent resistance, heat resistance, etc., and can be manufactured at low cost, and a method for manufacturing the same. The purpose is to

[Disclosure of the invention]

However, the laminate for electrical wiring boards according to the present invention is JIS
A fluororesin layer (2) on the front and back surfaces of a thermoplastic resin plate (1) with a heat resistance of 135°C or higher as defined by K 7201.
The method for producing a laminate for electrical wiring/gland plates according to the present invention is characterized in that a metal foil (3) is provided and accommodated through the
Heat resistance specified by JIS K 7201 is 135
It is characterized by overlaying a metal foil (3) on the front and back surfaces of a thermoplastic resin plate t1+ at a temperature of ℃ or higher via a fluorine-containing southern resin layer (2), and integrating this by heating and pressing. The present invention will be explained in detail by way of examples.

The thermoplastic resin plate (1) serving as the substrate is JISK7.
201 with a heat resistance of 135°C or higher, such as polysulfone, polyethersulfone, polyether 1
Shiimide etc. are used. If the above i@heat resistance is less than 135° C., the heat resistance of the laminate for electrical wiring boards is insufficient. This thermoplastic resin plate il+ may be a composite of glass fiber or its powder, or a base material such as paper. On the front and back surfaces of this thermoplastic resin plate fi+, fluorine-containing and perfluorinyl ether polymers, tetrafluorinated polymers and hexafluorinated hydrogen-J polymers, etc. can be used. This fluororesin layer may be composited with a base material such as glass fiber, and its thickness is suitably about 10 .mu.m to 0.5 mm thick.

The above thermoplastic resin plate fi+ is coated with copper, T''Ib3=um,
To laminate the metal foil (3) such as nickel or iron, nail it to the front and back surfaces of the thermoplastic resin plate (1) and heat it according to the usual method at 250-400°C for 5 seconds-30 minutes, 0.5-30 minutes. 1
By applying heat and pressure under the conditions of 00 K4/crl, 7.
The carbon fiber resin layer (2) becomes an adhesive layer to obtain a laminate for an electrical wiring board, which is stretched with a metal foil (31 strength).In addition, in this case, the metal foil (3) is・Apply silicone resin or affix a fluororesin sheet as shown in Figure 1 (b)
), a fluororesin layer (2) is formed,
A laminate for an electric wiring board may be obtained by heating and press-molding this on the front and back sides of the thermoplastic resin plate (1) in the same manner as described above. In this case, it is possible to reduce the number of man-hours required for hilling during molding, and improve workability.

The laminate for electrical wiring boards obtained as described above can be used as an electrical wiring board by creating a circuit pattern by subjecting the metal foil to machining and sowing treatments, and then mounting electrical and electronic components. Served.

Therefore, in the above-described laminate for electrical wiring boards according to the present invention, the fluororesin layer can improve the high frequency characteristics and also improve the solvent resistance.
Furthermore, since the fluororesin layer is provided and the thermoplastic resin plate serving as the substrate has a heat resistance of 135° C. or higher as defined by JIS K 7201, the heat resistance can also be improved. Moreover, the expensive fluororesin is used as the adhesive layer of the metal foil and the surface layer of the thermoplastic resin plate, so there is no need to use a large amount of it, and it can be manufactured at low cost.

A laminate according to the present invention using polysulfone as the thermoplastic resin plate, Yotsu-N Kakosenshin as the fluorine-based resin layer, and copper foil as the metal foil, and tetrafluoride drying:, I glass. The following table shows a performance comparison between Risalho: 7 copper clad board and Epo+Cinacolas cloth copper clad board.

1・□・ Below: Margin 1.゛...1.1 '-1 2 Knee 4 [Effects of the invention] As mentioned above, the laminate for electrical wiring boards according to the present invention is compliant with JI
It is characterized by having metal foil provided on the front and back surfaces of a thermoplastic resin plate with a heat resistance of 135°C or higher as defined by S K 7201, with a fluororesin layer interposed therebetween, so it has excellent heat resistance. The fluororesin layer on the thermoplastic resin board can improve high frequency characteristics, heat resistance, solvent resistance, etc., and the method for producing a laminate for electrical wiring boards according to the present invention is characterized by stacking metal foil on the front and back surfaces of a thermoplastic resin plate with a heat resistance specified by JIS K 7201 or higher than 135°C with a fluorine resin layer interposed therebetween, and heating and pressurizing them to integrate them. Therefore, when manufacturing the above-mentioned laminate for electrical wiring boards, it is possible to integrate the fluororesin layer into the metal foil and stack it on the thermoplastic resin board, and it is possible to prevent pilling during heating and pressurization. It is possible to reduce the number of man-hours and improve work efficiency.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are exploded front views of an embodiment of the present invention,
FIG. 2 is a front view of the same as above. fil ld thermoplastic resin plate, (2) is fluorine-based (sealing layer), (3) is metal foil. Agent Patent Attorney Ishi 1) Length Cell 1 Figure 1 = = " 11111 == ( b) [ 1111 "- Figure 2 1111 == =269- Cor1 = = Yoyo ¥1

Claims (1)

[Claims] A thermoplastic resin plate having a heat resistance of 135°C or higher as defined in Ill J I S K 7201, and metal foil provided on the front and back surfaces of the plate with a fluororesin layer interposed therebetween. Laminated board for electrical wiring boards. +21 Metal foil is layered on the front and back surfaces of a thermoplastic resin plate with a heat resistance of 135°C or higher as defined in JIS K 7201 via a fluororesin layer, and is integrated by heating and pressing. A method for manufacturing laminates for electrical wiring boards. system; 3) A method for producing a laminate for an electrical wiring board according to item 2 of the scope of Patent No. 411, characterized in that a metal foil on which one layer of fluororesin is preliminarily layered is used.