JPS59232482A - Method of laminating dry film - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for laminating a dry film of photoresist used to form a conductor pattern on a printed circuit board.

Background of the technology To form conductive patterns on copper foil for printed circuit boards, there are two methods: one is to directly print resist ink using a silk screen, etc. as a resist for etching or plating, and the other is to form a photosensitive film. The latter method includes a method of applying a liquid photosensitive paint and a method of using a so-called dry film.

Dry films are easier to use than liquid resists, have no pot life limitations, and have advantages such as uniform resist thickness, so they have been widely used in the production of recent printed circuit boards.

Prior Art and Problems Fig. 1 is a plan view of a printed circuit board on which a dry film is to be laminated, and Fig. 2 is a plan view of a printed circuit board shown in Fig. 1 with a dry film laminated on the copper foil surface.
1 is a printed circuit board covered with copper foil, 2 is a guide pin pole, 3 is a dry film, and 4 is an opening in the dry film 3, respectively.

A method of forming a conductor pattern on a printed circuit board 1 using a dry film is to place guide pin poles 2 at predetermined diagonal positions on a leveled printed circuit board 1 as shown in FIG.
A dry film 3 of a desired thickness is laminated with hot pressure welding as shown in FIG. 2, and the dry film 3 covering the guide pin hole 2 is removed to obtain an opening 4. stop,
Then, the patterned guide pin hole of the film and the guide pin hole 2 of the printed circuit board 1 are engaged and overlapped, exposed and developed, and the obtained resist pattern is used as an etching resist or a menki resist. do. However, conventionally, the part of the dry film 3 laminated on the printed circuit board 1 that covers the guide pin hole 2 of the printed circuit board 1 is removed and the dry film 3 is cut using a cutting tool such as a knife to obtain the opening 4. was. Therefore, the broken pieces of the dry film 3 and the cut pieces of the printed circuit board 1 that are generated at this time scatter and adhere to the surface of the dry film where the pattern is to be obtained, preventing the exposed film from being exposed and causing the areas to be exposed to Purpose of the Invention In view of the above-mentioned drawbacks of the conventional technology, the present invention has been developed by applying a dry film to a printed circuit board. The purpose of this is to prevent broken pieces of the dry film and cut pieces of the printed circuit board from remaining when used in stacks.

DESCRIPTION OF THE INVENTION According to the invention, this object is achieved by pre-drilling holes in the dry film at positions corresponding to the guide pin balls of the printed circuit board and then laminating the printed circuit board.

Examples of the invention The present invention will be explained in detail below with reference to the drawings.

FIG. 3 is a side view for explaining a dry film laminating method according to an embodiment of the present invention. 1 is a position detection sensor for the guide pinhole 2 of the printed circuit board 1, 8 is a timing device, 9 is a puncher, 10 is a laminator, and 11 is a cutting machine.

After drilling one transparent guide pin hole 2 in each diagonal position of the printed circuit board 1 cut to predetermined external dimensions using a press or a drilling machine, etc., copper foil is pasted on the surface of the printed circuit board 1. A printed circuit board 1 whose surface has been physically and chemically leveled and dried is placed at a predetermined position on a conveyor 6 with the copper foil 5 facing downward. Therefore, the position detection sensor 7 of the guide pin hole 2 provided at the top of the conveyor 6 is used to detect the guide pin ball 2 of the printed circuit board 1 being transferred in the direction of the arrow, and the output of the sensors 11 to 7 is determined at the timing. Lead to device 8. The timing device 8 drives the puncher 9 at a constant timing to punch and perforate the dry film 3 at a predetermined location. On the other hand, the printed circuit board 1 and the dry film 3 are guided to the laminator 10 while being transferred simultaneously.

Therefore, the timing device 8 takes timing so that the guide pinball 2 of the printing substrate 1 and the opening 4 of the dry film 3 are aligned, and the puncher 9 is driven.

The printed circuit board 1 and the dry film 3 transferred to the laminator 10 are heated and pressed by the laminator 10 to laminate them, and the dry film 3 is cut by a cutter 11 at the rear end of the printed circuit board 1.

Effects of the Invention As explained in detail above, according to the present invention, the dry film to be laminated onto the printed circuit board is made by punching the portions of the printed circuit board that cover the guide pinholes with a puncher etc. prior to lamination. As a result, no cut pieces of the dry film or cut pieces of the printed circuit board are generated when the dry film is perforated, and they do not stick to the exposed surface of the dry film and prevent exposure, making it possible to form a reliable resist pattern.

Especially when the pattern density becomes denser as in recent years, the effects of the present invention are extremely large.

[Brief explanation of drawings]

FIG. 1 is a plan view of a printed circuit board on which a dry film is to be laminated, and FIG. 2 is a plan view of a conventional printed circuit board with a dry film laminated on its copper foil surface.
FIG. 3 is a diagram showing an embodiment of the present invention. In the figure, 2 is a guide pinball, 3 is a dry film, 4 is an opening in the dry film 3, 7 is a sensor, 8 is a timing device, 9 represents a puncher. 10 represents a laminator.

Claims (1)

[Claims] A dry film laminating method characterized in that, prior to laminating the dry film and the copper foil of the printed circuit board, holes are previously opened in the dry film at positions corresponding to the guide pin poles of the printed circuit board.