JPS59228800A - Electronic part inserting machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for inserting electronic components such as resistors (Fig. 1a) and diodes (Fig. 1b) having lead wires in the coaxial direction into an electronic circuit board. The figure related to the improvement shows its specific configuration and operation diagram. From the state shown in Fig. 4a, the piston 1 is operated by air pressure, and when the insertion guide 2 moves forward, the pusher 4 also moves forward due to the spring 3, and the
The coaxial lead wire A of the electronic component 6 is located between the A and A.

Cover your mouth. At the same time, the i'4J: blade 8 also follows the steel ball 7, and the female blade 9 and the sword wire 45 are cut (fourth
Figure b). The insertion guide 2 continues to move forward to form the lead wire 42 into a U-shape and hold it by one inch. (FIG. 4C) In this state, the entire insertion device descends until the lower end of the insertion guide 2 comes into contact with the top surface of the electronic circuit board (FIG. 4D). Next, the lever 5 is opened in the direction of the arrow by an external drive (not shown), and the electronic components that have been held until now are moved to predetermined holes 13, 13 of the electronic circuit board through the ship shear 4 by the pressure of the sprizog 3. ' (Figure 4 e)
.

In such a configuration, the components inserted into the electronic circuit board are struck onto the electronic circuit board by the pushers 4 due to the pressure of the spring 3, which tends to cause greater damage to the electronic components. Therefore, the spring 3 is set to be extremely weak, but if it is made too weak, the pusher 4 of the presser will be lifted up during lead wire forming, and the shoulder portion will easily sag as shown in FIG. 5a. When this is inserted into the electronic circuit board to that extent, it will look like Figure 5.
The debris is transferred to it. Therefore, when the lead wires extending from the ill of a circuit board are bent to fix electronic components, the lead wires are pulled in and internal stress is applied to the electronic component body, causing damage to the electronic components due to shock, vibration, sudden temperature changes, etc. There are drawbacks that can lead to damage.

purpose of invention The present invention eliminates the above-mentioned conventional drawbacks.

Structure of the Invention In the present invention, when molding a part, the lead wire is strongly pressed down to make a complete 900° bend, and the lead wire is inserted into the circuit board as it is. A spring is provided to overcome the spring only in some cases, so as not to apply a strong impact to the inserted electronic components, which is extremely advantageous in improving the quality of not only the electronic components but also the circuits.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 7 to 9.

A spring 11 is provided on the upper part of the conventional insertion device so as to allow the psonoya 10 to pass therethrough, and a ring 12 is further fixed to the pusher 10 as a nine surface on the pusher 10 side. The spring 11 is set to be shorter than the spring 13 for holding down the lead wire during electronic component lead wire molding, and the length is set so that Hl<H2<H3.

The spring 13 holding down the electronic component lead wire has enough force to prevent the pusher 10 from lifting up during lead wire molding.

In the device configured as described above, the lead wire of the electronic component 6 located in the B part of the insertion device is pressed by the sufficient force of the spring 13 during molding by the downward movement of the piston 14, and is shaped into a perfect 90° U-shape. molded. At this time, the ring 12 of the pusher 10 is not yet in contact with the spring 11.

Next, the insertion device descends and the lower part of the insertion guide 15 comes into contact with the circuit board surface, and when the lever 16 opens in the direction of arrow A, the pusher 10 instantly pushes the electronic component 6 downward due to the pressure of the spring 13. Since the spring 11 stops the movement, the downward movement is stopped. Therefore,
Insertion of electronic components into the circuit board is performed by an insertion shaft 17 provided at the top of the insertion device that moves up and down according to a cam surface, so that insertion can be performed with less impact. In addition, in the figure, H
l, H2, and H3 have the relationship H) H2 H3. Furthermore, by setting the lowering limit of the insertion shaft 17 to a height H4 that matches the body diameter of the electronic component, the lead wire of the electronic component will not be deformed due to excessive pressing.

Effects of the Invention As described above, the present invention enables electronic parts to be completely molded to 90% when molded.
It is inserted into the circuit board with zero bending, and is attached to the circuit board by holding it at a height that matches the body diameter of the electronic component, so it can be inserted at high speed and with high quality without compromising the quality of the circuit board. It exhibits the characteristics that can be obtained.

[Brief explanation of the drawing]

Figures 1a and b are front views of electronic components, Figure 2 is a sectional view showing a conventional insertion device, Figure 3 is a side view of a partial cross section of Figure 2, Figures 4a, b, c, d and e are cross-sectional views of a conventional insertion device showing its operation, FIGS. FIG. 7 is a front view of an electronic component molded by an electronic component insertion device according to an embodiment of the present invention, and a sectional view of an electronic circuit board. FIG. 7 is a sectional view of an electronic component insertion device according to an embodiment of the present invention. The figure is a side view of the same partial cross section, No. 9
The figure is a sectional view of the main parts of the insertion device and the insertion shaft. 6...Electronic parts, 10...Pusher,
11...Spring, 12...Ring, 13...Spring, 14...Piston, 15...Insertion guide, 16... ...Lever, i'7...Insertion shaft. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (α) 1=-0=hi111 Figure 2 (b) Figure 3 A 1 (b-n (e) Figure 5 (o-) (b) gA Figure 6 (0-n (2) ) Fig. 7 2 464- Fig. 9

Claims (2)

[Claims] (1) The bent portions of both lead wires of an electronic component having coaxial lead wires are held between a lever that receives the lower side of the lead wire in the bending direction and a button on the upper side of the lead wire that is pressurized by a spring or the like. , means for forming the electronic component into a U-shape by lowering an insertion guide provided on the outside of the surface thereof, and means for lowering the electronic component by means of a pusher and a spring by relief of a lever on the side of the receiver above the insertion hole of the electronic circuit board; An electronic component insertion device comprising a spring-based stopper and means for mitigating the downward movement of the pusher before the lowering limit. (2) The bottom dead center of the pusher during insertion can be set to any or multiple heights according to the diameter of each component by adjusting the height of the inserter. Electronic component insertion device described in Section 1.