JPS59228748A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To preserve stored information of an ultraviolet ray erasable PROM without using a light shielding seal by providing a socket at the ultraviolet ray transmitting window side of a package, and mounting other IC element over the window at the socket. CONSTITUTION:An ultraviolet ray transmitting window 4 is formed on the upper surface of a package 3 which contains an IC chip 2. Several terminal pins 5 are arranged on the side face of the package 3, and connected to the chip 2. A pair of sockets 6 connected to the chip 2 are oppositely arranged at both sides of the window 4. The terminal pins 9 at both side faces of the package 8 of an MOS- ROM7 are inserted into the sockets 6, and the ROM7 is disposed above the window 4 of the package 3. A packing 10 is provided between the packages 8 and 3 to prevent the external light from entering to the window 4. The information of the ROM1 can be erased by emitting strong ultraviolet ray from the window 4 by removing the RAM. According to this structure, the information of the ROM7 can be preserved without bonding a light shielding seal on the window 4.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field 1 of the Invention The present invention relates to ultraviolet erasable read only memory (U
The present invention relates to a hybrid integrated circuit device configured by electrically connecting and integrating a V-EPROM with other integrated circuit elements.

[Technical background of the invention and its problems] With UV-EPROM, information stored in memory cells can be erased by irradiating ultraviolet light onto the integrated circuit chip from the outside, and new information can be stored again. It is configured so that it can be done.

FIG. 1 shows such a UV-EPROMI. In this UV-EPR, OMl, an ultraviolet light transmitting window 4 is provided on the top surface of a package 3 that houses an integrated circuit chip 2. Through this, the integrated circuit depth 2 inside the package 3 can be irradiated with ultraviolet light. The ultraviolet transmitting window 4 is made of quartz glass, sapphire plate, or 7. - is made of transparent aluminum or the like, and a light-shielding seal (not shown) is always attached to this ultraviolet-transmitting window 4 to protect the information stored in the memory cell.

This information is erased by peeling off the light-shielding seal and irradiating strong ultraviolet light from the ultraviolet-transmitting window 4.

By the way, the recent demand for miniaturization of electronic devices has led to the development of hybrid integrated circuit devices, and LJV-EPRO, which has a wide range of applications in the field of microcomputers in particular, has been developed.
Few hybrid integrated circuit devices using M have been developed, and the development of hybrid integrated circuit devices with a wide range of applications is expected.

[Object of the invention] The present invention has been made in response to such circumstances, and
- By hybridizing E P ROM and other integrated circuit elements, UV - [E F RO
The purpose of this invention is to provide a hybrid integrated circuit device which is compact and has a wide range of applications, and which can store information stored in M.

[Summary of the Invention] In other words, the present invention provides a hybrid integrated circuit device comprising an ultraviolet erasable read-only memory having an ultraviolet transmitting window in a pancase and another integrated circuit element electrically connected to the package. A socket 1 is provided on the side of the ultraviolet vA transmitting window [), and the other integrated circuit element is mounted in this socket to cover the ultraviolet transmitting window.

[Embodiment 1 of the Invention] Hereinafter, details of the present invention will be described with reference to an embodiment shown in the drawings.

FIG. 2 shows a hybrid integrated circuit device according to an embodiment of the present invention, and this embodiment shows a dual in-line type (hereinafter referred to as DIP type) package [DTP type on top of JV-EPROM]. Equipped with MOS-RAM,
Further, the UV-EP ROM and the MOS-RAM are electrically connected via a socket to form a 4M hybrid integrated circuit device.

In the figure, the reference numeral 1 indicates a UV-EPROM, and an ultraviolet light transmitting window 4 is formed on the upper surface of a package 3 that accommodates an integrated circuit chip 2.

A small number of terminal bins 5 are arranged in rows on both sides of the package 3, and each terminal bin 5 is electrically connected to the integrated circuit chip 2 inside the package 3.

On both sides of the ultraviolet transmitting window 4 on the top surface of the package 3, a pair of sockets ]-6, 6, which are electrically connected to the integrated circuit chip 2 inside the package 3, respectively face the ultraviolet transmitting window 4 at a distance of /υ. It is arranged as follows.

Above the ultraviolet transmitting window 4 of the package 3 is a MOS-RA.
M7 is provided, and this MOS-ROM7 is
The package 8 is fixed by inserting terminal pins 9 arranged in rows on both sides of the package 8 into the socket 6.

A light-shielding backing 10 is interposed between the lower surface of the package 8 and the upper surface of the package 3 to prevent light from entering the ultraviolet light transmitting window 4 from the outside through the gap between the two packages.

In the hybrid integrated circuit device configured as described above, U
To erase information stored in V-EPROMI, use MOS-
This can be easily done by removing the RAM 7 and irradiating strong ultraviolet rays from the ultraviolet transmitting window 4.

Furthermore, since the terminal pin 9 of the MOS-RAM 7 is electrically connected to the integrated circuit chip 11 inside the package 8, if the terminal pin 9 is inserted into the socket 6, the MOS-R
AM7 and UV-E I) ROM1 can be electrically connected easily.

FIG. 143
! = An example of the circuit configuration showing the electrical connection with M O5-RAM7, in this example
A gate IC (NOT
Goo 1 to IC12 are mounted in advance, and these Goo 1 to IC12 are electrically inserted in front of the chip enable terminal CEI of MOS-RAM 7, and the UV − is activated only when the chip selector signal CE+ is at “O” level. lEPROM
Since chip selector CE+ of 1 is selected, UV-E
It becomes possible to switch between PROM1 and fvlO8-RAM7. Therefore, when storing information in the UV-FPROM 1, information can be input only to the UV-L: ROM 1, and the MOS-RAM 7 can be set to ``J'' if necessary.

In the figure, symbol V is a power supply line, symbol is an address designation line, symbol I10 is a data input/output line, symbol WE is a write command line, symbol PGM is a program command terminal, symbol O[ is an output command line, symbol R/W is the old loading/reading command terminal C'.

[Effects of the Invention] As mentioned above, according to the circuit device of the present invention (1), a light-shielding sticker is pasted on the ultraviolet-transmitting window and C is removed.
It is also possible to obtain a compact hybrid integrated circuit device which can store information stored in an IJV-EPROM and has a wide range of applications.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a conventional hybrid integrated circuit device, Fig. 2 is a cross-sectional view showing an embodiment of the f-co integrated circuit device of the present invention, and Fig. 3 explains an example of its electrical connection. FIG. 1・・・・・・・・・・・・0M2.1 with UV-EPr
1...Integrated circuit chip 3.8...Package 4...Ultraviolet transmission window 5.9...
...Terminal bin 6...Socket 7...M OS -RA Mlo
・・・・・・・・・・・・Light blocking backing 12・・・・
...Gate IC Patent Attorney Sasa Suyama - Figure 1 Figure 2.

Claims (2)

[Claims] (1) In a hybrid integrated circuit device formed by electrically connecting and integrating other integrated circuit elements to an ultraviolet-erasable read-only memory whose package has an ultraviolet-transmitting window,
A hybrid integrated circuit device characterized in that a socket is provided on the side of the ultraviolet ray transmitting window of the package, and the other integrated circuit element is mounted in the socket covering the ultraviolet ray transmitting window. (2) The hybrid integrated circuit device according to claim 1, wherein a light-shielding backing is interposed between the ultraviolet erasable read-only memory and the package.