JPS59227405A - Manufacture of die made of ceramic - Google Patents
Manufacture of die made of ceramicInfo
- Publication number
- JPS59227405A JPS59227405A JP10303183A JP10303183A JPS59227405A JP S59227405 A JPS59227405 A JP S59227405A JP 10303183 A JP10303183 A JP 10303183A JP 10303183 A JP10303183 A JP 10303183A JP S59227405 A JPS59227405 A JP S59227405A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- holes
- die
- sintered body
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Metal Extraction Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）技術分野
耐摩耗性に秀れたセラミック製ダイスを製造するに際し
特に穴径が小さいダイスの製造を容易に行う方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to a method for easily manufacturing a ceramic die having excellent wear resistance, particularly a die having a small hole diameter.
（ロ）従来技術とその問題点
近年非酸化物系セラミックの開発が進み、８１５Ｎ４
、ザイアロン（Ｓ １６−ｚＡｊｚｏｚＮ８〜ｚ Ｚ／
、４．２ ） 、５ｉＣ１Ｂ４ＣおよびＡＪＮでｊの耐
摩耗性、耐薬品性、耐熱衝撃性に秀れたセラミック材料
が実用化されつつある。これらの用途の１つに線引きダ
イスがあげられ実用化テストがなされている。しかし、
これらの非酸化物系セラミックは難焼結性な上に脩ト加
−に性であるために実用化可能とするには解決きるべき
問題点は多い。即ち穴径の小さいダイスを作るには、焼
結前に圧粉体に孔を設けておく方法と焼結後に穿孔する
方法がある。一方、主な焼結方法としては、常圧焼結法
と加圧焼結法があるが、得られた焼結体の強度は加圧焼
結体の方が高い。寿命の、長い良好なダイスを製造する
には、ホットプレスの方が秀れているが、従来の穿孔方
法では穿孔不可能であり、加圧焼結前に穿孔するのも小
径の場合は不可能である。また常圧焼結法では、焼結前
に穿孔として、孔のあいた焼結体を得ることができるが
、微小孔からのクラック発生等のために、歩留が悪かっ
た。このため、これらセラミック焼結体に容易に穴をあ
ける方法を種々検討してきたがまだ良好な方法炙よ開発
されていなかった。(b) Conventional technology and its problems In recent years, the development of non-oxide ceramics has progressed, and 815N4
, Ziaron (S 16-zAjzozN8~z Z/
, 4.2) , 5iC1B4C and AJN ceramic materials with excellent wear resistance, chemical resistance, and thermal shock resistance are being put into practical use. One of these applications is wire drawing dies, which are being tested for practical use. but,
Since these non-oxide ceramics are difficult to sinter and are also highly resistant to stress, there are many problems that must be solved before they can be put to practical use. That is, in order to make a die with a small hole diameter, there are two methods: one is to make holes in the green compact before sintering, and the other is to make holes after sintering. On the other hand, the main sintering methods include normal pressure sintering and pressure sintering, but the strength of the obtained sintered body is higher in the pressure sintered body. Hot pressing is better for producing good quality dies with a long lifespan, but it is impossible to drill holes using conventional drilling methods, and drilling before pressure sintering is also unnecessary in the case of small diameters. It is possible. Further, in the pressureless sintering method, a sintered body with holes can be obtained by forming holes before sintering, but the yield is poor due to cracks generated from the micropores. For this reason, various methods for easily drilling holes in these ceramic sintered bodies have been studied, but no good method has yet been developed.
（ハ）発明のＨ，２成
本発明者らは、上記の実情に鑑み、セラミック製ダイス
の穴明は方法を種々検討したところ、焼結体を穴なしの
まま製造し、ビーム径をしぼった電子ビームの照射によ
ってセラミックを局部的に蒸発気化させ、穴あけするこ
とで、高密度のセラミック製小径用ダイスが製造可能で
あることを見い出したものである。すなわち、電子ビー
ムの照射によって容易に１ｖｒｍ径以下の貫通穴の形成
が可能であり、セラミック焼結体の素材としては穴が不
要となり、緻密な焼結体を得ることで、ダイスとしての
性能を大ｒｌｊに向上することが可能となったのである
。電子ビームによる穴あけののち、さらにダイヤモンド
砥石等による仕上げ加工例えば研削加工、ラッピング加
工が一般に必要であるが、下穴が存在するために、容易
であり、セラミックに欠陥を導入することは少ない。対
象とするセラミック材料は、Ｓｉ３Ｎ４ 、５ｉＡＩＯ
Ｎ 、 ＳｉＣ、Ｂ４Ｃ、ＡＩＮのいずれの材料も電子
ビーム加工が可能であることが判明しており、それぞれ
の材料特性（硬度、耐摩耗性、耐薬品性、耐酸化性等）
に応じ使いりけることが可能である。今まで述べてきた
様に、本発明は耐摩耗性に秀れたセラミック製ダイスを
製造するうえで、障害となっていた穴あけ加工を電子ビ
ーム照射によって行ない、特性の秀れたセラミック材料
製のダイスを製造する方法を提供するものであり、極め
て有用な発明である。電子ビームによるセラミックの穿
孔技術は、常圧焼結、加圧焼結にかかわらず、また密度
の高低にかかわらず有用な方法であり、各種セラミック
製ダイスを安価に供給可能ならしめたものである。以下
実施例により詳細に説明する。(C) H, Second Form of the Invention In view of the above-mentioned circumstances, the present inventors investigated various methods for making holes in ceramic dies, and found that they produced a sintered body without holes and narrowed down the beam diameter. It was discovered that high-density ceramic dies for small diameters can be manufactured by locally evaporating ceramic by irradiating it with an electron beam and drilling holes. In other words, through-holes with a diameter of 1 Vrm or less can be easily formed by electron beam irradiation, making holes unnecessary as a material for ceramic sintered bodies, and by obtaining a dense sintered body, the performance as a die can be improved. This made it possible to greatly improve rlj. After drilling with an electron beam, finishing processing using a diamond grindstone or the like, such as grinding or lapping, is generally required, but because of the presence of a pilot hole, it is easy and rarely introduces defects into the ceramic. The target ceramic materials are Si3N4, 5iAIO
It has been found that electron beam processing is possible for N, SiC, B4C, and AIN materials, and their respective material properties (hardness, wear resistance, chemical resistance, oxidation resistance, etc.)
It is possible to use it as needed. As mentioned above, the present invention uses electron beam irradiation to perform the drilling process, which has been an obstacle in manufacturing ceramic dies with excellent wear resistance. This invention provides a method for manufacturing dice, and is an extremely useful invention. Ceramic perforation technology using an electron beam is a useful method regardless of pressureless sintering or pressure sintering, and regardless of high or low density, and has made it possible to supply various ceramic dies at low cost. . This will be explained in detail below using examples.
実施例
第１図に示すダイスをＳｉ３Ｎ４で製作することを試み
たところ下穴の明いたホットプレス焼結体は得られない
ことが判明した。そのため、電子ビームによって０．８
０の下穴を加工したのち、通常のダイヤモンド砥石によ
って研削後ラップを施しダイスとした。得られたダイス
で銅線の伸線を行なったところ、５ケ月間の寿命を得た
。比較例として、下穴０．８ｚつきの常圧焼結窒化ケイ
素を製造し、同様にダイス加工し、使用に供したところ
、２ケ月の寿命であった。ホットプレス焼結体が常圧焼
結体に比し微粒、緻密なためと考えられる。Example When an attempt was made to manufacture the die shown in FIG. 1 from Si3N4, it was found that a hot-pressed sintered body with pilot holes could not be obtained. Therefore, 0.8
After drilling a pilot hole of 0, the sample was ground using a regular diamond grindstone and then lapped to form a die. When a copper wire was drawn using the obtained die, a service life of 5 months was obtained. As a comparative example, pressureless sintered silicon nitride with a pilot hole of 0.8z was produced, processed into dice in the same manner, and used, and the life was 2 months. This is thought to be because the hot press sintered body has finer grains and is denser than the pressureless sintered body.
このように本発明によれば、高性能なセラミックダイス
が容易に得られるのである。As described above, according to the present invention, a high-performance ceramic die can be easily obtained.
第１図はセラミック製ダイスの断面図を示す。 第１図 FIG. 1 shows a cross-sectional view of a ceramic die. Figure 1
Claims (1)
って穿孔することを特徴とするセラミック製ダイスの製
造方法。 Ｑ）セラミックがＳｉ３Ｎ４ 、５ｉ６−ｚＡ７ｚＯｚ
Ｎ８−ｚ 、 ＳｉＣ、Ｂ４ＣおよびＡｌＮから選ばれ
た１種以上を主成分とすることを特徴とする特許請求の
範囲第（１）項記載のセラミック製ダイスの製造方法。(1) A method for manufacturing a ceramic die, which comprises perforating a ceramic sintered body with no through holes using an electron beam. Q) Ceramic is Si3N4, 5i6-zA7zOz
The method for manufacturing a ceramic die according to claim 1, characterized in that the main component is one or more selected from N8-z, SiC, B4C, and AlN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10303183A JPS59227405A (en) | 1983-06-08 | 1983-06-08 | Manufacture of die made of ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10303183A JPS59227405A (en) | 1983-06-08 | 1983-06-08 | Manufacture of die made of ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59227405A true JPS59227405A (en) | 1984-12-20 |
| JPH0471686B2 JPH0471686B2 (en) | 1992-11-16 |
Family
ID=14343281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10303183A Granted JPS59227405A (en) | 1983-06-08 | 1983-06-08 | Manufacture of die made of ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59227405A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607490A (en) * | 2015-03-03 | 2015-05-13 | 株洲力洲硬质合金有限公司 | Processing process of micropore hard alloy wire-drawing mould |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51113298A (en) * | 1975-03-31 | 1976-10-06 | Toshiba Corp | Method of working polycrystal material in ion spattering operation |
-
1983
- 1983-06-08 JP JP10303183A patent/JPS59227405A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51113298A (en) * | 1975-03-31 | 1976-10-06 | Toshiba Corp | Method of working polycrystal material in ion spattering operation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607490A (en) * | 2015-03-03 | 2015-05-13 | 株洲力洲硬质合金有限公司 | Processing process of micropore hard alloy wire-drawing mould |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0471686B2 (en) | 1992-11-16 |
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