JPS592170U - 発光ダイオ−ド基板 - Google Patents

発光ダイオ−ド基板

Info

Publication number
JPS592170U
JPS592170U JP9760882U JP9760882U JPS592170U JP S592170 U JPS592170 U JP S592170U JP 9760882 U JP9760882 U JP 9760882U JP 9760882 U JP9760882 U JP 9760882U JP S592170 U JPS592170 U JP S592170U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
base
diode board
printed pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9760882U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322692Y2 (enrdf_load_stackoverflow
Inventor
平林　洋子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP9760882U priority Critical patent/JPS592170U/ja
Publication of JPS592170U publication Critical patent/JPS592170U/ja
Application granted granted Critical
Publication of JPS6322692Y2 publication Critical patent/JPS6322692Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP9760882U 1982-06-28 1982-06-28 発光ダイオ−ド基板 Granted JPS592170U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9760882U JPS592170U (ja) 1982-06-28 1982-06-28 発光ダイオ−ド基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9760882U JPS592170U (ja) 1982-06-28 1982-06-28 発光ダイオ−ド基板

Publications (2)

Publication Number Publication Date
JPS592170U true JPS592170U (ja) 1984-01-09
JPS6322692Y2 JPS6322692Y2 (enrdf_load_stackoverflow) 1988-06-22

Family

ID=30232099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9760882U Granted JPS592170U (ja) 1982-06-28 1982-06-28 発光ダイオ−ド基板

Country Status (1)

Country Link
JP (1) JPS592170U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222011A (ja) * 2011-04-05 2012-11-12 Panasonic Corp Ｌｅｄ発光モジュール及びそれを用いた照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222011A (ja) * 2011-04-05 2012-11-12 Panasonic Corp Ｌｅｄ発光モジュール及びそれを用いた照明装置

Also Published As

Publication number Publication date
JPS6322692Y2 (enrdf_load_stackoverflow) 1988-06-22

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