JPS592145U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS592145U
JPS592145U JP5999583U JP5999583U JPS592145U JP S592145 U JPS592145 U JP S592145U JP 5999583 U JP5999583 U JP 5999583U JP 5999583 U JP5999583 U JP 5999583U JP S592145 U JPS592145 U JP S592145U
Authority
JP
Japan
Prior art keywords
semiconductor element
lid member
housing container
semiconductor
semiconductor equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5999583U
Other languages
Japanese (ja)
Other versions
JPS615808Y2 (en
Inventor
薗 陸郎
赤崎 英彦
哲史 若林
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP5999583U priority Critical patent/JPS592145U/en
Publication of JPS592145U publication Critical patent/JPS592145U/en
Application granted granted Critical
Publication of JPS615808Y2 publication Critical patent/JPS615808Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第4図はそれぞれ本考案による半導体装置の
概略構造を示す図である。 1;半導体素子収容容器本体、2;半導体素子、3;外
部接続端子、4;壁部材、5;ボンディングワイヤ、6
;蓋部材、8;封止材、?、  9. 10;凸部、1
1;内部配線。 ”  7 f  f 7 ti   s  グ ゲ
1 to 4 are diagrams each showing a schematic structure of a semiconductor device according to the present invention. 1; Semiconductor element storage container main body, 2; Semiconductor element, 3; External connection terminal, 4; Wall member, 5; Bonding wire, 6
; Lid member, 8; Sealing material, ? , 9. 10; Convex portion, 1
1; Internal wiring. ” 7 f f 7 ti s gu ge

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子と該半導体素子の収容容器と、封止剤により
該収容容器に接着されて、該半導体素子を該収容容器内
に気密封止する蓋部材とを備えた半導体装置において、
該蓋部材と該収容容器との封止部内側の該蓋部材に、該
半導体素子を該封止剤から放射される放射線から遮へい
する方向に突出した放射線遮へい用の凸部を設けたこと
を特徴とする半導体装置。
A semiconductor device comprising a semiconductor element, a housing container for the semiconductor element, and a lid member that is adhered to the housing container with a sealant to hermetically seal the semiconductor element in the housing container,
A radiation shielding convex portion is provided on the lid member inside the sealing portion between the lid member and the storage container, and protrudes in a direction to shield the semiconductor element from radiation emitted from the encapsulant. Characteristic semiconductor devices.
JP5999583U 1983-04-21 1983-04-21 semiconductor equipment Granted JPS592145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5999583U JPS592145U (en) 1983-04-21 1983-04-21 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5999583U JPS592145U (en) 1983-04-21 1983-04-21 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS592145U true JPS592145U (en) 1984-01-09
JPS615808Y2 JPS615808Y2 (en) 1986-02-21

Family

ID=30190240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5999583U Granted JPS592145U (en) 1983-04-21 1983-04-21 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS592145U (en)

Also Published As

Publication number Publication date
JPS615808Y2 (en) 1986-02-21

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