JPS592145U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS592145U JPS592145U JP5999583U JP5999583U JPS592145U JP S592145 U JPS592145 U JP S592145U JP 5999583 U JP5999583 U JP 5999583U JP 5999583 U JP5999583 U JP 5999583U JP S592145 U JPS592145 U JP S592145U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lid member
- housing container
- semiconductor
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図乃至第4図はそれぞれ本考案による半導体装置の
概略構造を示す図である。
1;半導体素子収容容器本体、2;半導体素子、3;外
部接続端子、4;壁部材、5;ボンディングワイヤ、6
;蓋部材、8;封止材、?、 9. 10;凸部、1
1;内部配線。
” 7 f f 7
ti s グ ゲ1 to 4 are diagrams each showing a schematic structure of a semiconductor device according to the present invention. 1; Semiconductor element storage container main body, 2; Semiconductor element, 3; External connection terminal, 4; Wall member, 5; Bonding wire, 6
; Lid member, 8; Sealing material, ? , 9. 10; Convex portion, 1
1; Internal wiring. ” 7 f f 7 ti s gu ge
Claims (1)
該収容容器に接着されて、該半導体素子を該収容容器内
に気密封止する蓋部材とを備えた半導体装置において、
該蓋部材と該収容容器との封止部内側の該蓋部材に、該
半導体素子を該封止剤から放射される放射線から遮へい
する方向に突出した放射線遮へい用の凸部を設けたこと
を特徴とする半導体装置。A semiconductor device comprising a semiconductor element, a housing container for the semiconductor element, and a lid member that is adhered to the housing container with a sealant to hermetically seal the semiconductor element in the housing container,
A radiation shielding convex portion is provided on the lid member inside the sealing portion between the lid member and the storage container, and protrudes in a direction to shield the semiconductor element from radiation emitted from the encapsulant. Characteristic semiconductor devices.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5999583U JPS592145U (en) | 1983-04-21 | 1983-04-21 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5999583U JPS592145U (en) | 1983-04-21 | 1983-04-21 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS592145U true JPS592145U (en) | 1984-01-09 |
JPS615808Y2 JPS615808Y2 (en) | 1986-02-21 |
Family
ID=30190240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5999583U Granted JPS592145U (en) | 1983-04-21 | 1983-04-21 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS592145U (en) |
-
1983
- 1983-04-21 JP JP5999583U patent/JPS592145U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS615808Y2 (en) | 1986-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS592145U (en) | semiconductor equipment | |
JPS58166040U (en) | semiconductor equipment | |
JPS5942043U (en) | Resin-encapsulated semiconductor device | |
JPS5827938U (en) | semiconductor equipment | |
JPS6049644U (en) | semiconductor equipment | |
JPS6013893U (en) | waterproof door | |
JPS5897925U (en) | Airtight seal device for electric wire and cable penetrations | |
JPS60109330U (en) | Resin-encapsulated semiconductor device | |
JPS5819523U (en) | Airtight package for circuit elements | |
JPS58109751U (en) | powder container | |
JPS58140641U (en) | Glass-sealed semiconductor package | |
JPS5987182U (en) | Shock-resistant mounting structure for electronic equipment | |
JPS5851447U (en) | semiconductor package | |
JPS606232U (en) | Resin packaging for semiconductor devices | |
JPS58147191U (en) | Sealing plug structure for display devices | |
JPS59109149U (en) | Package for semiconductors | |
JPS5923744U (en) | Sealing structure of hybrid integrated circuit | |
JPS5837156U (en) | semiconductor equipment | |
JPS6020145U (en) | semiconductor equipment | |
JPS605134U (en) | Glass sealed semiconductor device | |
JPS58166039U (en) | semiconductor equipment | |
JPS58177948U (en) | Resin-encapsulated semiconductor device | |
JPS5856445U (en) | Protection structure for semiconductor elements | |
JPS58103149U (en) | semiconductor equipment | |
JPS58131632U (en) | semiconductor equipment |