JPS5921200B2 - Parts simultaneous arrangement supply device - Google Patents

Parts simultaneous arrangement supply device

Info

Publication number
JPS5921200B2
JPS5921200B2 JP53131122A JP13112278A JPS5921200B2 JP S5921200 B2 JPS5921200 B2 JP S5921200B2 JP 53131122 A JP53131122 A JP 53131122A JP 13112278 A JP13112278 A JP 13112278A JP S5921200 B2 JPS5921200 B2 JP S5921200B2
Authority
JP
Japan
Prior art keywords
parts
segment
supply
component
supply device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53131122A
Other languages
Japanese (ja)
Other versions
JPS5558600A (en
Inventor
清治 隈井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP53131122A priority Critical patent/JPS5921200B2/en
Publication of JPS5558600A publication Critical patent/JPS5558600A/en
Publication of JPS5921200B2 publication Critical patent/JPS5921200B2/en
Expired legal-status Critical Current

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  • Feeding Of Articles To Conveyors (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 この発明は多品種多数の被実装物を実装面に対応する所
定の位置関係に配列して同時に供給する部品同時配列供
給装置に関するもので、作業性を向上せしめると共に装
置を簡略化せしめることを目的とする。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a component simultaneous arranging and supplying device for simultaneously supplying a large number of various types of objects to be mounted in a predetermined positional relationship corresponding to a mounting surface. The purpose is to simplify.

例えば一個の基板上にトランジスタやコンデンサ等の多
品種多数の電子部品を装着した混成集積回路(ハイブリ
ットIC)に於いては、基板上に形成されたパターンに
沿つて各部品を所定の位置へ配列する必要があるが、多
品種の部品を連続して供給することから個々の部品供給
台が必要で個個の部品の供給位置が異なり、また基板上
での部品の装着位置も異なるので、従来は第1図に示す
様に複数個の部品供給台a、b、c・・・・・・nを同
一個所に集めて設置し、これの前面に装着すべき基板A
を固定し、先ず部品供給台aより取出した部品a’をx
、y方向に夫々所定量移動させて基板Aの所定位置に持
つて行き、装着させ、続いて部品供給台bより取出した
部品b生x、y方向に移動させ、基板Aの所定位置に装
着し、この様にして順次各部品供給台c、d・・・・・
・ nより取出された部品c’、d’・・・・・・n’
を基板Aへ装着していた。
For example, in a hybrid integrated circuit (hybrid IC) in which a large number of electronic components of various types such as transistors and capacitors are mounted on a single substrate, each component is arranged in a predetermined position along a pattern formed on the substrate. However, since a wide variety of parts are continuously supplied, individual component supply tables are required, and the supply positions of individual parts are different, and the mounting positions of parts on the board are also different, so As shown in Fig. 1, a plurality of component supply stands a, b, c...n are gathered and installed in the same place, and the board A to be mounted on the front of this is installed.
is fixed, and the part a' taken out from the parts supply stand a is x
, y-direction by a predetermined amount, bring it to a predetermined position on board A, and mount it. Then, part b taken out from component supply table b is moved in the x and y directions, and is mounted at a predetermined position on board A. In this way, each component supply table c, d...
・ Parts c', d'...n' taken out from n'
was attached to board A.

又、他の法として各部品供給台a、b、c・・・・・・
nより取出される部品a’、b’、Cl−・・・・・
n’を一定のストロークで前方へ送出し、これに対応
させて基板Aをx、y方向に所定量移動させ、部品が基
板Aの所定位置に来る様になして装着する方法があつた
。何れの場合にも基板A上へ部品を一個宛供給していた
ので作業性が非常に悪かつた。又、各部品供給台a、b
、c・・・・・・nより取出される部品a’、b’、c
’・・・・・・ n城は基板Aをx、y方向に任意量移
動可能に構成せねばならず、装置が複雑となり、能力も
低かつた。この発明は上記従来の欠点に鑑み、これを改
良除去したもので、複数の被実装物をセグメント台を介
して所定位置関係を保つて実装面に供給するようにした
部品同時配列供給装置において、前記セグメント台は被
実装物供給側で前記複数の被実装物をそれぞれ供給する
被実装物供給装置に対応するように分離され、且つ実装
側で前記所定の位置関係を保つように集合される複数の
部分に分割したものであつて、以下この発明の構成を図
面に示す実施例に従つて説明すると次の通りである。
In addition, as another method, each parts supply table a, b, c...
Parts a', b', Cl-... taken out from n
There is a method of sending the component n' forward with a constant stroke and correspondingly moving the board A by a predetermined amount in the x and y directions so that the component is placed at a predetermined position on the board A. In either case, the parts were supplied onto the board A one by one, resulting in very poor work efficiency. In addition, each parts supply stand a, b
, c... Parts a', b', c taken out from n
'...N Castle had to be configured to be able to move the substrate A by an arbitrary amount in the x and y directions, making the device complex and having low performance. In view of the above-mentioned conventional drawbacks, the present invention has been made to improve and eliminate them, and provides a component simultaneous arrangement and supply device that supplies a plurality of objects to be mounted onto a mounting surface via a segment table while maintaining a predetermined positional relationship. The segment table is separated on the mounting object supply side so as to correspond to the mounting object supply device that supplies the plurality of mounting objects, respectively, and is assembled on the mounting side so as to maintain the predetermined positional relationship. The structure of the present invention will be described below with reference to the embodiments shown in the drawings.

第2図及び第3図に於いて、1、2、3、4|5、6は
被実装物供給装置である部品供給台で、例えば直進フィ
ーダ等により構成し、基板(被実装面)A上へ供給すべ
き部品(被実装物)?、8・・・・・・12を夫々個別
に連続的に搬送して来る。13、14・・・・・・18
は基板A上に配列される部品の配置位置に対応してセグ
メント区分され、分離・集合可能に構成されたセグメン
ト台で、図面では格子状に区分され、ガイド19に沿つ
て移動する。
In FIGS. 2 and 3, 1, 2, 3, 4 | 5, 6 are component supply stands which are mounted object supply devices, and are configured with, for example, a linear feeder. Which parts (mounted objects) should be supplied to the top? , 8...12 are individually and continuously conveyed. 13, 14...18
1 is a segment stand that is divided into segments corresponding to the arrangement positions of components arranged on the substrate A, and configured to be separable and assembled; in the drawing, it is divided into a lattice shape and moves along a guide 19.

各セグメント台13,14・・・・・・18には第4図
にも示す様に同一高さに設定された移動桿20,21・
・・・・・25を有し、これの後端に夫々突設した突起
26とセグメント台13,14・・・・・・18と間に
介在させ,且つガイド19上を摺動自在に配されたスラ
イド27の前後動にて各セグメント台13,14・・・
・・・18は集合或は分離する。即ち、スライド27が
駆動シリンダ28のピストンロツド28aの伸長動作に
伴つて前進すると、これに最も近いセグメント台18か
ら最も遠いセグメント台13に至るまで順次スライド2
7の前端面27aに当接し、スライド27の前進端で一
点鎖線で示す様に集合整列され基板Aと同様の配置関係
を得る。逆にピストンロツド28aが退入し、スライド
27が後退すると、これの後端面に各移動桿20,21
・・・・・・25に突設した突起26が当接し、スライ
ド27の後退端で各移動桿20,21・・・・・・25
の後端が揃えられ、各移動桿20,21・・・・・・2
5の長さの違いにより各セグメント台13,14・・・
・・・18DS実線で示す様に分離される・前記各移動
桿20,21・・・・・・25の長さはセグメント台1
3,14・・・・・・18の分離時に各セグメント台が
夫々対応する部品供給台1,2・・・・・・6の前方に
位置する長さに設定される。即ち、図示の場合では部品
供給台1の前方にはセグメント台13、部品供給台2の
前方にはセグメント台14、・・・・・・、部品供給台
5の前方にはセグメント台17、部品供給台18の前方
にはセグメント台18が夫夫位置する様に設定し,この
被実装物供給側で各部品供給台1,2・・・・・・6か
ら各セグメント台13,14・・・・・・18への部品
の受け渡しを一方向(直交方向)への往復動で行なう。
又、長手方向に隣り 5合うセグメント台13,16、
14,17、及び15,18は夫々同一軌跡上を移動す
るか、直交方向に隣り合うセグメント台13,14,1
5及び16,17,18は軌跡が異なり、各部品供給台
1,2・・・・・・6からの距離が異なるので、各部品
供給台1,2・・・・・・6の部品取出し位置を夫々対
応する各セグメント台13,14・・・・・・18との
距離が全て同一となる様にストツパ一等で設定すれば同
時に部品7,8・・・・・・12を谷セグメント台13
,14・・・・・・18上へ供給できる。尚,基板A上
のセグメントを区分線で左右に分割し、対応するセグメ
ント台を区分線0で左右に分割し部品供給台及びセグメ
ント台13/,14′・゛゜・・・18′を設けて、両
側から部品を供給し、中心線0に集合させる。
As shown in FIG.
. . 25, interposed between the protrusions 26 protruding from the rear ends thereof and the segment bases 13, 14, . . . 18, and slidably disposed on the guide 19. By the back and forth movement of the slide 27, each segment stand 13, 14...
...18 is set or separated. That is, as the slide 27 moves forward with the extension of the piston rod 28a of the drive cylinder 28, the slide 2 moves sequentially from the segment base 18 closest to it to the segment base 13 farthest from it.
7, and are assembled and aligned as shown by the dashed line at the forward end of the slide 27 to obtain the same arrangement as the substrate A. Conversely, when the piston rod 28a retreats and the slide 27 retreats, each moving rod 20, 21 is attached to the rear end surface of the slide 27.
The protrusion 26 protruding from the slide 27 comes into contact with each moving rod 20, 21...25 at the retreating end of the slide 27.
The rear ends of each moving rod 20, 21...2 are aligned.
Each segment stand 13, 14... due to the difference in length of 5.
...18DS is separated as shown by the solid line.The length of each of the moving rods 20, 21...25 is the segment base 1.
When parts 3, 14, . That is, in the illustrated case, a segment table 13 is placed in front of the component supply table 1, a segment table 14 is placed in front of the component supply table 2, and a segment table 17 is placed in front of the component supply table 5. A segment stand 18 is set to be positioned in front of the supply stand 18, and on this mounting object supply side, each segment stand 13, 14, . . . ...The delivery of parts to 18 is performed by reciprocating motion in one direction (orthogonal direction).
In addition, five matching segment stands 13, 16 adjacent in the longitudinal direction,
14, 17, and 15, 18 move on the same locus, respectively, or segment stands 13, 14, 1 adjacent in the orthogonal direction.
5, 16, 17, and 18 have different trajectories and different distances from each component supply table 1, 2, . If the positions of the parts 7, 8, . . . 12 are set using the first stopper so that the distances from the corresponding segment stands 13, 14, . . . 18 are all the same, the parts 7, 8, . Platform 13
, 14...18. In addition, the segments on board A are divided into left and right by the dividing line, and the corresponding segment tables are divided into left and right by dividing line 0, and component supply tables and segment tables 13/, 14', ゛゜...18' are provided. , parts are fed from both sides and collected at center line 0.

この様にすれば狭いスペースでより多くの部品を供給で
きる。29はガイド19に平行に設けられ基板Aをスト
ツク部から順次連続して搬送する搬送ラインで例えば搬
送ライン29の部品供給位置に基板Aを吸着する吸着孔
30を形成し、その側方に基板Aを搬送ライン29に押
付けて位置決めするプツシヤ一31を設け、これらによ
り基板Aを実装側に対応する位置に位置決めしている。
In this way, more parts can be supplied in a narrow space. Reference numeral 29 is a transfer line that is provided parallel to the guide 19 and sequentially transfers the substrates A from the stock section.For example, a suction hole 30 for sucking the substrate A is formed at the component supply position of the transfer line 29, and the substrate A is placed on the side thereof. A pusher 31 is provided for positioning the substrate A by pressing it against the transport line 29, and these pushers 31 position the substrate A at a position corresponding to the mounting side.

このようにして位置決めされた基板A上に実装側で集合
したセグメント台13,14・・・・・・18及び13
′,14t・・・・・18′上の部品をその位置関係を
変えずに移送手段33により移送供給する。またセグメ
ント台に真空吸着孔を設け吸着固定することにより移動
中の部品の位置ずれを防止できる。移送手段33は例え
ば第5図に示す様にサクシヨンカツプ34の下面にスポ
ンジの如き、通気件を有し、且つ各部材の高さの違いを
吸収し得る軟弾性を有する保持材35を取付け、サクシ
ヨンカツプ34をパイプ36により負圧源に接続してあ
り、保持材35を配列された部品上に被せ、負圧源を作
動させてサクシヨンカツプ34内を負圧にし、保持材3
5を介して部品を吸着保持し,この状態で基板A上へ移
送し、サクシヨンカツプ34内の負圧を解除し、部品を
供給する。保持材35は部品形状に合せて凸凹を設けて
もよい。上記構成に於いて、作用を説明すると、駆動シ
リンダ28のピストンロツド28aを退入させ、スライ
ド27を後退させて被実装物供給側で各セグメント台1
3,14・・・・・・18を分離させる。
Segment stands 13, 14...18 and 13 assembled on the mounting side on the board A positioned in this way
', 14t...18' are transferred and supplied by the transfer means 33 without changing their positional relationship. Further, by providing a vacuum suction hole in the segment stand and suctioning and fixing the segment, it is possible to prevent the positional displacement of the moving parts. For example, as shown in FIG. 5, the transfer means 33 has a holding material 35 such as a sponge attached to the lower surface of the suction cup 34, which has air permeability and soft elasticity capable of absorbing differences in height of each member. 34 is connected to a negative pressure source through a pipe 36, a holding material 35 is placed over the arranged parts, the negative pressure source is activated to create a negative pressure inside the suction cup 34, and the holding material 3
The parts are sucked and held through the suction cups 5, and in this state are transferred onto the substrate A, the negative pressure inside the suction cup 34 is released, and the parts are supplied. The holding material 35 may be provided with unevenness according to the shape of the component. In the above configuration, the operation will be described. The piston rod 28a of the drive cylinder 28 is retracted, the slide 27 is retracted, and each segment table 1 is placed on the mounting object supply side.
3, 14...18 are separated.

そして各部品供給台1,2・・・・・・6より部品7,
8・・・・・・12を取出し、夫々対応する谷セグメン
ト台13,14・・・・・・18上に載せる。各セグメ
ント台13,14・・・・・・18上に部品7,8・・
・・・・12が載せられるとピストンロツド28aを伸
長させてスライド27を前進させ、各セグメント台13
,14・・・・・・18を実装側で集合整列させる。同
様に反対側の各セグメント台13′,14t・・・・・
18′にも夫々所定の部品7′,8′・・・・・・12
′を載せ集合整列させる。この様に各セグメント台13
,14・・・・・・18及び13′,14t・・・・・
18′が整列され各部品が所定の位置関係に配列される
と移送手段33を炸動させ、これの保持材を各部品7,
8・・・・・・12及び7′,8/・・・・・・12/
上に被せ、サクシヨンカツプ34内に負圧を発生させて
各部品7,8・・・・・・12及び7′,8t・・・・
・12′をその位置関係を保つた状態で吸着保持し、こ
れを搬送ライン29上の部品供給位置に吸着孔30の吸
着力並びにプツシヤ一31により位置決めされた基板A
上へ移送し、各部品7,8・・・・・・12及び7′,
8t・・・・・12′を基板A上へ載せ、サクシヨンカ
ツプ34の負圧を解除して供給する。尚、基板Aの表面
にはその搬送途中に接着剤を塗布しておき、供給された
部品7,8・・・・・・12及び7′,8t・・・・・
12′が移送手段33の復帰時に保持材35に付着して
基板Aから離れるのを防止する。こうして基板Aに各部
品が供給されると、吸着孔30の吸着力を除去し、プッ
シャ一31を復帰させて基板Aをフリーとなし、次に搬
送されて来る基板Aにて送出す。上記動作を繰返して連
続的に基板A上へ各部品を供給する。尚.セグメント台
13,14・・・・・・18の形状は前記した格子状に
限定されるものではなく、部品の配置関係に対応して適
宜選定すればよく,任意の形状を取り得るものである。
又,スライド27もこれに限定されるものではなく、各
セグメント台13,14・・・・・・18の一部に突起
を設けてこれを係合させる様にしてもよい。以上説明し
た様にこの発明は複数の被実装物をセグメント台を介し
て所定位置関係を保つて実装面に供給するようにした部
品同時配列供給装置において,前記セグメント台は被実
装物供給側で前記複数の被実装物をそれぞれ供給する被
実装物供給装置に対応するよう′こ分離され、且つ実装
側で前記所定の位置関係を保つように集合される複数の
部分に分離したから、分離したセグメント台上に夫々部
品を載せ、これを集合させれば各部品を所定の位置関係
に配列でき,更に配列された部品を全て同時に実装面へ
供給でき、作業性が大幅に向上する。
Then, from each parts supply table 1, 2...6, parts 7,
8...12 are taken out and placed on the corresponding valley segment stands 13, 14...18, respectively. Parts 7, 8... on each segment stand 13, 14...18
... 12 is placed, the piston rod 28a is extended to advance the slide 27, and each segment table 13 is moved forward.
, 14 . . . 18 are set and arranged on the implementation side. Similarly, each segment stand 13', 14t on the opposite side...
18' also have predetermined parts 7', 8'...12
′ and arrange the set. Each segment stand 13 like this
, 14...18 and 13', 14t...
18' are aligned and each part is arranged in a predetermined positional relationship, the transfer means 33 is activated, and the holding material is transferred to each part 7,
8...12 and 7', 8/...12/
12 and 7', 8t... by generating negative pressure in the suction cup 34.
12' is held by suction while maintaining its positional relationship, and the board A is positioned at the component supply position on the conveyance line 29 by the suction force of the suction hole 30 and the pusher 31.
Transfer each part 7, 8...12 and 7',
8t...12' is placed on the substrate A, and the negative pressure of the suction cup 34 is released and supplied. Note that adhesive is applied to the surface of the board A during its transportation, and the supplied parts 7, 8...12 and 7', 8t...
12' adheres to the holding material 35 when the transfer means 33 returns and prevents it from separating from the substrate A. When each component is supplied to the board A in this manner, the suction force of the suction hole 30 is removed, the pusher 31 is returned, the board A is made free, and the next board A is sent out. Each component is continuously supplied onto the substrate A by repeating the above operation. still. The shape of the segment stands 13, 14...18 is not limited to the above-mentioned lattice shape, but may be appropriately selected depending on the arrangement of the parts, and can take any shape. .
Furthermore, the slide 27 is not limited to this, and a projection may be provided on a part of each segment base 13, 14, . . . , 18 and engaged with the projection. As explained above, the present invention provides a component simultaneous arrangement and supply device in which a plurality of objects to be mounted are supplied to a mounting surface via a segment stand while maintaining a predetermined positional relationship, in which the segment stand is on the object supply side. Since it is separated into a plurality of parts that are separated so as to correspond to the mounting object supply devices that supply the plurality of objects to be mounted, respectively, and assembled so as to maintain the predetermined positional relationship on the mounting side, the separated parts are separated. By placing each component on a segment stand and assembling them, each component can be arranged in a predetermined positional relationship, and furthermore, all the arranged components can be simultaneously supplied to the mounting surface, greatly improving work efficiency.

又,部品の移動方向が一定となり動作が簡略化される。
更に構造が簡単で装置全体が小型となる。
Furthermore, the movement direction of the parts is constant, which simplifies the operation.
Furthermore, the structure is simple and the entire device is small.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の供給方式を示す概略図、第2図は本発明
に係かる部品同時配列供給装置を示す平面図、第3図は
その断面図.第4図は本発明に係かるセグメント台及び
その移動桿を示す斜視図、第5図は本発明に係かる移送
手段を示す断面図である。 1,2・・・・・・6・・・・・・被実装物供給装置(
部品供給台),13,14・・・・・・18・・・・・
・セグメント台、A・・・・・・実装面(基板)。
FIG. 1 is a schematic diagram showing a conventional supply system, FIG. 2 is a plan view showing a simultaneous component arrangement and supply device according to the present invention, and FIG. 3 is a sectional view thereof. FIG. 4 is a perspective view showing a segment table and its moving rod according to the present invention, and FIG. 5 is a sectional view showing a transfer means according to the present invention. 1, 2...6... Mounted object supply device (
parts supply table), 13, 14...18...
・Segment stand, A... Mounting surface (board).

Claims (1)

【特許請求の範囲】[Claims] 1 複数の被実装物をセグメント台を介して所定位置関
係を保つて実装面に供給するようにした部品同時配列供
給装置において、前記セグメント台は被実装物供給側で
前記複数の被実装物をそれぞれ供給する被実装物供給装
置に対応するように分離され、且つ実装側で前記所定の
位置関係を保つように集合される複数の部分に分割され
ていることを特徴とする部品同時配列供給装置。
1. In a component simultaneous arrangement and supply device that supplies a plurality of objects to be mounted onto a mounting surface via a segment stand while maintaining a predetermined positional relationship, the segment stand supplies the plurality of objects to be mounted on the object supply side. A component simultaneous arrangement supply device characterized in that it is divided into a plurality of parts that are separated so as to correspond to the respective supply devices for mounting objects and are assembled so as to maintain the predetermined positional relationship on the mounting side. .
JP53131122A 1978-10-24 1978-10-24 Parts simultaneous arrangement supply device Expired JPS5921200B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53131122A JPS5921200B2 (en) 1978-10-24 1978-10-24 Parts simultaneous arrangement supply device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53131122A JPS5921200B2 (en) 1978-10-24 1978-10-24 Parts simultaneous arrangement supply device

Publications (2)

Publication Number Publication Date
JPS5558600A JPS5558600A (en) 1980-05-01
JPS5921200B2 true JPS5921200B2 (en) 1984-05-18

Family

ID=15050492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53131122A Expired JPS5921200B2 (en) 1978-10-24 1978-10-24 Parts simultaneous arrangement supply device

Country Status (1)

Country Link
JP (1) JPS5921200B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8201653A (en) * 1982-04-21 1983-11-16 Philips Nv METHOD AND APPARATUS FOR PLACING CHIP-SHAPED ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A SUBSTRATE

Also Published As

Publication number Publication date
JPS5558600A (en) 1980-05-01

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